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91930 GB356N LQFP44 12N65 BTA40A LTC340 LBN13003 20200CT
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  2816-4 Datasheet PDF File

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    UPA2816T1S

Renesas Electronics Corporation
Part No. UPA2816T1S
Description P-channel MOSFET ?0 V, ?7 A, 15.5 mΩ

File Size 137.11K  /  7 Page

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Amphenol Communications Solutions

Part No. 54122-816523000LF
Description BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 52 position, 2.54mm (0.100in) pitch
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    Samsung Electronic
Part No. K4D28163HD
Description 2M x 16Bit x 4 Banks Double Data Rate Synchronous RAM with Bi-directional Data Strobe and DLL Data Sheet

File Size 229.58K  /  16 Page

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Amphenol Communications Solutions

Part No. 54122-128161250LF
Description BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 16 position, 2.54mm (0.100in) pitch
Tech specs    

Official Product Page

    EM828164PA EM828164PA-60 EM828164PA-75 EM828164PA-90

Emerging Memory & Logic Solutions Inc
Part No. EM828164PA EM828164PA-60 EM828164PA-75 EM828164PA-90
Description 128M: 8M x 16 Mobile SDRAM

File Size 618.80K  /  48 Page

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Amphenol Communications Solutions

Part No. 77315-428-16LF
Description BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 16 Positions 2.54mm (0.100in) Pitch, Right Angle
Tech specs    

Official Product Page

    K4M28163PH

Samsung semiconductor
Part No. K4M28163PH
Description 2M x 16Bit x 4 Banks Mobile SDRAM

File Size 140.49K  /  12 Page

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Amphenol Communications Solutions

Part No. 68682-816
Description Dubox® 2.54mm, Board to Board Connector, PCB Mounted Receptacle, Vertical, Through Hole, Dual Entry, Double Row, 32 Position ,2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    KFG2816Q1M-DEB

Samsung semiconductor
Part No. KFG2816Q1M-DEB
Description (KFG2816Q1M-DEB / KFG2816U1M-DIB) Flash Memory

File Size 1,280.65K  /  88 Page

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Amphenol Communications Solutions

Part No. 59202-S28-16-050LF
Description Minitek® 2.00mm, Board To Board, Unshrouded Vertical Header, Surface Mount, Double Row, 32 Positions.
Tech specs    

Official Product Page

    44428-1604 SD-44428-001 0444281604

Molex Electronics Ltd.
http://
Part No. 44428-1604 SD-44428-001 0444281604
Description 3.00mm (.118) Pitch Micro-Fit 3.0 BMI Header, Surface Mount Compatible, Dual Row, Right Angle, without

File Size 232.66K  /  4 Page

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Amphenol Communications Solutions

Part No. 54112-816202500LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 20 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    Samsung Electronic
Part No. K4S28163LD-RFR
Description 2M x 16Bit x 4 Banks SDRAM in 54CSP Data Sheet

File Size 97.04K  /  12 Page

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Amphenol Communications Solutions

Part No. 54122-816202500LF
Description BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 20 position, 2.54mm (0.100in) pitch
Tech specs    

Official Product Page

    52610-2816 52610-2916 52610-0516 52610-0571 52610-0616 52610-0716 52610-0771 52610-0916 52610-0671 52610-0816 52610-0871

Molex Electronics Ltd.
Part No. 52610-2816 52610-2916 52610-0516 52610-0571 52610-0616 52610-0716 52610-0771 52610-0916 52610-0671 52610-0816 52610-0871
Description 1.0 FPC CONN SMT ZIF EMBSTP PKG

File Size 481.08K  /  7 Page

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Amphenol Communications Solutions

Part No. 54242-816062600LF
Description BergStik® 2.54mm, Board To Board Connector, Unshrouded Stacking vertical header, Surface Mount, Double Row, 6 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    K4M281633F K4M281633F-C K4M281633F-F1L K4M281633F-G K4M281633F-L K4M281633F-N K4M281633F-RE

Samsung Electronic
SAMSUNG[Samsung semiconductor]
SAMSUNG SEMICONDUCTOR CO. LTD.
Samsung Semiconductor Co., Ltd.
Part No. K4M281633F K4M281633F-C K4M281633F-F1L K4M281633F-G K4M281633F-L K4M281633F-N K4M281633F-RE
Description 2M x 16Bit x 4 Banks Mobile SDRAM in 54FBGA 200万16 × 4银行54FBGA移动SDRAM

File Size 111.99K  /  12 Page

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Amphenol Communications Solutions

Part No. 54112-816122500LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 12 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    42820 42817 42818 42815 42816 43914 43915 43938 43980

Molex Electronics Ltd.
Part No. 42820 42817 42818 42815 42816 43914 43915 43938 43980
Description 10.00mm (.393") Pitch Mini-Fit, Sr.垄芒
10.00mm (.393) Pitch Mini-Fit, Sr.?/a>

File Size 153.37K  /  2 Page

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Amphenol Communications Solutions

Part No. 59112-G28-16-050LF
Description Minitek® 2.00mm, Board To Board, Unshrouded Vertical Stacking Header, Through Hole, Double Row, 32 Positions.
Tech specs    

Official Product Page

For 2816-4 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | <8> | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

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