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Amphenol Communications Solutions |
| Part No. |
95278-101B26LF
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| Description |
BergStik®, Board to Board connector, Unshrouded Header, SMT, Double Row, 26 Positions, 2.54 mm Pitch, Vertical, 5.84 mm (0.23 in.) Mating
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
95278-801B26LF
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| Description |
BergStik®, Board to Board connector, Unshrouded Header, SMT, Double Row, 26 Positions, 2.54 mm Pitch, Vertical, 5.84 mm (0.23 in.) Mating
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
95278-501B26LF
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| Description |
BergStik®, Board to Board connector, Unshrouded Header, SMT, Double Row, 26 Positions, 2.54 mm Pitch, Vertical, 5.84 mm (0.23 in.) Mating
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
10072354-S01B26ULF
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| Description |
Minitek® 2.00mm, Board to Board, Shrouded Header - Through Mount Pin-in-Paste - Double row - 26 Positions - 2mm (0.079in) - Right Angle.
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
95278-401B26LF
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| Description |
BergStik®, Board to Board connector, Unshrouded vertical header, Surface Mount, Double Row, 26 Positions, 2.54mm (0.100in) Pitch.
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Official Product Page
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ST Microelectronics STMicroelectronics
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| Part No. |
STD4N52K3 STF4N52K3 STP4N52K3 STU4N52K3
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| Description |
N-channel 525 V, 2.5 A, 2.1 Ohm typ., SuperMESH3(TM) Power MOSFET in IPAK package N-channel 525 V, 2.5 A, 2.1typ., SuperMESH3 Power MOSFET in DPAK, TO-220FP, TO-220 and IPAK packages N-channel 525 V, 2.5 A, 2.1 Ω typ., SuperMESH3 Power MOSFET in DPAK, TO-220FP, TO-220 and IPAK packages
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| File Size |
1,093.72K /
21 Page |
View
it Online |
Download Datasheet
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Price and Availability
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