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| Part No. |
405347402
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| OCR Text |
...lectr olytic, wr ought copper constr uction n cor r osion-r esistant, electr o-tin plating n high-compr ession ter mination design n accurate color coding scheme n economical, standar d length bar r el n single or dual mounting ... |
| Description |
COPPER ALLOY, TIN FINISH, WIRE TERMINAL
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| File Size |
309.53K /
8 Page |
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it Online |
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M/A-COM Technology Solu...
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| Part No. |
XP1050-QJ-15
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| OCR Text |
...lable and the power dissipation constr aints, the bias circuit may be a single transistor or a low-power operational amplifier, with a low value resistor in se ries with the drain supply used to sense the current. app note [2] pw... |
| Description |
2.5 W Power Amplifier
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| File Size |
188.43K /
7 Page |
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it Online |
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Union Semiconductor, In...
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| Part No. |
UM5204EECD
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| OCR Text |
...ssion lines. the low inductance constr uction minimizes voltage overshoot during high current surges. this device is optimized for esd protection of portable electronics. they may be used to meet the esd immunity requirements of iec 6100... |
| Description |
Quad Channel Low Capacitance ESD Protection Array
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| File Size |
190.07K /
6 Page |
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it Online |
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Union Semiconductor, In...
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| Part No. |
UM5204EECE
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| OCR Text |
...ssion lines. the low inductance constr uction minimizes voltage overshoot during high current surges. this device is optimized for esd protection of portable electronics. they may be used to meet the esd immunity requirements of iec 6100... |
| Description |
Quad Channel Low Capacitance ESD Protection Array
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| File Size |
178.50K /
6 Page |
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it Online |
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Elite Semiconductor
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| Part No. |
AD82586C-QG24NAT
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| OCR Text |
...nvironment test board, which is constr ucted with a thermally efficient, 4-layers pcb (2s2p). the simulation is tested using t he jesd51-5 thermal me asurement standard. note 1.3: jt represents the thermal parameter for the heat flow ... |
| Description |
2x20W Stereo Digital Audio Amplifier
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| File Size |
158.50K /
3 Page |
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it Online |
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