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Amphenol Communications Solutions |
| Part No. |
10118085-101-12LF
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| Description |
Unshrouded Right Angle header,Surface Mount, Double Row, 12 Positions, 2.54mm (0.100in) Pitch.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
10119333-101-15LF
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| Description |
BergStik®, Board to Board connector, Unshrouded horizontal header, Surface mount, Single Row, 15 Positions, 2.54mm (0.100in) Pitch.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
10114829-10110LF
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| Description |
1.25mm Wire to Board Wafer, Vertical, Through Hole, 10 Positions
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
70287-1025 0702871025
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| Description |
2.54mm (.100") Pitch C-Grid Header, Breakaway, Dual Row, Vertical, with Retention Pin, 54 Circuits, 6.10mm
2.54mm (.100) Pitch C-Grid Header, Breakaway, Dual Row, Vertical, with Retention Pin, 54 Circuits, 6.10mm
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| File Size |
308.33K /
6 Page |
 View
it Online |
Download Datasheet
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Amphenol Communications Solutions |
| Part No. |
10114831-10113LF
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| Description |
1.25mm Wire-to-Board Connector System WAFER THROUGH HOLE RIGHT ANGLE, 13 POSITIONS, TIN PLATING
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
70287-1012 0702871012
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| Description |
2.54mm (.100") Pitch C-Grid庐 Header, Breakaway, Dual Row, Vertical, with RetentionPin, 28 Circuits, 6.10mm (.240") Mating Pin Length, Tin (Sn) Plating
2.54mm (.100) Pitch C-Grid? Header, Breakaway, Dual Row, Vertical, with RetentionPin, 28 Circuits, 6.10mm (.240) Mating Pin Length, Tin (Sn) Plating
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| File Size |
308.31K /
6 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
10114831-10114LF
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| Description |
1.25mm Wire-to-Board Connector System WAFER THROUGH HOLE RIGHT ANGLE, 14 POSITIONS, TIN PLATING
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
70287-1023 0702871023
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| Description |
2.54mm (.100") Pitch C-Grid庐 Header, Breakaway, Dual Row, Vertical, with RetentionPin, 50 Circuits, 6.10mm (.240") Mating Pin Length, Tin (Sn) Plating
2.54mm (.100) Pitch C-Grid? Header, Breakaway, Dual Row, Vertical, with RetentionPin, 50 Circuits, 6.10mm (.240) Mating Pin Length, Tin (Sn) Plating
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| File Size |
308.31K /
6 Page |
View
it Online |
Download Datasheet |
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|
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Amphenol Communications Solutions |
| Part No. |
10114829-10114LF
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| Description |
1.25mm Wire to Board Wafer, Vertical, Through Hole, 14 Positions
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
70287-1022 0702871022
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| Description |
2.54mm (.100") Pitch C-Grid庐 Header, Breakaway, Dual Row, Vertical, with Retention Pin, 48 Circuits, 6.10mm (.240") Mating Pin Length, Tin (Sn) Plating
2.54mm (.100) Pitch C-Grid? Header, Breakaway, Dual Row, Vertical, with Retention Pin, 48 Circuits, 6.10mm (.240) Mating Pin Length, Tin (Sn) Plating
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| File Size |
308.32K /
6 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
10114828-10115LF
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| Description |
1.25mm Wire to Board Wafer,Vertical, Surface Mount, 15 Positions
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
70287-1021 0702871021
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| Description |
2.54mm (.100") Pitch C-Grid庐 Header, Breakaway, Dual Row, Vertical, with RetentionPin, 46 Circuits, 6.10mm (.240") Mating Pin Length, Tin (Sn) Plating
2.54mm (.100) Pitch C-Grid? Header, Breakaway, Dual Row, Vertical, with RetentionPin, 46 Circuits, 6.10mm (.240) Mating Pin Length, Tin (Sn) Plating
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| File Size |
308.32K /
6 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
10114830-10111LF
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| Description |
1.25mm Wire to Board Wafer, Right Angle, Surface Mount, 11 Positions
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
70287-1020 0702871020
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| Description |
2.54mm (.100) Pitch C-Grid庐 Header, Breakaway, Dual Row, Vertical, with Retention Pin, 44 Circuits, 6.10mm (.240) Mating Pin Length, Tin (Sn) Plating
2.54mm (.100) Pitch C-Grid? Header, Breakaway, Dual Row, Vertical, with Retention Pin, 44 Circuits, 6.10mm (.240) Mating Pin Length, Tin (Sn) Plating
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| File Size |
308.33K /
6 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
10114829-10115LF
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| Description |
1.25mm Wire to Board Wafer, Vertical, Through Hole, 15 Positions
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
70287-1019 0702871019
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| Description |
2.54mm (.100") Pitch C-Grid庐 Header, Breakaway, Dual Row, Vertical, with RetentionPin, 42 Circuits, 6.10mm (.240") Mating Pin Length, Tin (Sn) Plating
2.54mm (.100) Pitch C-Grid? Header, Breakaway, Dual Row, Vertical, with RetentionPin, 42 Circuits, 6.10mm (.240) Mating Pin Length, Tin (Sn) Plating
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| File Size |
308.32K /
6 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
10114831-10115LF
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| Description |
1.25mm Wire-to-Board Connector System WAFER THROUGH HOLE RIGHT ANGLE, 15 POSITIONS, TIN PLATING
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| Tech specs |
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Official Product Page
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Bom2Buy.com
Price and Availability
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