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  MADP-030015-1314 Datasheet PDF File

For MADP-030015-1314 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | <7> | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

    EIM1314-5

Excelics Semiconductor, Inc.
Part No. EIM1314-5
Description 13.75-14.50GHz Multi-Stage Power Amplifier

File Size 208.72K  /  3 Page

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Amphenol Communications Solutions

Part No. 131-4114-11D
Description Paladin® 112Gb/s Backplane Connector, 4-Pair, 4 Column, Open Wall, Backplane Module, 1.5mm Wipe, Nickel Sulfamate.
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    HA13143

Hitachi Semiconductor
Part No. HA13143
Description Four-Channel BTL Driver for CD Players

File Size 41.43K  /  7 Page

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Amphenol Communications Solutions

Part No. 131-4416-11D
Description Paladin® 112Gb/s Backplane Connector, 4-Pair, 6 Column, Right End Wall, Backplane Module, 1.5mm Wipe, Nickel Sulfamate.
Tech specs    

Official Product Page

    Sony, Corp.
Part No. HV1314P
Description Interface IC 接口IC

File Size 139.39K  /  5 Page

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Amphenol Communications Solutions

Part No. 131-4118-11H
Description Paladin® 112Gb/s Backplane Connector, 4-Pair, 8 Column, Open Wall, Backplane Module, 1.5mm Wipe, APP.
Tech specs    

Official Product Page

    FUJITSU LTD
Part No. FLM1314-3F
Description KU BAND, GaAs, N-CHANNEL, RF POWER, JFET

File Size 134.17K  /  4 Page

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Amphenol Communications Solutions

Part No. 131-4514-11H
Description Paladin® 112Gb/s Backplane Connector, 4-Pair, 4 Column, Left Polarized, Backplane Module, 1.5mm Wipe, APP.
Tech specs    

Official Product Page

    M/A-COM Technology Solu...
Part No. MADP042008 MADP042008-15
Description SURMOUNTTM 8μM PIN Diodes
SURMOUNT 8μM PIN Diodes

File Size 645.18K  /  4 Page

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Amphenol Communications Solutions

Part No. 131-4216-21D
Description Paladin® 112Gb/s Backplane Connector, 4-Pair, 6 Column, Double End Wall, Backplane Module, 2.25mm Wipe, Nickel Sulfamate.
Tech specs    

Official Product Page

    M/A-COM Technology Solu...
Part No. MADP042005 MADP042005-15
Description SURMOUNTTM PIN Diodes
SURMOUNT PIN Diodes

File Size 128.41K  /  4 Page

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Amphenol Communications Solutions

Part No. 131-4518-21D
Description Paladin® 112Gb/s Backplane Connector, 4-Pair, 8 Column, Left Polarized, Backplane Module, 2.25mm Wipe, Nickel Sulfamate.
Tech specs    

Official Product Page

    FLM1314-12F

Eudyna Devices Inc
Part No. FLM1314-12F
Description X, Ku-Band Internally Matched FET

File Size 303.83K  /  4 Page

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Amphenol Communications Solutions

Part No. 131-4314-21H
Description Paladin® 112Gb/s Backplane Connector, 4-Pair, 4 Column, Left End Wall, Backplane Module, 2.25mm Wipe, APP.
Tech specs    

Official Product Page

    TOSHIBA[Toshiba Semiconductor]
Part No. TIM1314-30L
Description MICROWAVE POWER GaAs FET

File Size 38.03K  /  2 Page

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Amphenol Communications Solutions

Part No. 131-4616-21H
Description Paladin® 112Gb/s Backplane Connector, 4-Pair, 6 Column, Right Polarized, Backplane Module, 2.25mm Wipe, APP.
Tech specs    

Official Product Page

    TGI1314-50L

Toshiba Semiconductor
Part No. TGI1314-50L
Description MICROWAVE POWER GaN HEMT

File Size 90.01K  /  2 Page

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Amphenol Communications Solutions

Part No. 131-4316-11D
Description Paladin® 112Gb/s Backplane Connector, 4-Pair, 6 Column, Left End Wall, Backplane Module, 1.5mm Wipe, Nickel Sulfamate.
Tech specs    

Official Product Page

    KLT-131451S

KODENSHI KOREA CORP.
Part No. KLT-131451S
Description 1310nm InGaAsP strained MQW for FP-LD 1.5mm ball lens TO CAN

File Size 161.22K  /  2 Page

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Amphenol Communications Solutions

Part No. 131-4618-11D
Description Paladin® 112Gb/s Backplane Connector, 4-Pair, 8 Column, Right Polarized, Backplane Module, 1.5mm Wipe, Nickel Sulfamate.
Tech specs    

Official Product Page

For MADP-030015-1314 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | <7> | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

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