| |
|
 |
Seoul Semicondutctor, Inc.
SEOUL[Seoul Semiconductor]
http://
|
| Part No. |
SSC-Z16B
|
| OCR Text |
...
(1) Lead Solder -Preliminary heating to be at 150max. for 2 minutes max. -Soldering heat to be at 240max. for 5 seconds max.
LED Surface...cooling: -5C/sec.
120
0 60 to 120 sec. 5sec. max
(2) Lead-Free Solder -Preliminary heating ... |
| Description |
CHIP LED DEVICE 芯片发光器件
|
| File Size |
634.90K /
7 Page |
 View
it Online |
Download Datasheet
|
| |
|
|
Seoul Semicondutctor, Inc.
SEOUL[Seoul Semiconductor]
http://
|
| Part No. |
SSC-YGHR411-H
|
| OCR Text |
...le (1) Lead Solder -Preliminary heating to be at 150max. for 2 minutes max. -Soldering heat to be at 240max. for 5 seconds max.
LED Surface...cooling: -5C/sec.
120
0 60 to 120 sec. 5sec. max
(2) Lead Free Solder -Preliminary heating ... |
| Description |
CHIP LED DEVICE DUAL COLOR LED, RED/YELLOW GREEN, 1.5 mm
|
| File Size |
425.68K /
7 Page |
View
it Online |
Download Datasheet |
| |
|
|
Seoul Semicondutctor, Inc.
SEOUL[Seoul Semiconductor]
|
| Part No. |
SSC-YGFR411-H
|
| OCR Text |
...le (1) Lead Solder -Preliminary heating to be at 150max. for 2 minutes max. -Soldering heat to be at 240max. for 5 seconds max.
LED Surface...cooling: -5C/sec.
120
0 60 to 120 sec. 5sec. max
(2) Lead Free Solder -Preliminary heating ... |
| Description |
CHIP LED DEVICE DUAL COLOR LED, RED/YELLOW GREEN, 1.5 mm
|
| File Size |
400.92K /
7 Page |
View
it Online |
Download Datasheet |
| |
|
|
http://
SEOUL[Seoul Semiconductor]
|
| Part No. |
SSC-YG104
|
| OCR Text |
...
(1) Lead Solder -Preliminary heating to be at 150max. for 2 minutes max. -Soldering heat to be at 240max. for 5 seconds max.
LED Surface...cooling: -5C/sec.
120
0 60 to 120 sec. 5sec. max
(2) Lead-Free Solder -Preliminary heating ... |
| Description |
CHIP LED DEVICE
|
| File Size |
313.04K /
7 Page |
View
it Online |
Download Datasheet |
| |
|
|
Seoul Semicondutctor Inc.
SEOUL[Seoul Semiconductor]
|
| Part No. |
SSC-YG104-IC1
|
| OCR Text |
...onditions / Profile Preliminary heating to be at 150max. for 2 minutes max. Soldering heat to be at 220max. for 5 seconds max.
LED Surface ...cooling: -5C/sec.
120
0 60 to 120 sec. 5sec. max
(2) Reflow Soldering Conditions /Lead-Free... |
| Description |
CHIP LED DEVICE
|
| File Size |
313.59K /
7 Page |
View
it Online |
Download Datasheet |
| |
|
|
http://
SEOUL[Seoul Semiconductor]
|
| Part No. |
SSC-YG101
|
| OCR Text |
...
(1) Lead Solder -Preliminary heating to be at 150max. for 2 minutes max. -Soldering heat to be at 240max. for 5 seconds max.
LED Surface...cooling: -5C/sec.
120
0 60 to 120 sec. 5sec. max
(2) Lead-Free Solder -Preliminary heating ... |
| Description |
CHIP LED DEVICE
|
| File Size |
314.52K /
7 Page |
View
it Online |
Download Datasheet |
|
Price and Availability
|
