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Molex Electronics Ltd.
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| Part No. |
0877580816 87758-0816
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| Description |
2.00mm (.079) Pitch Milli-Grid?/a> Header, Through Hole, Vertical, 8 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Pocket Tray Packaging, Lead-free
2.00mm (.079) Pitch Milli-Grid垄芒 Header, Through Hole, Vertical, 8 Circuits, 0.38楼矛m (15楼矛) Gold (Au) Selective Plating, Pocket Tray Packaging, Lead-free
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| File Size |
170.91K /
4 Page |
 View
it Online |
Download Datasheet
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Murata Manufacturing Co Ltd |
| Part No. |
DFE2016CKA-2R2M=P2
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| Description |
Fixed IND 2.2uH 1400mA NONAUTO
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| Tech specs |
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Official Product Page
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Murata Manufacturing Co Ltd |
| Part No. |
DFE2016CKA-1R0M=P2
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| Description |
Fixed IND 1uH 1800mA NONAUTO
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
10127820-1622LPCLF
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| Description |
Minitek® Pwr 4.2, Dual Row, Vertical Through Hole Header, 80u\\ Min Tin plating, Natural Color, 16 Positions, LCP, GW Compatible, With Pegs, Tape and Reel with cap.
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
68020-162HLF
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| Description |
BergStik®, Board to Board connector, Unshrouded Right angled Header, Through Hole, Double Row, 62 Positions, 2.54mm (0.100in) Pitch.
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
87758-5017 0877585017
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| Description |
2.00mm (.079) Pitch Milli-Grid?/a> Header, Through Hole, Vertical, 50 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, Pocket Tray Packaging, Lead-free
2.00mm (.079) Pitch Milli-Grid?Header, Through Hole, Vertical, 50 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, Pocket Tray Packaging, Lead-free
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| File Size |
170.76K /
4 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
67292-016LF
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| Description |
BergStik® 2.54mm, Board To Board, Vertical 2 Row Guide Pin Header 32 Positions 2.54mm Pitch 3.81um (150u\\.) Tin-Lead Mating plating.
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
87758-3217 0877583217
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| Description |
2.00mm (.079) Pitch Milli-Grid?/a> Header, Through Hole, Vertical, 32 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, Pocket Tray Packaging, Lead-free
2.00mm (.079) Pitch Milli-Grid Header, Through Hole, Vertical, 32 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, Pocket Tray Packaging, Lead-free
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| File Size |
170.71K /
4 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
54122-809201650LF
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| Description |
BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 20 position, 2.54mm (0.100in) pitch
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
87758-4017 0877584017
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| Description |
2.00mm (.079) Pitch Milli-Grid?/a> Header, Through Hole, Vertical, 40 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, Pocket Tray Packaging, Lead-free
2.00mm (.079) Pitch Milli-Grid Header, Through Hole, Vertical, 40 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, Pocket Tray Packaging, Lead-free
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| File Size |
170.76K /
4 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
10127820-1621LPLF
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| Description |
Minitek® Pwr 4.2, Dual Row, Vertical Through Hole Header, Gold Flash plating, Natural Color, 16 Positions, LCP, GW Compatible, Tray Packing, With Pegs.
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
87758-5016 0877585016
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| Description |
2.00mm (.079) Pitch Milli-Grid?/a> Header, Through Hole, Vertical, 50 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Pocket Tray Packaging, Lead-free
2.00mm (.079) Pitch Milli-Grid?Header, Through Hole, Vertical, 50 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Pocket Tray Packaging, Lead-free
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| File Size |
170.71K /
4 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
10127720-162LF
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| Description |
Minitek® Pwr 3.0, Dual Row, Right Angle Through Hole Header, 16 Positions, Gold Flash plating, Non GW Compatible LCP, With Pegs, Tray Packing.
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
87758-4016 0877584016
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| Description |
2.00mm (.079) Pitch Milli-Grid?/a> Header, Through Hole, Vertical, 40 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Pocket Tray Packaging, Lead-free
2.00mm (.079) Pitch Milli-Grid Header, Through Hole, Vertical, 40 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Pocket Tray Packaging, Lead-free
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| File Size |
170.71K /
4 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
10127820-1622PLF
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| Description |
Minitek® Pwr 4.2, Dual Row, Vertical Through Hole Header, 80u\\ Min Tin plating, Natural Color, 16 Positions, Non GW Compatible Nylon66, Tray Packing, With Pegs.
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
87758-4050 0877584050
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| Description |
2.00mm (.079) Pitch Milli-Grid?/a> Header, Through Hole, Vertical, 40 Circuits, 0.38μm(15μ) Gold (Au) Selective Plating, Tray Packaging, Lead-free
2.00mm (.079) Pitch Milli-Grid Header, Through Hole, Vertical, 40 Circuits, 0.38μm(15μ) Gold (Au) Selective Plating, Tray Packaging, Lead-free
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| File Size |
135.77K /
4 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
67292-016
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| Description |
BergStik® 2.54mm, Board To Board, Vertical 2 Row Guide Pin Header 32 Positions 2.54mm Pitch 3.81um (150u\\.) Tin-Lead Mating plating.
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Official Product Page
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