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  5941-4CC Datasheet PDF File

For 5941-4CC Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | <8> | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

    IRG4CC70UB

International Rectifier
Part No. IRG4CC70UB
Description IRG4CC70UB IGBT Die in Wafer Form

File Size 34.36K  /  1 Page

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Amphenol Communications Solutions

Part No. 68459-410HLF
Description BergStik® 2.54mm, Board To Board Connector, Unshrouded Right Angled Header, Through Hole, Double Row, 10 Positions, 2.54mm (0.100in)Pitch.
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    IRG4CC60UB

International Rectifier
Part No. IRG4CC60UB
Description IRG4CC60UB IGBT Die in Wafer Form

File Size 27.20K  /  1 Page

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Amphenol Communications Solutions

Part No. 68459-414HLF
Description BergStik® 2.54mm, Board To Board Connector, Unshrouded Right Angled Header, Through Hole, Double Row, 14 Positions, 2.54mm (0.100in)Pitch.
Tech specs    

Official Product Page

    IRG4CC60FB

International Rectifier
Part No. IRG4CC60FB
Description IRG4CC60FB IGBT Die in Wafer Form

File Size 27.19K  /  1 Page

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Amphenol Communications Solutions

Part No. 10159559-410221RLF
Description ComboStak® Vertical Receptacle 2P 10S 2P Height 7.7mm
Tech specs    

Official Product Page

    IRG4CC58KB

International Rectifier
Part No. IRG4CC58KB
Description IRG4CC58KB IGBT Die in Wafer Form

File Size 40.45K  /  1 Page

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Amphenol Communications Solutions

Part No. 10136594-101LF
Description AirMax VS2®, Backplane Connectors, 4-Pair, 120 -position, 2mm pitch, 10 column, 4 Walls, Right Angle Header, small press-fit, 1 side plating.
Tech specs    

Official Product Page

    IRG4CC50WB

Hittite Microwave Corporation
International Rectifier
Part No. IRG4CC50WB
Description IGBT Die in Wafer Form 600 V Size 5 WARP Speed
IRG4CC50WB IGBT Die in Wafer Form

File Size 23.15K  /  1 Page

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Amphenol Communications Solutions

Part No. 68459-416HLF
Description BergStik® 2.54mm, Board To Board Connector, Unshrouded Right Angled Header, Through Hole, Double Row, 16 Positions, 2.54mm (0.100in)Pitch.
Tech specs    

Official Product Page

    IRG4CC50UB

International Rectifier
Part No. IRG4CC50UB
Description IRG4CC50UB IGBT Die in Wafer Form

File Size 35.08K  /  1 Page

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Amphenol Communications Solutions

Part No. 68459-412HLF
Description BergStik® 2.54mm, Board To Board Connector, Unshrouded Right Angled Header, Through Hole, Double Row, 12 Positions, 2.54mm (0.100in)Pitch.
Tech specs    

Official Product Page

    IRG4CC50SB

International Rectifier
Part No. IRG4CC50SB
Description IRG4CC50SB IGBT Die in Wafer Form

File Size 38.93K  /  1 Page

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Amphenol Communications Solutions

Part No. 68459-418HLF
Description BergStik® 2.54mm, Board To Board Connector, Unshrouded Right Angled Header, Through Hole, Double Row, 18 Positions, 2.54mm (0.100in)Pitch.
Tech specs    

Official Product Page

    IRG4CC50KB

International Rectifier
Part No. IRG4CC50KB
Description IRG4CC50KB IGBT Die in Wafer Form

File Size 36.59K  /  1 Page

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Amphenol Communications Solutions

Part No. 10136594-102LF
Description AirMax VS2®, Backplane Connectors, 4-Pair, 120 -position, 2mm pitch, 10 column, 4 Walls, Right Angle Header, small press-fit, 2 side plating.
Tech specs    

Official Product Page

    IRG4CC50FB

International Rectifier
Part No. IRG4CC50FB
Description IRG4CC50FB IGBT Die in Wafer Form

File Size 34.90K  /  1 Page

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    IRG4CC40WB

International Rectifier
Part No. IRG4CC40WB
Description 晶体管| IGBT的|正陈| 600V的五(巴西)国际消费电子展|芯片
IRG4CC40WB IGBT Die in Wafer Form

File Size 22.92K  /  1 Page

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For 5941-4CC Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | <8> | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

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