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test formation Datasheet PDF File

For test formation Found Datasheets File :: 3435 Search Time::1.625ms
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				BOURNS[Bourns Electronic Solutions]
Part No.	2DAA-F6RLF 2DAA-F6R
OCR Text	...15 KV Air Discharge per the ESD test method specified in IEC 61000-4-2. The device measures 1.00 mm x 1.50 mm and is available in a 6 bump F...formation. The grid pitch is 0.5 mm and the dimensions for the packaged device are shown below. 0.4...
Description	Integrated Passive & Active Device
File Size	222.37K / 4 Page	View it Online	Download Datasheet

				BOURNS[Bourns Electronic Solutions]
Part No.	2DAB-F6RLF 2DAB-F6R
OCR Text	...15 KV Air Discharge per the ESD test method specified in IEC 61000-4-2. The device measures 1.00 mm x 1.50 mm and is available in a 6 bump F...formation. The grid pitch is 0.5 mm and the dimensions for the packaged device are shown below. 0.4...
Description	Integrated Passive & Active Device
File Size	222.58K / 4 Page	View it Online	Download Datasheet

				Bourns Electronic Solutions
Part No.	2DAC-C16R 2DAC-C16RLF
OCR Text	... typical thermal cycle and bend test specifications without the use of an underfill material. SOLDER BUMPS SILICON DIE Figure 1 - CSP ...formation. The grid pitch is 0.5 mm. The dimensions for the CSP packaged device are shown in Fig. 2 ...
Description	Integrated Passive & Active Device using CSP
File Size	232.59K / 4 Page	View it Online	Download Datasheet

				BOURNS[Bourns Electronic Solutions]
Part No.	2DAD-C5RLF 2DAD-C5R
OCR Text	...15 KV Air Discharge per the ESD test method specified in IEC 61000-4-2. The device measures 1.00 mm x 1.33 mm and is available in a 5 bump C...formation. The grid pitch is 0.5 mm and the dimensions for the packaged device are shown below. 0.4...
Description	Integrated Passive & Active Device using CSP
File Size	213.15K / 4 Page	View it Online	Download Datasheet

				Bourns, Inc. BOURNS[Bourns Electronic Solutions]
Part No.	2FAD-C20R 2FAD-C20RLF
OCR Text	... typical thermal cycle and bend test specifications without the use of an underfill material. SOLDER BUMPS SILICON DIE Figure 1 - CSP ...formation. The grid pitch is 0.5 mm and the dimensions for the CSP packaged device are shown in Fig....
Description	Integrated Passive & Active Device using CSP
File Size	240.05K / 4 Page	View it Online	Download Datasheet

				BOURNS[Bourns Electronic Solutions] Bourns, Inc.
Part No.	2FAE-C15R 2FAE-C15RLF
OCR Text	...15 KV Air Discharge per the ESD test method specified in IEC 61000-4-2. The device measures 1.33 mm x 2.96 mm and is available in a 15 bump ...formation. The grid pitch is 0.5 mm and the dimensions for the packaged device are shown below. 2.9...
Description	Integrated Passive & Active Device using CSP
File Size	219.15K / 4 Page	View it Online	Download Datasheet

				Bourns, Inc. BOURNS[Bourns Electronic Solutions]
Part No.	2FAG-C15RLF 2FAG-C15R
OCR Text	...15 KV Air Discharge per the ESD test method specified in IEC 61000-4-2. The device measures 1.33 mm x 2.96 mm and is available in a 15 bump ...formation. The grid pitch is 0.5 mm and the dimensions for the packaged device are shown below. 2.9...
Description	Integrated Passive & Active Device using CSP
File Size	241.38K / 4 Page	View it Online	Download Datasheet

				Bourns, Inc. BOURNS[Bourns Electronic Solutions]
Part No.	2FAK-C15R 2FAK-C15RLF
OCR Text	...15 KV Air Discharge per the ESD test method specified in IEC 61000-4-2. The device measures 1.33 mm x 2.96 mm and is available in a 15 bump ...formation. The grid pitch is 0.5 mm and the dimensions for the packaged device are shown below. 0.4...
Description	Integrated Passive & Active Device using CSP
File Size	218.89K / 4 Page	View it Online	Download Datasheet

				Bourns, Inc. BOURNS[Bourns Electronic Solutions]
Part No.	2FAM-C5RLF 2FAM-C5R
OCR Text	...15 KV Air Discharge per the ESD test method specified in IEC 61000-4-2. The device measures 1.00 mm x 1.33 mm and is available in a 5 bump C...formation. The grid pitch is 0.5 mm and the dimensions for the packaged device are shown below. 0.4...
Description	Integrated Passive & Active Device using CSP
File Size	235.85K / 4 Page	View it Online	Download Datasheet

				http:// Bourns Electronic Solutions Bourns, Inc.
Part No.	2FAN-C5R 2FAN-C5RLF
OCR Text	...15 KV Air Discharge per the ESD test method specified in IEC 61000-4-2. The device measures 1.00 mm x 1.33 mm and is available in a 5 bump C...formation. The grid pitch is 0.5 mm and the dimensions for the packaged device are shown below. 0.4...
Description	Integrated Passive & Active Device using CSP
File Size	240.61K / 4 Page	View it Online	Download Datasheet

For test formation Found Datasheets File :: 3435 Search Time::1.625ms
Page :: | 1 | 2 | 3 | 4 | 5 | 6 | <7> | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |