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  502-0406 Datasheet PDF File

For 502-0406 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | <8> | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

    DB Lectro Inc.
DB Lectro, Inc.
Part No. HG4502/024-S2 HG4502/009-D1 HG4502/005-S1 HG4502/005-S2 HG4502/009-SD1 HG4502/009-SD2 HG4502/024-SD1 HG4502/024-SD2 HG4502/012-D2 HG4502/012-D1 HG4502/012-SD1 HG4502/012-SD2 HG4502/024-S1 HG4502/024-D2 HG4502/009-S2 HG4502/012-S2 HG4502/005-D1 HG4502/005-D2 HG4502/005-SD1 HG4502/005-SD2 HG4502/024-D1
Description Heavy Duty Magnetic Latching Relay 重型继电

File Size 57.86K  /  2 Page

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Amphenol Communications Solutions

Part No. G832MB030406022HR
Description 0.80mm Board-to-Board 85Ω Connector, Pitch 0.8mm, Height 11.7 mm, 40 Positions, Dual Row, BTB Vertical Receptacle SMT, Gold Flash White.
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    HITACHI-METALS[Hitachi Metals, Ltd]
Part No. LF-FSLF-S090JR-0406A FSLF-S090JR
Description 2012 Size Chip Multilayer Diplexer for CELL / GPS

File Size 51.09K  /  4 Page

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Amphenol Communications Solutions

Part No. 69190-406HLF
Description BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Single Row, 06 Positions, 2.54 mm (0.100in) Pitch.
Tech specs    

Official Product Page

    HITACHI-METALS[Hitachi Metals, Ltd]
Part No. LF-FSLF-S090JG-0406A FSLF-S090JG
Description 2012 Size Chip Multilayer Diplexer for CELL / GPS

File Size 52.40K  /  4 Page

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Amphenol Communications Solutions

Part No. 77319-804-06LF
Description BergStik®, Board to Board connector, Unshrouded right angled header, Through Hole, Double Row, 06 Positions, 2.54 mm (0.100) Pitch.
Tech specs    

Official Product Page

    Bourns, Inc.
Part No. EHA4-2512/883B EHA9-2512/883B EHA9-2502/883B EHA4-2502/883B
Description Dual Micropower, Single Supply, Rail-to-Rail Input and Output (RRIO) Instrumentation Amplifier; Temperature Range: Full-Range Ind; Package: 15-QSOP T&R
Voltage-Feedback Operational Amplifier
Ambient Light Photo Detect IC; Temperature Range: -40°C to 85°C; Package: 5-DFN
Dual Channel Micro-power, Single Supply, Rail-to-Rail Input and Output (RRIO) Instrumentation Amplifier; Temperature Range: -40°C to 85°C; Package: 16-QSOP T&R
Dual Channel Micro-power, Single Supply, Rail-to-Rail Input and Output (RRIO) Instrumentation Amplifier; Temperature Range: -40&deg;C to 85&deg;C; Package: 16-QSOP T&amp;R 电压反馈运算放大

File Size 1,069.45K  /  15 Page

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Amphenol Communications Solutions

Part No. 54776-604-06LF
Description BergStik®, Board to Board connector, Unshrouded Vertical Stacking Header, Through Hole, Double row , Double body, Triplex, 6 Positions, 2.54mm (0.100in) Pitch
Tech specs    

Official Product Page

    XF0406-00SMTH XF0406-00SMTH-15

XFMRS Inc.
Part No. XF0406-00SMTH XF0406-00SMTH-15
Description TRANSFORMER

File Size 44.25K  /  1 Page

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Amphenol Communications Solutions

Part No. 59202-S28-04-065LF
Description Minitek® 2.00mm, Board To Board, Unshrouded Vertical Header, Surface Mount, Double Row, 8 Positions.
Tech specs    

Official Product Page

    XF04061-2SB11

XFMRS Inc.
Part No. XF04061-2SB11
Description TRANSFORMERS

File Size 65.72K  /  1 Page

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Amphenol Communications Solutions

Part No. 77317-804-06
Description BergStik®, Board to Board connector, Unshrouded Right angle Header, Through Hole, Double Row, 6 Positions ,2.54mm (0.100in) Pitch,
Tech specs    

Official Product Page

    SOM04060

celduc-relais
Part No. SOM04060
Description MOSFET BASED DC SOLID-STATE RELAY

File Size 367.26K  /  5 Page

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Amphenol Communications Solutions

Part No. 71600-406LF
Description Quickie IDC Receptacle, Wire to Board connector -Double row - 6Positions - 2.54 mm (0.100in) Pitch
Tech specs    

Official Product Page

    2MP04-060-10 2MP04-060-12 2MP04-060-15 2MP04060

RMT Ltd.
Part No. 2MP04-060-10 2MP04-060-12 2MP04-060-15 2MP04060
Description Specifications
The series of two-stage TE modules has been designed for applications where a relatively large cold side is required as well as two-stage level cooling.

File Size 214.62K  /  4 Page

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Amphenol Communications Solutions

Part No. 68000-406HLF
Description BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 6 Positions, 2.54 mm Pitch, Vertical, 5.84 mm (0.23 in.) Mating, 2.41 mm (0.095 in.) Tail
Tech specs    

Official Product Page

    Peregrine Semiconductor Cor...
PEREGRINE[Peregrine Semiconductor Corp.]
Peregrine Semiconductor...
Part No. PE9304_06 9304-00 9304-01 9304-11 PE9304 PE930406 PE9304-15
Description 1- 7 GHz Low Power CMOS Divide-by-2 Prescaler
1 GHz - 7 GHz Low Power UltraCMOS Divide-by-2 Prescaler Rad-hard for Space Applications

File Size 210.38K  /  6 Page

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Amphenol Communications Solutions

Part No. 86380-406HLF
Description 86380-406HLF-B/S II HDR DR SELF-RET
Tech specs    

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    EPCOS AG
Part No. HV0406DG
Description Interface IC 接口IC

File Size 187.11K  /  6 Page

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Amphenol Communications Solutions

Part No. 10082201-404-06LF
Description BergStik®, Board to Board connector, Unshrouded Right Angle Header, Through Hole, Pin In Paste, Single row , 6 Positions, 2.54mm (0.100in) Pitch
Tech specs    

Official Product Page

For 502-0406 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | <8> | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

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