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  43045-0806 Datasheet PDF File

For 43045-0806 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | <8> | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

    43045-1810

Molex Electronics Ltd.
Part No. 43045-1810
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Header, Surface Mount, Dual Row, Right Angle, with Solder Tab, 18 Circuits

File Size 180.51K  /  3 Page

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Amphenol Communications Solutions

Part No. 10093084-3045HFLF
Description QSFP+ Cable Assembly, 28 AWG, 4.5ms, passive, Halogen free
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    43045-1812

Molex Electronics Ltd.
Part No. 43045-1812
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Header, Surface Mount Compatible, Dual Row, Vertical, with PCB Polarizing Peg, 18 Circuits

File Size 166.51K  /  3 Page

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Amphenol Communications Solutions

Part No. 10093084-3045LF
Description QSFP+ Cable Assembly, 28 AWG, 4.5ms, passive, non-halogen free
Tech specs    

Official Product Page

    43045-1818

Molex Electronics Ltd.
Part No. 43045-1818
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Header, Surface Mount, Dual Row, Vertical, with Solder Tab, 18 Circuits

File Size 175.78K  /  3 Page

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Amphenol Communications Solutions

Part No. 54202-G08-06P
Description BergStik®, Board to Board connector, Unshrouded Vertical Header, Surface Mount, Double Row, 12 Positions, 2.54 mm (0.100in) Pitch.
Tech specs    

Official Product Page

    43045-1817

Molex Electronics Ltd.
Part No. 43045-1817
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Header, Surface Mount, Dual Row, Vertical, with Press-fit Metal Retention Clip, 18 Circuits

File Size 174.07K  /  3 Page

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Amphenol Communications Solutions

Part No. 75160-806-10LF
Description BergStik®, Board to Board connector, Unshrouded vertical header, through hole, single Row,10 position, 2.54mm pitch
Tech specs    

Official Product Page

    43045-0820

Molex Electronics Ltd.
Part No. 43045-0820
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Header, Surface Mount, Dual Row, Vertical, with Solder Tab, 8 Circuits

File Size 174.46K  /  3 Page

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Amphenol Communications Solutions

Part No. 57102-F08-06LF
Description Minitek®, Board/Wire to Board Connectors, Unshrouded Headers - Through Hole - Double row - 12 Positions - 2mm (0.079inch) - Vertical
Tech specs    

Official Product Page

    43045-0821

Molex Electronics Ltd.
Part No. 43045-0821
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Header, Surface Mount Compatible, Dual Row, Right Angle, with Press-fit Metal Retention Clip, 8 Circuits

File Size 183.77K  /  3 Page

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Amphenol Communications Solutions

Part No. 54102-G0806LF
Description 54102-G0806LF-DUPLEX
Tech specs    

Official Product Page

    43045-0822

Molex Electronics Ltd.
Part No. 43045-0822
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Header, Surface Mount Compatible, Dual Row, Right Angle, with Press-fit Metal Retention Clip, 8 Circuits

File Size 183.86K  /  3 Page

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Amphenol Communications Solutions

Part No. 54122-101080600RLF
Description BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 8 position, 2.54mm (0.100in) pitch
Tech specs    

Official Product Page

    43045-0823

Molex Electronics Ltd.
Part No. 43045-0823
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Header, Surface Mount Compatible, Dual Row,

File Size 183.81K  /  3 Page

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Amphenol Communications Solutions

Part No. 68020-408-061033LF
Description BergStik®, Board to Board connector, Unshrouded Right angled Header, Through Hole, Double Row, 8 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    43045-1811

Molex Electronics Ltd.
Part No. 43045-1811
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Header, Surface Mount, Dual Row, Right Angle, with Solder Tab, 18 Circuits

File Size 180.51K  /  3 Page

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Amphenol Communications Solutions

Part No. 10142708-06200LF
Description Minitek®Pwr 5.7, Vertical Through Hole Header, Dual Row, Black Color, 6 Positions, 100u\\ Tin overall plating, GW Compatible LCP, With Pegs, Tray.
Tech specs    

Official Product Page

    43045-1816

Molex Electronics Ltd.
Part No. 43045-1816
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Header, Surface Mount, Dual Row, Vertical, with Press-fit Metal Retention Clip, 18 Circuits

File Size 174.08K  /  3 Page

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Amphenol Communications Solutions

Part No. 54112-808061500LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 6 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

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