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  2166 Datasheet PDF File

For 2166 Found Datasheets File :: 128+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | <8> | 9 | 10 | 11 | 12 | 13 |   

    Renesas Electronics Corporation.
Part No. HD64F2168 HD64F2166 H8S/2168 H8S2168 H8S/2167 H8S2166 HD64F2167
Description (HD64F2166 - HD64F2168) Hardware Manual
Renesas 16-Bit Single-Chip Microcomputer

File Size 5,155.17K  /  874 Page

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Amphenol Communications Solutions

Part No. 51952-166LF
Description PwrBlade®, Power Supply Connectors, 3ACP 16S Vertical Header.
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    H8S2167 H8S2168 H8S_2167 HD64F2166 H8S_2166 H8S_2168 H8S2166 HD64F2167 HD64F2168

RENESAS[Renesas Electronics Corporation]
Part No. H8S2167 H8S2168 H8S_2167 HD64F2166 H8S_2166 H8S_2168 H8S2166 HD64F2167 HD64F2168
Description Renesas 16-Bit Single-Chip Microcomputer

File Size 4,808.51K  /  874 Page

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Amphenol Communications Solutions

Part No. RJE021660310H
Description Modular Jack - Right Angle, Input Output Connectors 6P6C, Shield, High Temperature.
Tech specs    

Official Product Page

   
Part No. PG2166 PG2161 PG2164 PG2163 PG2158 PG2162 PG2165 PG2152 PG2151 PG2155 PG2150 PG2153 PG2154
Description Photoflash Capacitor Chargers in ThinSOT; Package: SOT; No of Pins: 5; Temperature Range: -40°C to 125°C
TRANSISTOR | BJT | PNP | 70V V(BR)CEO | 5A I(C) | TO-5
TRANSISTOR | BJT | PNP | 50V V(BR)CEO | 5A I(C) | TO-5
1.2MHz White LED Step-Up Converters with Built-In Schottky in ThinSOT; Package: SOT; No of Pins: 6; Temperature Range: -40°C to 125°C
TRANSISTOR | BJT | PNP | 90V V(BR)CEO | 5A I(C) | TO-5

File Size 192.67K  /  1 Page

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Amphenol Communications Solutions

Part No. 86832-166HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 66 Positions, 2.54 mm Pitch, Vertical, 8.26 mm (0.325 in.) Mating, 2.54 mm (0.1 in.) Tail.
Tech specs    

Official Product Page

   
Part No. HYMD216646L6-K HYMD216646L6-H HYMD216646L6-L HYMD2166466-H HYMD2166466-K HYMD2166466-L
Description SDRAM|DDR|16MX64|CMOS|DIMM|184PIN|PLASTIC

File Size 245.50K  /  16 Page

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Amphenol Communications Solutions

Part No. 68692-166HLF
Description BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 66 Positions, 2.54 mm (0.100in) Pitch.
Tech specs    

Official Product Page

    HYNIX SEMICONDUCTOR INC
Part No. HYMD2166466 HYMD216646L6 HYMD2166466-H
Description 16Mx64|2.5V|K/H/L|x4|DDR SDRAM - Unbuffered DIMM 128MB
16M X 64 DDR DRAM MODULE, 0.75 ns, DMA184

File Size 215.77K  /  16 Page

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Amphenol Communications Solutions

Part No. RJE021660120H
Description Modular Jack - Right Angle, Input Output Connectors 6P6C, Shield, High Temperature.
Tech specs    

Official Product Page

    IRP2166 IR2166PBF IR2166S IRPLLNR4

IRF[International Rectifier]
Part No. IRP2166 IR2166PBF IR2166S IRPLLNR4
Description Universal Input Linear Fluorescent Ballast using the IR2166
PFC & BALLAST CONTROL IC
From old datasheet system

File Size 612.07K  /  32 Page

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Amphenol Communications Solutions

Part No. RJE021660410H
Description Modular Jack - Right Angle, Input Output Connectors 6P6C, Shield, High Temperature.
Tech specs    

Official Product Page

    MMDF2P01HD ON2166 MMDF2P01HDR2

MOTOROLA INC
Motorola, Inc
Part No. MMDF2P01HD ON2166 MMDF2P01HDR2
Description 2 A, 12 V, 0.2 ohm, 2 CHANNEL, P-CHANNEL, Si, POWER, MOSFET
DUAL TMOS POWER FET 2.0 AMPERES 12 VOLTS
From old datasheet system

File Size 283.97K  /  10 Page

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Amphenol Communications Solutions

Part No. RJE021660210
Description Modular Jack - Right Angle, Input Output Connectors 6P6C, Shield.
Tech specs    

Official Product Page

    THMY721661BEG-10 THMY721661BEG-80 THMY721661BEG

TOSHIBA[Toshiba Semiconductor]
Part No. THMY721661BEG-10 THMY721661BEG-80 THMY721661BEG
Description 16/777/216-WORD BY 72-BIT SYNCHRONOUS DRAM MODULE
16,777,216-WORD BY 72-BIT SYNCHRONOUS DRAM MODULE

File Size 648.18K  /  13 Page

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Amphenol Communications Solutions

Part No. RJE021660420
Description Modular Jack - Right Angle, Input Output Connectors 6P6C, Shield.
Tech specs    

Official Product Page

    Toshiba, Corp.
Part No. THMY721661BEG-80 THMY721661BEG-10
Description 16M Word x 72 Bit Synchronous DRAM Module(16M字x 72位同步DRAM模块) 1,600字72位同步DRAM模块,600字72位同步的DRAM模块

File Size 844.25K  /  13 Page

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Amphenol Communications Solutions

Part No. 68492-166HLF
Description BergStik®, Board to Board connector, Unshrouded Right Angled Header, Through Hole, Double Row, 66 Positions, 2.54 mm (0.100in)Pitch.
Tech specs    

Official Product Page

    HYMD216646C6J-D4 HYMD216646C6J-D43 HYMD216646C6J-J

Hynix Semiconductor
Part No. HYMD216646C6J-D4 HYMD216646C6J-D43 HYMD216646C6J-J
Description Unbuffered DDR SDRAM DIMM

File Size 165.54K  /  18 Page

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Amphenol Communications Solutions

Part No. 68602-166HLF
Description BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 66 Positions, 2.54 mm (0.100in)Pitch.
Tech specs    

Official Product Page

For 2166 Found Datasheets File :: 128+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | <8> | 9 | 10 | 11 | 12 | 13 |   

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Part: 216D4TCASB21S
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Pack: BGA
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