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  ACK-2182 Datasheet PDF File

For ACK-2182 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | <8> | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

    FLATPACK

Amkor Technology
Part No. FLATPACK
Description Ceramic Flat Pack Package

File Size 486.00K  /  1 Page

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Amphenol Communications Solutions

Part No. 70218-265LF
Description Metral® Board Connectors, Backplane Connectors, Signal Header, Vertical, Press Fit, 4 Rows, 24 Positions.
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    RACK1122

Emcore Corporation
Part No. RACK1122
Description Integrated Microwave Transceiver

File Size 265.49K  /  2 Page

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Amphenol Communications Solutions

Part No. 61082-182409LF
Description BergStak® 0.80mm Pitch, Receptacle, Vertical, Double Row, 180 Positions.
Tech specs    

Official Product Page

    OPR3201 OPR-3201-BLACK

List of Unclassifed Manufacturers
Part No. OPR3201 OPR-3201-BLACK
Description Barcode laser scanner

File Size 802.13K  /  2 Page

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Amphenol Communications Solutions

Part No. 131-7218-21D
Description Paladin® 112Gb/s Backplane Connector, 7-Pair, 8 Column, Double End Wall, Backplane Module, 2.25mm Wipe, Nickel Sulfamate.
Tech specs    

Official Product Page

    J68.APACKAGE

Intersil Corporation
Part No. J68.APACKAGE
Description 68 PAD CERAMIC LEADLESS CHIP CARRIER PACKAGE

File Size 16.23K  /  1 Page

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Amphenol Communications Solutions

Part No. 131-6218-21H
Description Paladin® 112Gb/s Backplane Connector, 6-Pair, 8 Column, Double End Wall, Backplane Module, 2.25mm Wipe, APP.
Tech specs    

Official Product Page

    J68.BPACKAGE

Intersil Corporation
Part No. J68.BPACKAGE
Description 68 PAD CERAMIC LEADLESS CHIP CARRIER PACKAGE

File Size 19.70K  /  1 Page

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Amphenol Communications Solutions

Part No. 61082-182500LF
Description BergStak® 0.80mm Pitch, Receptacle, Vertical, Double Row, 180 Positions.
Tech specs    

Official Product Page

    J20.BPACKAGE

Intersil Corporation
Part No. J20.BPACKAGE
Description 20 PAD CERAMIC LEADLESS CHIP CARRIER PACKAGE

File Size 16.39K  /  1 Page

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Amphenol Communications Solutions

Part No. 131-5218-21D
Description Paladin® 112Gb/s Backplane Connector, 5-Pair, 8 Column, Double End Wall, Backplane Module, 2.25mm Wipe, Nickel Sulfamate.
Tech specs    

Official Product Page

    XFPOEP3-STACK8-4

XFMRS Inc.
Part No. XFPOEP3-STACK8-4
Description 2X4 Stacked Combo

File Size 81.66K  /  2 Page

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Amphenol Communications Solutions

Part No. 131-4218-21H
Description Paladin® 112Gb/s Backplane Connector, 4-Pair, 8 Column, Double End Wall, Backplane Module, 2.25mm Wipe, APP.
Tech specs    

Official Product Page

    XFATM8-STACK12-4 XFATM8-STACK12-4-15

XFMRS Inc.
Part No. XFATM8-STACK12-4 XFATM8-STACK12-4-15
Description 2x6 STACKED COMBO

File Size 74.67K  /  2 Page

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Amphenol Communications Solutions

Part No. 20021824-100A0T1LF
Description Minitek127®, Board to Board connector, Unshrouded Vertical Stacking Header, Through Hole, Double Row, 100 Positions, 1.27 mm (.050in) * 1.27 mm (.050in) Pitch.
Tech specs    

Official Product Page

    XFATM2U-STACK2-4

XFMRS Inc.
Part No. XFATM2U-STACK2-4
Description DUAL PORT COMBO

File Size 69.26K  /  2 Page

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Amphenol Communications Solutions

Part No. RJULE4218201
Description Modular Jack - Right Angle, Input Output Connectors RJ45, 8P8C, Without LEDs, Shield.
Tech specs    

Official Product Page

    XFATM8G-STACK8-4

XFMRS Inc.
Part No. XFATM8G-STACK8-4
Description 2x4 STACKED COMBO
   2x4 STACKED COMBO

File Size 105.46K  /  2 Page

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Amphenol Communications Solutions

Part No. 70218-254LF
Description 4 Row Signal Header, Straight, Press-Fit
Tech specs    

Official Product Page

For ACK-2182 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | <8> | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

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