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  8215-9004 Datasheet PDF File

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Part No. COM9004P
Description Carrier/Multi-Wire Interface

File Size 325.05K  /  8 Page

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Amphenol Communications Solutions

Part No. 54122-110082150LF
Description BergStik®, Board to Board connector, Unshrouded Stacking vertical header, Through Hole, Double Row, 8 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

HUA FENG CIRCUIT





   
Part No. 71821584 71821585 71821586
Description Synchronizable, High-Frequency Current- and Voltage-Mode PWM Controllers for Isolated Supplies
陶瓷加热元件

File Size 265.43K  /  3 Page

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Amphenol Communications Solutions

Part No. 68482-150HLF
Description BergStik® 2.54mm, Board To Board Connector, Unshrouded Vertical Header, Through Hole, Double Row, 50 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    TS900407

Taiwan Semiconductor Company, Ltd
Part No. TS900407
Description 300mA CMOS LDO Adjustable Voltage with Enable & Power Good

File Size 308.76K  /  7 Page

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Amphenol Communications Solutions

Part No. 76308-215LF
Description Dubox® 2.54mm, Board to Board Connector, 15 Positions,Single Row,Vertical,2.54mm pitch,Card Connector.
Tech specs    

Official Product Page

    IP9004 IP9004A IP9004A-TF IP9004AL IP9004AL-TF

Interpion semiconductor
Part No. IP9004 IP9004A IP9004A-TF IP9004AL IP9004AL-TF
Description    5-CH MOTOR DRIVE IC

File Size 158.26K  /  12 Page

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Amphenol Communications Solutions

Part No. 68482-152HLF
Description BergStik® 2.54mm, Board To Board Connector, Unshrouded Vertical Header, Through Hole, Double Row, 52 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    Molex, Inc.
Part No. 74752-9004 74752-9001 74752-4501 74752-4101 74752-3101 74752-1101
Description SFP Copper Patch Cbl 10G-10M(Pass w/o eq INTERCONNECTION DEVICE
SFP Copper Patch Cbl(Pssv w/o EQ)30 AWG INTERCONNECTION DEVICE
SFP Copper Patch Cable 10G - 5 M 24AWG INTERCONNECTION DEVICE
SFP Copper Patch Cable 10G - 1 M 24AWG INTERCONNECTION DEVICE
SFP Copper Patch Cable 10G - 1M 26AWG INTERCONNECTION DEVICE
SFP Copper Patch Cable 10G - 1 M INTERCONNECTION DEVICE

File Size 410.89K  /  4 Page

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Amphenol Communications Solutions

Part No. 54112-111082150LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 8 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    LBN09004

SIPAT Co,Ltd
Part No. LBN09004
Description SAW Filter Electrical Characteristic

File Size 129.52K  /  1 Page

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Amphenol Communications Solutions

Part No. 10143578-215KLF
Description Minitek MicroSpace™ 1.27mm Crimp-to-Wire Connector Platform, Wire to Board Connector, Vertical, Header, Surface Mount, 15 Position,staggered,side Latch<br><br>(For product qualification latest status, please submit <a href=\\javascript:;\\ class=\\button product-enquiry\\ style=\\background: none;color: red;\\><span>Product Enquiry</span></a>)
Tech specs    

Official Product Page

    INTERPION SEMICONDUCTOR CO.,LTD.
INTERPION SEMICONDUCTOR CO., LTD.
Part No. IP9004 IP9004AL-TF IP9004A-TF
Description 5-CH MOTOR DRIVE IC 5通道马达驱动电路

File Size 162.42K  /  12 Page

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Amphenol Communications Solutions

Part No. 89008-215LF
Description 5 Row Signal Header, Straight, Press-Fit, Wide body
Tech specs    

Official Product Page

    TBB200 TBB200G Q67100-H8215 Q67100-H8216

SIEMENS AG
SIEMENS[Siemens Semiconductor Group]
Part No. TBB200 TBB200G Q67100-H8215 Q67100-H8216
Description PLL-Frequency Synthesizer with I2C Bus 锁相环频率合成I2C总线

File Size 459.90K  /  28 Page

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Amphenol Communications Solutions

Part No. 68458-215HLF
Description BergStik® 2.54mm, Board To Board Connector, Unshrouded Right Angled Header, Through Hole, Single Row, 15 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    TA8215 TA8215H TA8215L E003747

Toshiba Corporation
TOSHIBA[Toshiba Semiconductor]
Part No. TA8215 TA8215H TA8215L E003747
Description 18W BTL x 3CH AUDIO POWER AMPLIFIER
From old datasheet system

File Size 481.31K  /  11 Page

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Amphenol Communications Solutions

Part No. 54121-111082150LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Single Row, 8 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    7447728215

Wurth Elektronik GmbH & Co. KG, Germany.
Part No. 7447728215
Description WE-TI Radial Leaded Wire Wound Inductor

File Size 987.86K  /  6 Page

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Amphenol Communications Solutions

Part No. 78208-215HLF
Description PV Shrouded Header, Wire to Board connector, 2 Wall Shrouded Header - Through Hole - Single row - 15 Positions 2.54mm - Right Angle.
Tech specs    

Official Product Page

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