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Ramtron International Corp.
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Part No. |
FM18L08
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OCR Text |
...iques and a board wash using no water. 2. Humidity A typical battery-backed SRAM module is qualified at 60 C, 90% Rh, but under no bias and no pressure. These conditions are chosen because multicomponent assemblies are vulnerable to moistur... |
Description |
256Kb Bytewide FRAM Memory(256Kb宽字节FRAM存储 From old datasheet system
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File Size |
80.39K /
12 Page |
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Fairchild Semiconductor Corporation FAIRCHILD[Fairchild Semiconductor]
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Part No. |
RMPA0963
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OCR Text |
...rly dried to remove solvents or water residues. * Static Sensitivity: Follow ESD precautions to protect against ESD damage: * A properly gro...resistant solder joint. The illustration below indicates the recommended soldering profile. * Solder... |
Description |
Cellular CDMA, CDMA2000-1X and WCDMA Power Amplifier Module From old datasheet system
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File Size |
117.92K /
7 Page |
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it Online |
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FAIRCHILD[Fairchild Semiconductor]
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Part No. |
RMPA5255
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OCR Text |
...rly dried to remove solvents or water residues. * Static Sensitivity: Follow ESD precautions to protect against ESD damage: - A properly gro...resistant solder joint. The illustration below indicates the recommended soldering profile. Solder J... |
Description |
From old datasheet system 4.9-5.9 GHz WLAN Linear Power Amplifier Module
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File Size |
779.24K /
7 Page |
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it Online |
Download Datasheet |
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Price and Availability
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