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  0032.1162 Datasheet PDF File

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    42225-0032

Molex Electronics Ltd.
Part No. 42225-0032
Description 2.54mm (.100) Pitch KK? Header, Breakaway, Vertical, with Polarizing Wall, 32 Circuits, Tin (Sn) Plating
File Size 190.41K  /  8 Page

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Rochester Electronics LLC
Part No. 100324/VYA
Description 100324 - TTL to ECL Translator, 6 Func, Complementary Output, ECL - Dual marked (5962-9153001VYA)
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HUA FENG CIRCUIT





    CONEXANT[Conexant Systems, Inc]
Part No. AR-20441-11 AR-11627 AR-P48 AR-20431 AR-20441-12
Description AccessRunner ADSL Modem Device Set for PCI Applications
File Size 153.14K  /  24 Page

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Toshiba Electronic Devices & Storage Corporation
Part No. 2SA1162
Description PNP Bipolar Transistor / VCEO=-50 V / IC=-0.15 A / hFE=70~400 / VCE(sat)=-0.3 V / AEC-Q101 / SOT-346
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    2SC1162 2SC1162-2014

Quanzhou Jinmei Electro...
Quanzhou Jinmei Electronic Co.,Ltd.
Part No. 2SC1162 2SC1162-2014
Description Silicon NPN Power Transistors
File Size 63.36K  /  4 Page

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Amphenol Communications Solutions
Part No. 79821-162HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 62 Positions, 2.54 mm Pitch, Vertical, 10.92 mm (0.43 in.) Mating, 5.08 mm (0.2 in.) Tail.
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    2SB1162 2SB1162-2014

Quanzhou Jinmei Electronic Co.,Ltd.
Quanzhou Jinmei Electronic ...
Part No. 2SB1162 2SB1162-2014
Description Silicon PNP Power Transistors
File Size 43.16K  /  3 Page

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Amphenol Communications Solutions
Part No. 131-5116-21D
Description Paladin® 112Gb/s Backplane Connector, 5-Pair, 6 Column, Open Wall, Backplane Module, 2.25mm Wipe, Nickel Sulfamate.
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    13-000321

CONEC Elektronische Bauelemente GmbH
Part No. 13-000321
Description HIGH POWER CONTACT FEMALE
File Size 200.57K  /  1 Page

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Amphenol Communications Solutions
Part No. 131-4116-21H
Description Paladin® 112Gb/s Backplane Connector, 4-Pair, 6 Column, Open Wall, Backplane Module, 2.25mm Wipe, APP.
Tech specs 　 　

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    CH20-0032-17G-RTR CH20-0032-17G-TR CH20-0032-17G1

Tyco Electronics
Part No. CH20-0032-17G-RTR CH20-0032-17G-TR CH20-0032-17G1
Description Low Cost SMT 17dB Bi-Directional Coupler, 824-960 MHz
File Size 234.38K  /  2 Page

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Amphenol Communications Solutions
Part No. 77311-162-36LF
Description BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Single Row, 36 Positions, 2.54 mm Pitch.
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Part No. 031-0021-0001 032-0032-0001
Description PANEL MOUNT, CABLE TERMINATED, FEMALE, RF CONNECTOR, SOLDER, RECEPTACLE
CABLE TERMINATED, MALE, RF CONNECTOR, SOLDER, PLUG
File Size 71.60K  /  3 Page

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Amphenol Communications Solutions
Part No. 10127721-162GLF
Description Minitek® Pwr 3.0, Dual Row, Vertical Through Hole Header, 16 Position, 3.2mm Kink Tail (Gold Flash) plating, GW Compatible LCP, Black Color,Tray Packing.
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    2SK1161 2SK1162

Hitachi Semiconductor
Part No. 2SK1161 2SK1162
Description Silicon N Channel MOS FET
Silicon N-Channel MOS FET
File Size 33.64K  /  6 Page

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Amphenol Communications Solutions
Part No. 75168-116-20LF
Description BergStik®, Board to Board connector, Unshrouded Right Angled header, Through Hole, Single Row, 20 Positions, 2.54mm (0.100in) Pitch.
Tech specs 　 　

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    2SK1161-E 2SK1161 2SK1162 2SK1162-E

Renesas Electronics Corporation
Part No. 2SK1161-E 2SK1161 2SK1162 2SK1162-E
Description Silicon N Channel MOS FET
File Size 78.00K  /  7 Page

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Amphenol Communications Solutions
Part No. 54242-811162350LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Surface Mount, Double Row, 16 Positions, 2.54mm (0.100in) Pitch.
Tech specs 　 　

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    A-70400-0142 14-60-0032

Molex Electronics Ltd.
Part No. A-70400-0142 14-60-0032
Description 2.54mm (.100) Pitch SL Insulation Displacement Connector Assembly, Female,Single Row, Version G, Positive Lock, Wire Size 24, 3.81μm (150μ) Tin/Lead (SnPb)
File Size 162.74K  /  3 Page

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Amphenol Communications Solutions
Part No. 131-3116-21D
Description Paladin® 112Gb/s Backplane Connector, 3-Pair, 6 Column, Open Wall, Backplane Module, 2.25mm Wipe, Nickel Sulfamate.
Tech specs 　 　

Official Product Page

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