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ML60124R HMC412 45800 300A1 20IND 300A1 40MHZ EH1100TS
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For properties Found Datasheets File :: 14208    Search Time::2.188ms    
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    Wurth Elektronik GmbH &...
Part No. 7448990220
OCR Text ...rn: [mm] scale - 3:1 schematic: properties test conditions value unit tol. inductance 1 100 khz/ 100 mv l 1 22 h 20% inductance 2 100 khz/ 100 mv l 2 22 h 20% rated current 1 t = 40 k i r 1 3.4 a max. rated current 2 t = 40 k i r 2 3.4 a ma...
Description WE-MCRI SMD Molded Coupled Inductor

File Size 378.55K  /  5 Page

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    Ledil, Inc.
Part No. C10449
OCR Text ...date updated 22/11/2013 optical properties viewing light effi- led angle beam ciency cd/lm connector golden dragon+ 71 deg wide 89 % 0.550 - january 31st 2018 2:14 copyright ledil oy - subject to change without prior notice - page 1/...
Description Tina Lens

File Size 237.44K  /  4 Page

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    315-11-115-41-003000

Mill-Max Mfg. Corp.
Part No. 315-11-115-41-003000
OCR Text ...172 (uns c17200) per astm b 194 properties?of?beryllium?copper: chemical composition: cu 98.1%, be 1.9% temper as stamped: td01 properties after heat treatment (th01): hardness: 36-43 rockwell c mechanical life: 1000 cycles min. density: ....
Description Interconnect Socket Low Profile Solder Tail Socket

File Size 117.57K  /  3 Page

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    315-11-115-41-001000

Mill-Max Mfg. Corp.
Part No. 315-11-115-41-001000
OCR Text ...172 (uns c17200) per astm b 194 properties?of?beryllium?copper: chemical composition: cu 98.1%, be 1.9% temper as stamped: td01 properties after heat treatment (th01): hardness: 36-43 rockwell c mechanical life: 1000 cycles min. density: ....
Description Interconnect Socket Low Profile Solder Tail Socket

File Size 117.38K  /  3 Page

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    MC88915 MC88915FN55 MC88915FN55PLCC MC88915FN70PLCC MC88915FN70

MOTOROLA[Motorola Inc]
MOTOROLA[Motorola, Inc]
Part No. MC88915 MC88915FN55 MC88915FN55PLCC MC88915FN70PLCC MC88915FN70
OCR Text ... fabricated with key transistor properties intentionally varied to create a 14 cell designed experimental matrix. IC performance was characterized over a range of transistor properties (represented by the 14 cells) in excess of the expected...
Description Low Skew CMOS PLL Clock Driver

File Size 145.50K  /  13 Page

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    315-11-114-41-003000

Mill-Max Mfg. Corp.
Part No. 315-11-114-41-003000
OCR Text ...172 (uns c17200) per astm b 194 properties?of?beryllium?copper: chemical composition: cu 98.1%, be 1.9% temper as stamped: td01 properties after heat treatment (th01): hardness: 36-43 rockwell c mechanical life: 1000 cycles min. density: ....
Description Interconnect Socket Low Profile Solder Tail Socket

File Size 117.28K  /  3 Page

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    STKM2000 STKM2000SERIES

STMicroelectronics
Part No. STKM2000 STKM2000SERIES
OCR Text ...f functions. Defining only some properties, the designer is able to create himself the cells needed for his application. For example, the following electrical parameters are accessible and adjustable: q q q q q q q q very high speed NPN...
Description 2 m/2 POLY/2 METAL BiCMOS MIXED ANALOG-DIGITAL STANDARD CELLS
2 u/2 POLY/2 METAL BiCMOS MIXED ANALOG-DIGITAL STANDARD CELLS

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    315-11-113-41-003000

Mill-Max Mfg. Corp.
Part No. 315-11-113-41-003000
OCR Text ...172 (uns c17200) per astm b 194 properties?of?beryllium?copper: chemical composition: cu 98.1%, be 1.9% temper as stamped: td01 properties after heat treatment (th01): hardness: 36-43 rockwell c mechanical life: 1000 cycles min. density: ....
Description Interconnect Socket Low Profile Solder Tail Socket

File Size 117.57K  /  3 Page

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    315-11-113-41-001000

Mill-Max Mfg. Corp.
Part No. 315-11-113-41-001000
OCR Text ...172 (uns c17200) per astm b 194 properties?of?beryllium?copper: chemical composition: cu 98.1%, be 1.9% temper as stamped: td01 properties after heat treatment (th01): hardness: 36-43 rockwell c mechanical life: 1000 cycles min. density: ....
Description Interconnect Socket Low Profile Solder Tail Socket

File Size 117.38K  /  3 Page

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    315-11-112-41-003000

Mill-Max Mfg. Corp.
Part No. 315-11-112-41-003000
OCR Text ...172 (uns c17200) per astm b 194 properties?of?beryllium?copper: chemical composition: cu 98.1%, be 1.9% temper as stamped: td01 properties after heat treatment (th01): hardness: 36-43 rockwell c mechanical life: 1000 cycles min. density: ....
Description Interconnect Socket Low Profile Solder Tail Socket

File Size 117.57K  /  3 Page

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For properties Found Datasheets File :: 14208    Search Time::2.188ms    
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