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ZARLINK[Zarlink Semiconductor Inc]
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| Part No. |
ZL60304_07 ZL60304 ZL60304MLDC ZL60304MMDC
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| OCR Text |
...erver Clusters, Super-computing interconnections InfiniBand 4x-SX compliant Fibre Channel connections XAUI based interconnections Proprietary backplanes Interconnects rack-to-rack, shelf-to-shelf, board-to-board, board-to-optical backplane
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| Description |
Parallel Fiber Optic Transceiver Parallel Fiber Optic Transceiver
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| File Size |
269.36K /
6 Page |
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it Online |
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EXAR[Exar Corporation]
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| Part No. |
XR16L570_07 XR16L570 XR16L570IL24 XR16L570IL32
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| OCR Text |
...RE 3. XR16L570 TYPICAL DATA BUS interconnections
D0 D1 D2 D3 D4 D5 D6 D7 A0 A1 A2 IOR# IOW# UART_CS# UART_INT UART_RESET
D0 D1 D2 D3 D4 D5 D6 D7 A0 A1 A2 IOR# IOW# CS# INT RESET
VCC
VCC
TX RX RTS# CTS# Serial Interface of RS-... |
| Description |
SMALLEST 1.62V TO 5.5V UART WITH 16-BYTE FIFO AND POWERSAVE
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| File Size |
320.92K /
47 Page |
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it Online |
Download Datasheet |
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Vishay Intertechnology,Inc.
VISAY[Vishay Siliconix]
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| Part No. |
VESD05C-FC1
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| OCR Text |
...s a chip with all packaging and interconnections manufactured on the wafer prior to dicing. The interconnections are made of solder bumps on i/o pads.Our device utilizes a silicon P/N junction for excellent clamping (protection) performance... |
| Description |
Bidirectional ESD protection diodes
in flip-chip 1005 size;
Flip Chip Protection Diode - Chip Size 0402
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| File Size |
130.34K /
5 Page |
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it Online |
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SIPEX[Sipex Corporation]
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| Part No. |
SP7512KN HS7512 SP7512BN
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| OCR Text |
...ar Operation Figure 1 shows the interconnections for unipolar operation. Connect IO1 and FB1 as shown in diagram. Tie IO2 (Pin 7), FB3 (Pin 3), and FB4 (Pin 1) to Ground (Pin 8). To maintain specified linearity, external amplifiers must be ... |
| Description |
Double-Buffered 12-Bit Multiplying DAC
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| File Size |
86.22K /
6 Page |
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it Online |
Download Datasheet |
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OKI[OKI electronic componets]
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| Part No. |
KGL4201
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| OCR Text |
.... Gold-based, three-level metal interconnections are used for high density and shorter wiring paths. Layers 1 and 2 are signal lines. Layer 3, which is formed by electroplating, is used for ground or power supply lines because of its lower ... |
| Description |
10-Gbps GaAs Family High-Speed Optical Communications System
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| File Size |
296.16K /
24 Page |
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it Online |
Download Datasheet |
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OKI electronic componet...
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| Part No. |
KGL4201
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| OCR Text |
.... gold-based, three-level metal interconnections are used for high density and shorter wiring paths. layers 1 and 2 are signal lines. layer 3, which is formed by electroplating, is used for ground or power supply lines because of its lower ... |
| Description |
10-Gbps GaAs Family High-Speed Optical Communications System
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| File Size |
300.93K /
24 Page |
View
it Online |
Download Datasheet |
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Price and Availability
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