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  87759-4250 Datasheet PDF File

For 87759-4250 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | <8> | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

    87759-3464

Molex Electronics Ltd.
Part No. 87759-3464
Description 2.00mm (.079) Pitch Milli-Grid?/a> Header, Surface Mount, Vertical, 34 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, without Press-fit Plastic Pegs

File Size 420.98K  /  8 Page

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Amphenol Communications Solutions

Part No. 54121-816142500LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Single Row, 14 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    87759-3865

Molex Electronics Ltd.
Part No. 87759-3865
Description 2.00mm (.079) Pitch Milli-Grid?/a> Header, Surface Mount, Vertical, 38 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, without Press-fit Plastic Pegs

File Size 280.27K  /  6 Page

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Amphenol Communications Solutions

Part No. 54122-112042500LF
Description BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 4 position, 2.54mm (0.100in) pitch
Tech specs    

Official Product Page

    87759-1875

Molex Electronics Ltd.
Part No. 87759-1875
Description 2.00mm (.079) Pitch Milli-Grid?/a> Header, Surface Mount, Vertical, 18 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, without Press-fit Plastic Pegs, with Pick-and-Place Cap

File Size 280.29K  /  6 Page

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Amphenol Communications Solutions

Part No. U10A474250T
Description SlimSAS Right angle X8 30u\\ Gold plating, Latch pin length=3.0mm, 24G, T&R packing
Tech specs    

Official Product Page

    87759-1876

Molex Electronics Ltd.
Part No. 87759-1876
Description 2.00mm (.079) Pitch Milli-Grid?/a> Header, Surface Mount, Vertical, 18 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, with Press-fit Plastic Pegs, Pick-and-Place Cap

File Size 355.72K  /  6 Page

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Amphenol Communications Solutions

Part No. U10KH7425001T
Description SlimSAS Vertical X12 30u\\ Gold plating, Latch pin outside, Latch pin length=3.0mm, 24G, T&R packing
Tech specs    

Official Product Page

    87759-1814

Molex Electronics Ltd.
Part No. 87759-1814
Description 2.00mm (.079) Pitch Milli-Grid?/a> Header, Surface Mount, Vertical, 18 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, without Press-fit Plastic Pegs, Lead-free

File Size 420.10K  /  8 Page

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Amphenol Communications Solutions

Part No. 77315-425-04LF
Description BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 4 Positions 2.54mm (0.100in) Pitch, Right Angle
Tech specs    

Official Product Page

    87759-0875

Molex Electronics Ltd.
Part No. 87759-0875
Description 2.00mm (.079) Pitch Milli-Grid?/a> Header, Surface Mount, Vertical, 8 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, without Press-fit Plastic Pegs

File Size 280.47K  /  6 Page

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Amphenol Communications Solutions

Part No. 61124-250CACLF
Description Assembly, Top Mount, D/D(136Pins), VTB, Type 123, 3.3V, 5mm s/o, Right Push Rod Eject, 9.5mm Eject Travel
Tech specs    

Official Product Page

    87759-1450

Molex Electronics Ltd.
Part No. 87759-1450
Description 2.00mm (.079) Pitch Milli-Grid?/a> Header, Surface Mount, Vertical, 14 Circuits, 0.38μm (30μ) Gold (Au) Selective Plating, without Press-fit Plastic Pegs, Lead-free

File Size 174.22K  /  4 Page

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Amphenol Communications Solutions

Part No. 54122-112142500LF
Description BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 14 position, 2.54mm (0.100in) pitch
Tech specs    

Official Product Page

    87759-0674

Molex Electronics Ltd.
Part No. 87759-0674
Description 2.00mm (.079) Pitch Milli-Grid Header, Surface Mount, Vertical, 6 Circuits, 0.38um (15u) Gold (Au) Selective Plating

File Size 421.17K  /  8 Page

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Amphenol Communications Solutions

Part No. 54122-811242500LF
Description BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 24 position, 2.54mm (0.100in) pitch
Tech specs    

Official Product Page

    87759-1614

Molex Electronics Ltd.
Part No. 87759-1614
Description 2.00mm (.079) Pitch Milli-Grid?/a> Header, Surface Mount, Vertical, 16 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, without Press-fit Plastic Pegs, Lead-free

File Size 420.27K  /  8 Page

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Amphenol Communications Solutions

Part No. 54242-504140950LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Surface Mount, Double Row, 14 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    87759-0814

Molex Electronics Ltd.
Part No. 87759-0814
Description 2.00mm (.079) Pitch Milli-Grid?/a> Header, Surface Mount, Vertical, 8 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, without Press-fit Plastic Pegs, Lead-free

File Size 420.16K  /  8 Page

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Amphenol Communications Solutions

Part No. 59112-G24-25-051LF
Description Minitek® 2.00mm, Board To Board, Unshrouded Vertical Stacking Header, Through Hole, Double Row, 50 Positions.
Tech specs    

Official Product Page

For 87759-4250 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | <8> | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

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