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  62300-5300 Datasheet PDF File

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    ATS-55300W-C2-R0

Advanced Thermal Solutions, Inc.
Part No. ATS-55300W-C2-R0
Description High Performance BGA Cooling

File Size 266.53K  /  1 Page

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Amphenol Communications Solutions

Part No. 10138796-23000LF
Description HPCE CTB VT HEADER 4HP with latch
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    ATS-55300D-C1-R0

Advanced Thermal Solutions, Inc.
Part No. ATS-55300D-C1-R0
Description High Performance X-CUT - Heat Sink, T412, BLACk-ANODIZED

File Size 229.47K  /  1 Page

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Amphenol Communications Solutions

Part No. 54111-111362300LF
Description BergStik® 2.54mm, Board To Board Connector, Unshrouded vertical stacked header, Through Hole, Single Row, 36 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

   
Part No. PT3-12 PT3-3 PT3-2 PT3-7 PT3-4 PT3-8 7T5300 PT3-10 PT3-11
Description 55V Single N-Channel HEXFET Power MOSFET in a TO-262 package; A IRFZ44ZL with Standard Packaging
Logic IC
30V Single N-Channel HEXFET Power MOSFET in a D2-Pak package; A IRF3709ZS with Standard Packaging
75V Single N-Channel HEXFET Power MOSFET in a D-Pak package; A IRFR2607Z with Standard Packaging
75V Single N-Channel HEXFET Power MOSFET in a TO-262 package; A IRF1407L with Standard Packaging
55V Single N-Channel HEXFET Power MOSFET in a TO-262 package; A IRL3705ZL with Standard Packaging
Dual CMOS LDO 300mA & 150mA w/Shtdn., Voltage Detect,Bypass & Ind. Delayed Reset, -40C to 125C, 8-MSOP, TUBE
Dual CMOS LDO 300mA &amp; 150mA w/Shtdn., Voltage Detect,Bypass &amp; Ind. Delayed Reset, -40C to 125C, 8-MSOP, TUBE 逻辑IC

File Size 45.02K  /  1 Page

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Amphenol Communications Solutions

Part No. 54122-812162300LF
Description BergStik®, Board to Board connector, Unshrouded Vertical Stacking Header, Through Hole, Double row, 16 Positions, 2.54mm (0.100in) Pitch
Tech specs    

Official Product Page

    ATS-55300R-C1-R0

Advanced Thermal Solutions, Inc.
Part No. ATS-55300R-C1-R0
Description High Performance X-CUT - Heat Sink, T412, BLACK-ANODIZED

File Size 229.44K  /  1 Page

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Amphenol Communications Solutions

Part No. 54122-410062300RLF
Description BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 6 position, 2.54mm (0.100in) pitch
Tech specs    

Official Product Page

    MT5300-UGS

Marktech Corporate
Part No. MT5300-UGS
Description 5.0mm ROUND LED LAMP

File Size 153.17K  /  6 Page

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Amphenol Communications Solutions

Part No. 54112-111262300LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 26 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    ATS-55300D-C2-R0

Advanced Thermal Solutions, Inc.
Part No. ATS-55300D-C2-R0
Description High Performance BGA Cooling

File Size 266.53K  /  1 Page

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Amphenol Communications Solutions

Part No. 54242-111362300LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Surface Mount, Double Row, 36 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    ATS-55300R-C2-R0

Advanced Thermal Solutions, Inc.
Part No. ATS-55300R-C2-R0
Description High Performance BGA Cooling

File Size 266.54K  /  1 Page

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Amphenol Communications Solutions

Part No. FLAR21623005
Description FLA Tool-less Rotatable Receptacle NEMA ANSI C136.41, 3 Power, 2 Signal, 16AWG, 150C
Tech specs    

Official Product Page

    ATS-55300K-C2-R0

Advanced Thermal Solutions, Inc.
Part No. ATS-55300K-C2-R0
Description High Performance BGA Cooling

File Size 266.54K  /  1 Page

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Amphenol Communications Solutions

Part No. FLAR41623005
Description FLA Tool-less Rotatable Receptacle NEMA ANSI C136.41, 3 Power, 4 Signal, 16AWG, 150C
Tech specs    

Official Product Page

    MT5300-BLS

Marktech Corporate
Part No. MT5300-BLS
Description 5.0mm ROUND LED LAMP

File Size 153.15K  /  6 Page

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Amphenol Communications Solutions

Part No. 54242-810162300LF
Description BergStik® 2.54mm, Board To Board Connector, Unshrouded Vertical Stacking Header, Surface Mount, Double row, 16 Positions, 2.54mm (0.100in) Pitch
Tech specs    

Official Product Page

    PC2-3200 PC2-4200 PC2-5300 PC2-6400

Micron Technology
Part No. PC2-3200 PC2-4200 PC2-5300 PC2-6400
Description    DDR2 SDRAM UDIMM

File Size 356.14K  /  19 Page

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Amphenol Communications Solutions

Part No. 54121-811262300LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Single Row, 26 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

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