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  DTM1-0513 Datasheet PDF File

For DTM1-0513 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | <7> | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

    Electronic Theatre Controls, Inc.
ECM Electronics Limited
ECM Electronics, Ltd.
Part No. VC0513-272 VC0513-270 VC0513-271 VC0513-560 VC0513-562 VC0513-561 VC0513-680 VC0513-392 VC0513-681 VC0513-391 VC0513-682 VC0513-390 VC0513-181 VC0513-821 VC0513-330 VC0513-180 VC0513-3R9 VC0513-822 VC0513-332 VC0513-820 VC0513-6R8 VC0513-331 VC0513-5R6
Description Medium Power Axial Inductors 中功率轴向电
File Size 46.22K  /  2 Page

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Amphenol Communications Solutions
Part No. 68405-130HLF
Description BergStik®, Board to Board connector, Unshrouded Right Angled Header, Through Hole, Double Row, 30 Positions, 2.54 mm (0.100in)Pitch.
Tech specs 　 　

Official Product Page

HUA FENG CIRCUIT





    Teledyne Technologies I...
Part No. UTOUTC0513
Description    Thin-Film Cascadable Amplifier 5 to 500 MHz
File Size 170.27K  /  6 Page

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Amphenol Communications Solutions
Part No. 68705-131HLF
Description BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Single Row, 31 Positions, 2.54 mm (0.100in) Pitch.
Tech specs 　 　

Official Product Page

    0513360510 51336-0510

Molex Electronics Ltd.
Part No. 0513360510 51336-0510
Description 1.25mm (.049) Pitch Mini Mi II System Wire-to-Board IDT Housing, Single Row, 5Circuits
1.25mm (.049") Pitch Mini Mi II垄芒 System Wire-to-Board IDT Housing, Single Row, 5Circuits
MOLEX Connector
File Size 99.07K  /  2 Page

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Amphenol Communications Solutions
Part No. U95Z2454051301
Description ULTQSFP 2X2 COMBO 4LP&SPFG
Tech specs 　 　

Official Product Page

    PAIRUI GROUP INC.
Part No. DAE1-0511H DAE1-0513H DAE1-0512H DAE1-0514H DAE-1H DAE1-0515H DAE1-0521H
Description DC-DC Converter
File Size 362.32K  /  3 Page

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Amphenol Communications Solutions
Part No. 98426-G04-05-133LF
Description Minitek® 2.00mm, Board to Board, Shrouded Vertical Stacking Header, Through Hole, Double Row, 10 Positions, 2.00mm (0.079in) Pitch.
Tech specs 　 　

Official Product Page

    51353-2400 0513532400

Molex Electronics Ltd.
Part No. 51353-2400 0513532400
Description 2.00mm (.079) Pitch MicroClasp Wire-to-Board Receptacle Housing, Positive LockDual Row, 24 circuits
File Size 242.32K  /  3 Page

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Amphenol Communications Solutions
Part No. 73305-131LF
Description RJ45 Modular Jack, Input Output Connectors, CAT 3, Standard, 6P6C, Right Angle, Surface Mount, without Shield, 1 Port.
Tech specs 　 　

Official Product Page

    51353-3000 0513533000

Molex Electronics Ltd.
Part No. 51353-3000 0513533000
Description 2.00mm (.079) Pitch MicroClasp?/a> Wire-to-Board Receptacle Housing, Positive Lock Dual Row, 30 circuits
File Size 242.32K  /  3 Page

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Amphenol Communications Solutions
Part No. 68705-130HLF
Description BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Single Row, 30 Positions, 2.54 mm (0.100in) Pitch.
Tech specs 　 　

Official Product Page

    51353-2200 0513532200

Molex Electronics Ltd.
Part No. 51353-2200 0513532200
Description 2.00mm (.079) Pitch MicroClasp Wire-to-Board Receptacle Housing, Positive LockDual Row, 22 circuits
File Size 242.32K  /  3 Page

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Amphenol Communications Solutions
Part No. 54121-407051300LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Single Row, 5 Positions, 2.54mm (0.100in) Pitch.
Tech specs 　 　

Official Product Page

    51353-2000 0513532000

Molex Electronics Ltd.
Part No. 51353-2000 0513532000
Description 2.00mm (.079) Pitch MicroClasp Wire-to-Board Receptacle Housing, Positive Lock Dual Row, 20 circuits
File Size 242.35K  /  3 Page

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Amphenol Communications Solutions
Part No. 10120513-002C-TRLF
Description SAS/PCIe 3.0 (U.2) Connectors, Storage and Server Connector, 68 Position Vertical Recep SMT, 12Gb/s.
Tech specs 　 　

Official Product Page

    51336-1710 0513361710

Molex Electronics Ltd.
Part No. 51336-1710 0513361710
Description 1.25mm (.049) Pitch Mini Mi II System Wire-to-Board IDT Housing, Single Row, 17Circuits
1.25mm (.049) Pitch Mini Mi II?/a> System Wire-to-Board IDT Housing, Single Row, 17Circuits
1.25mm (.049") Pitch Mini Mi II垄芒 System Wire-to-Board IDT Housing, Single Row, 17Circuits
File Size 99.07K  /  2 Page

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Amphenol Communications Solutions
Part No. 54102-S0513B03LF
Description BERGSTIK 0.100\\ HEADER-REPLACMNT 77313-801-26LF
Tech specs 　 　

Official Product Page

    0436500513

Molex Electronics Ltd.
Part No. 0436500513
Description
File Size 152.53K  /  3 Page

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Amphenol Communications Solutions
Part No. 54112-807051300LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 5 Positions, 2.54mm (0.100in) Pitch.
Tech specs 　 　

Official Product Page

For DTM1-0513 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | <7> | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

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