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HITTITE[Hittite Microwave Corporation]
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| Part No. |
HMC282
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| OCR Text |
...nd can be die mounted with AuSn eutectic preforms or with electrically conductive epoxy. The mounting surface should be clean and flat. eutectic Die Attach: A 80/20 gold tin preform is recommended with a work surface temperature of 255 deg.... |
| Description |
GaAs MMIC LOW NOISE AMPLIFIER 36 - 40 GHz
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| File Size |
108.21K /
6 Page |
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http://
VISAY[Vishay Siliconix]
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| Part No. |
SI8401DB SI8401DB-T SI8401DB-T1-E3 SI8401DB-T1
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| OCR Text |
...ed with a thin metal. Bumps are eutectic solder 63/57 Sn/Pb. (Sn 3.8 Ag, 0.7 Cu for Pb-free bumps) Non-solder mask defined copper landing pad. The flat side of wafers is oriented at the bottom.
MILLIMETERS* Dim A A1 A2 b D E e S Min
0.6... |
| Description |
P-Channel 20-V (D-S) MOSFET
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| File Size |
80.46K /
5 Page |
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it Online |
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Agilent (Hewlett-Packard)
HP[Agilent(Hewlett-Packard)]
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| Part No. |
MSA-0500 MSA-0500-G MSA-0500-GP4
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| OCR Text |
...nded assembly procedure is gold-eutectic die attach at 400C and either wedge or ball bonding using 0.7 mil gold wire. This chip is intended to be used with an external blocking capacitor completing the shunt feedback path (closed loop). Dat... |
| Description |
Cascadable Silicon Bipolar MMIC Amplifier
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| File Size |
59.51K /
4 Page |
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it Online |
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GENNUM[Gennum Corporation]
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| Part No. |
GO1525 GS9060 GS9062 GS1532 GS1560
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| OCR Text |
...s compatible with both standard eutectic and Pb-free solder reflow profiles. The recommended standard eutectic reflow profile is shown in Figure 3-1. The maximum recommended Pb-free reflow profile is shown in Figure 3-2.
Temperature 60-150... |
| Description |
HD-LINX II Voltage Controlled Oscillator
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| File Size |
150.83K /
9 Page |
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it Online |
Download Datasheet |
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Price and Availability
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