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T1007 53761 2700G UADT12 FSE0050 A3546 17446 LN9715S
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  1300.1HS Datasheet PDF File

For 1300.1HS Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | <8> | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

    1300

Nihon Dempa Kogyo
Part No. 1300
Description Crystal Clock Oscillators
File Size 44.15K  /  5 Page

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Rochester Electronics LLC
Part No. BLA1011-300
Description BLA1011-300 - 300W LDMOS Avionics Power Transistor
Tech specs 　 　

Official Product Page

HUA FENG CIRCUIT





    EPC-1300-1.0-4

EPIGAP optoelectronic GmbH
Part No. EPC-1300-1.0-4
Description Photodiode-Chip
File Size 122.52K  /  2 Page

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Toshiba Electronic Devices & Storage Corporation
Part No. XPN1300ANC
Description N-ch MOSFET, 100 V, 30 A, 0.0133 Ω@10V, TSON Advance(WF)
Tech specs 　 　

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    EPC-1300-0.22-1

EPIGAP optoelectronic GmbH
Part No. EPC-1300-0.22-1
Description Photodiode-Chip
File Size 121.66K  /  2 Page

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Amphenol Communications Solutions
Part No. 54112-801300800LF
Description BERGSTIK STACKING
Tech specs 　 　

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    EPC-1300-0.5-4

EPIGAP optoelectronic GmbH
Part No. EPC-1300-0.5-4
Description Photodiode-Chip
File Size 122.82K  /  2 Page

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Amphenol Communications Solutions
Part No. 92813-007LF
Description Minitek® 2.00mm, Board to Board, Unshrouded Vertical Stacking Header, Surface Mount, Double Row, 40 Positions, 2.00mm (0.079in) Pitch..
Tech specs 　 　

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    EPC-1300-0.22-2

EPIGAP optoelectronic GmbH
Part No. EPC-1300-0.22-2
Description Photodiode-Chip
File Size 122.66K  /  2 Page

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Amphenol Communications Solutions
Part No. 92813-005LF
Description Minitek® 2.00mm, Board to Board, Unshrouded Vertical Stacking Header, Surface Mount, Double Row, 16 Positions, 2.00mm (0.079in) Pitch..
Tech specs 　 　

Official Product Page

    EPD-1300-5-0.2

EPIGAP optoelectronic GmbH
Part No. EPD-1300-5-0.2
Description Photodiode
File Size 44.59K  /  2 Page

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Amphenol Communications Solutions
Part No. 10061913-003CLF
Description PCI Express® GEN 3 Card Edge, Storage and Server Connector, Vertical, Surface Mount, x16, 164 Positions, 1.00mm (0.039in) Pitch
Tech specs 　 　

Official Product Page

    EPC-1300-0.22-3

EPIGAP optoelectronic GmbH
Part No. EPC-1300-0.22-3
Description Photodiode-Chip
File Size 121.53K  /  2 Page

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Amphenol Communications Solutions
Part No. 54121-112021300LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Single Row, 2 Positions, 2.54mm (0.100in) Pitch.
Tech specs 　 　

Official Product Page

    EPC-1300-0.5-3

EPIGAP optoelectronic GmbH
Part No. EPC-1300-0.5-3
Description Photodiode-Chip
File Size 121.96K  /  2 Page

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Amphenol Communications Solutions
Part No. 54121-407031300LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Single Row, 3 Positions, 2.54mm (0.100in) Pitch.
Tech specs 　 　

Official Product Page

    EPC-1300-0.22-4

EPIGAP optoelectronic GmbH
Part No. EPC-1300-0.22-4
Description Photodiode-Chip
File Size 121.80K  /  2 Page

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Amphenol Communications Solutions
Part No. 75188-130-03LF
Description BergStik® 2.54mm, Board To Board Connector, Unshrouded Vertical header, Through Hole, Single Row, 3 Positions, 5.08mm (0.200in) Pitch.
Tech specs 　 　

Official Product Page

    EPC-1300-0.5-2

EPIGAP optoelectronic GmbH
Part No. EPC-1300-0.5-2
Description Photodiode-Chip
File Size 122.90K  /  2 Page

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Amphenol Communications Solutions
Part No. 54121-808121300LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Single Row, 12 Positions, 2.54mm (0.100in) Pitch.
Tech specs 　 　

Official Product Page

For 1300.1HS Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | <8> | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

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