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ProTek Devices Microsemi, Corp.
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| Part No. |
PIP208 PIP8.4H2 PHP8.4H2 PIP208H1 PHP8.4H1 PIP8.4H3 PIP120H1 PHP30 PIP208H3 PIP208H2 PHP500H3
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| Description |
15000 W, UNIDIRECTIONAL, SILICON, TVS DIODE PLASTIC, PIP, 2 PIN 7500 W, UNIDIRECTIONAL, SILICON, TVS DIODE PLASTIC, PIP, 2 PIN 7500 W, UNIDIRECTIONAL, SILICON, TVS DIODE HERMETIC SEALED, GLASS, PHP, 2 PIN
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| File Size |
282.67K /
5 Page |
View
it Online |
Download Datasheet
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Toshiba Electronic Devices & Storage Corporation |
| Part No. |
TRS20H120H
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| Description |
SiC Schottky Barrier Diode (SBD), 1200 V, 20 A, TO-247-2L
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
10127403-20H1400LF
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| Description |
PwrBlade® ULTRA Connector System, Power Connectors, Receptacle, 4HP+12S Vertical Through Hole
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| Tech specs |
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Official Product Page
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Microsemi, Corp. White Electronic Designs, Corp.
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| Part No. |
WE128K32-XH1X WE128K32-XG2TX WE128K32NP-200H1Q WE128K32NP-120H1Q WE128K32NP-150H1Q WE128K32NP-140H1Q WE128K32NP-140H1QA WE128K32NP-200H1QA WE128K32NP-250H1Q WE128K32NP-150H1QA WE128K32NP-120H1QA
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| Description |
EEPROM MCP 128K X 32 EEPROM 5V MODULE, 200 ns, CPGA66 1.075 X 1.075 INCH, HERMETIC SEALED, CERAMIC, HIP-66 128K X 32 EEPROM 5V MODULE, 120 ns, CPGA66 1.075 x 1.075 INCH, HERMETIC SEALED, CERAMIC, HIP-66 128K X 32 EEPROM 5V MODULE, 150 ns, CPGA66 1.075 X 1.075 INCH, HERMETIC SEALED, CERAMIC, HIP-66 128K X 32 EEPROM 5V MODULE, 140 ns, CPGA66 1.075 X 1.075 INCH, HERMETIC SEALED, CERAMIC, HIP-66 128K X 32 EEPROM 5V MODULE, 250 ns, CPGA66 1.075 X 1.075 INCH, HERMETIC SEALED, CERAMIC, HIP-66
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| File Size |
403.23K /
14 Page |
View
it Online |
Download Datasheet
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Amphenol Communications Solutions |
| Part No. |
10127401-20H1400LF
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| Description |
PwrBlade® ULTRA Connector System, Power Connectors, Receptacle, 6HP+18S Right Angle, Through Hole
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
10106262-0H15001LF
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| Description |
PwrBlade+®,Power Connectors, Right Angle, Header 17LP 60S
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| Tech specs |
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Official Product Page
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White Electronic Designs, Corp. Microsemi, Corp.
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| Part No. |
WS128K32NV-17H1C WS128K32NV-17H1I WS128K32NV-17H1MA WS128K32NV-20H1C WS128K32NV-17H1CA WS128K32NV-17H1IA WS128K32NV-20H1CA WS128K32NV-20H1I WS128K32NV-15H1C WS128K32NV-25H1C WS128K32NV-25H1IA WS128K32NV-35H1C WS128K32NV-35H1IA WS128K32NV-35H1M WS128K32NV-35H1CA WS128K32NV-35H1MA
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| Description |
512K X 8 MULTI DEVICE SRAM MODULE, 17 ns, CHIP66 512K X 8 MULTI DEVICE SRAM MODULE, 20 ns, CHIP66 512K X 8 MULTI DEVICE SRAM MODULE, 15 ns, CHIP66 512K X 8 MULTI DEVICE SRAM MODULE, 25 ns, CHIP66 512K X 8 MULTI DEVICE SRAM MODULE, 35 ns, CHIP66
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| File Size |
164.15K /
5 Page |
View
it Online |
Download Datasheet
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Microsemi, Corp. White Electronic Designs, Corp.
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| Part No. |
WS128K32NV-17H1MA WS128K32NV-17H1C WS128K32NV-17H1IA WS128K32NV-17H1CA WS128K32NV-20H1C WS128K32NV-20H1I WS128K32NV-15H1C WS128K32NV-25H1C WS128K32NV-25H1CA WS128K32NV-25H1I WS128K32NV-25H1IA WS128K32NV-35H1C WS128K32NV-35H1CA WS128K32NV-35H1I WS128K32NV-35H1M WS128K32NV-35H1MA WS128K32NV-15H1CA WS128K32NV-20H1CA
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| Description |
128K X 32 MULTI DEVICE SRAM MODULE, 17 ns, CPGA66 1.075 X 1.075 INCH, HERMETIC SEALED, CERAMIC, HIP-66 128K X 32 MULTI DEVICE SRAM MODULE, 20 ns, CPGA66 1.075 X 1.075 INCH, HERMETIC SEALED, CERAMIC, HIP-66 128K X 32 MULTI DEVICE SRAM MODULE, 15 ns, CPGA66 1.075 X 1.075 INCH, HERMETIC SEALED, CERAMIC, HIP-66 128K X 32 MULTI DEVICE SRAM MODULE, 25 ns, CPGA66 1.075 X 1.075 INCH, HERMETIC SEALED, CERAMIC, HIP-66 128K X 32 MULTI DEVICE SRAM MODULE, 35 ns, CPGA66 1.075 X 1.075 INCH, HERMETIC SEALED, CERAMIC, HIP-66
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| File Size |
459.43K /
8 Page |
View
it Online |
Download Datasheet
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