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Mitsubishi Electric, Corp.
MITSUBISHI[Mitsubishi Electric Semiconductor]
Mitsubishi Electric Corporation
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| Part No. |
M51162P M51162
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| Description |
RECORDINGIPLAYBACK PREAMPLIFIER FOR STEREO CASSETTE TAPE RECORDER RECORDINGIPLAYBACK前置记录仪立体声盒式录音
CONN HEADER 12POS .100 R/A GOLD
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| File Size |
448.84K /
7 Page |
 View
it Online |
Download Datasheet
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Toshiba Electronic Devices & Storage Corporation |
| Part No. |
2SA1162
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| Description |
PNP Bipolar Transistor / VCEO=-50 V / IC=-0.15 A / hFE=70~400 / VCE(sat)=-0.3 V / AEC-Q101 / SOT-346
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
79821-162HLF
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| Description |
BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 62 Positions, 2.54 mm Pitch, Vertical, 10.92 mm (0.43 in.) Mating, 5.08 mm (0.2 in.) Tail.
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
131-5116-21D
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| Description |
Paladin® 112Gb/s Backplane Connector, 5-Pair, 6 Column, Open Wall, Backplane Module, 2.25mm Wipe, Nickel Sulfamate.
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
131-4116-21H
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| Description |
Paladin® 112Gb/s Backplane Connector, 4-Pair, 6 Column, Open Wall, Backplane Module, 2.25mm Wipe, APP.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
77311-162-36LF
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| Description |
BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Single Row, 36 Positions, 2.54 mm Pitch.
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
10127721-162GLF
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| Description |
Minitek® Pwr 3.0, Dual Row, Vertical Through Hole Header, 16 Position, 3.2mm Kink Tail (Gold Flash) plating, GW Compatible LCP, Black Color,Tray Packing.
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
75168-116-20LF
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| Description |
BergStik®, Board to Board connector, Unshrouded Right Angled header, Through Hole, Single Row, 20 Positions, 2.54mm (0.100in) Pitch.
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
54242-811162350LF
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| Description |
BergStik®, Board to Board connector, Unshrouded vertical stacked header, Surface Mount, Double Row, 16 Positions, 2.54mm (0.100in) Pitch.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
131-3116-21D
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| Description |
Paladin® 112Gb/s Backplane Connector, 3-Pair, 6 Column, Open Wall, Backplane Module, 2.25mm Wipe, Nickel Sulfamate.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
131-8116-21D
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| Description |
Paladin® 112Gb/s Backplane Connector, 8-Pair, 6 Column, Open Wall, Backplane Module, 2.25mm Wipe, Nickel Sulfamate.
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Official Product Page
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Price and Availability
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