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  0736 Datasheet PDF File

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    0736231001

Molex Electronics Ltd.
Part No. 0736231001
Description 1.91mm (.075) Pitch Quick Twist/Retarded Pin Plug Insert Mold for EVC Cable, 10Circuit

File Size 106.87K  /  2 Page

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Amphenol Communications Solutions

Part No. 54121-107361150LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Single Row, 36 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    0736560190 73656-0190

Molex Electronics Ltd.
Part No. 0736560190 73656-0190
Description 2.00mm (.079) Pitch HDM? Board-to-Board Backplane Power Module, Vertical, SMC,Power Receptacle, 1 Circuits, Gold (Au) 0.76μm (30μ)

File Size 104.05K  /  3 Page

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Amphenol Communications Solutions

Part No. 54112-807361000LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 36 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    0736441016

Molex Electronics Ltd.
Part No. 0736441016
Description 2.00mm (.079) Pitch HDM Board-to-Board Backplane Header, Vertical, SMC, Press- Fit, Guide Post Location B

File Size 243.44K  /  5 Page

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Amphenol Communications Solutions

Part No. 54121-107360950LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Single Row, 36 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    0736441009

Molex Electronics Ltd.
Part No. 0736441009
Description 2.00mm (.079) Pitch HDM? Board-to-Board Backplane Header, Vertical, SMC, Press-Fit, Guide Post Location A, Polarizing Key Position E, 144 Circuits

File Size 167.28K  /  4 Page

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Amphenol Communications Solutions

Part No. 75160-107-36LF
Description BergStik®, Board to Board connector, Unshrouded vertical header, through hole, single Row,36 position, 2.54mm pitch
Tech specs    

Official Product Page

    0736441008

Molex Electronics Ltd.
Part No. 0736441008
Description 2.00mm (.079) Pitch HDM? Board-to-Board Backplane Header, Vertical, SMC, PressFit, Guide Post Location B, Polarizing Key Position E, 144 Circuits

File Size 167.28K  /  4 Page

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Amphenol Communications Solutions

Part No. 75168-107-36LF
Description BergStik®, Board to Board connector, Unshrouded Right Angled header, Through Hole, Single Row, 36 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    0736441011

Molex Electronics Ltd.
Part No. 0736441011
Description 2.00mm (.079) Pitch HDM? Board-to-Board Backplane Header, Vertical, SMC, Press-Fit, Guide Post Location A, Polarizing Key Position F, 144 Circuits

File Size 159.58K  /  4 Page

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Amphenol Communications Solutions

Part No. 54122-107361150LF
Description BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 36 position, 2.54mm (0.100in) pitch
Tech specs    

Official Product Page

    0736441012

Molex Electronics Ltd.
Part No. 0736441012
Description 2.00mm (.079) Pitch HDM? Board-to-Board Backplane Header, Vertical, SMC, PressFit, Guide Post Location B, Polarizing Key Position G, 144 Circuits

File Size 167.28K  /  4 Page

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Amphenol Communications Solutions

Part No. 77315-807-36LF
Description BergStik®, Board to Board connector, Unshrouded Right Angled Header, Through Hole, Single Row, 36 Positions, 2.54 mm Pitch.
Tech specs    

Official Product Page

    0736441018

Molex Electronics Ltd.
Part No. 0736441018
Description 2.00mm (.079) Pitch HDM? Board-to-Board Backplane Header, Vertical, SMC, PressFit, Guide Post Location N/A, Polarizing Key Position N/A, 144 Circuits

File Size 167.28K  /  4 Page

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Amphenol Communications Solutions

Part No. 54121-107360800LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Single Row, 36 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    0736441004

Molex Electronics Ltd.
Part No. 0736441004
Description 2.00mm (.079) Pitch HDM? Board-to-Board Backplane Header, Vertical, SMC, PressFit, Guide Post Location B, Polarizing Key Position C, 144 Circuits

File Size 167.28K  /  4 Page

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Amphenol Communications Solutions

Part No. 54122-807361150LF
Description BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 36 position, 2.54mm (0.100in) pitch
Tech specs    

Official Product Page

    73656-5001 0736565001

Molex Electronics Ltd.
Part No. 73656-5001 0736565001
Description 2.00mm (.079) Pitch HDM? Board-to-Board Backplane Power Module, Vertical, SMCPower Receptacle, 3 Circuits, Gold (Au) 0.76μm (30μ)

File Size 391.50K  /  7 Page

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Amphenol Communications Solutions

Part No. 54121-407360940LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Single Row, 36 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

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