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  76762-8501 Datasheet PDF File

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    NCV8501.PDF NCV8501-D

ON Semiconductor
Part No. NCV8501.PDF NCV8501-D
Description 150 mA LDO Regulator
From old datasheet system
File Size 108.08K  /  16 Page

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Amphenol Communications Solutions
Part No. 437-6762-000
Description VHDM®, Backplane connectors, Vertical Orientation, Press Fit Termination, 6 Row VHDM, backplane power, dual, 6mm.
Tech specs 　 　

Official Product Page

HUA FENG CIRCUIT





    48P-6043-072V-9 85013-0098

Molex Electronics Ltd.
Part No. 48P-6043-072V-9 85013-0098
Description 2.54mm (.100) Pitch DIN 41612 Header, Vertical, C-Pin Press-Fit Style R/2 Reverse, 0.6μm (24μ) Selective Gold (Au), 48 Circuits, Lead free
File Size 282.30K  /  5 Page

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Amphenol Communications Solutions
Part No. 95278-501-42LF
Description BergStik®, Board to Board connector, Unshrouded Header, SMT, Double Row, 42 Positions, 2.54 mm Pitch, Vertical, 5.84 mm (0.23 in.) Mating
Tech specs 　 　

Official Product Page

    LA8501-P LA8500 LA8501P

SANYO[Sanyo Semicon Device]
Sanyo Electric Co.,Ltd.
Part No. LA8501-P LA8500 LA8501P
Description Monolithic Linear IC
Tone Ringer
File Size 51.24K  /  2 Page

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Amphenol Communications Solutions
Part No. 95278-501-46LF
Description BergStik®, Board to Board connector, Unshrouded Header, SMT, Double Row, 46 Positions, 2.54 mm Pitch, Vertical, 5.84 mm (0.23 in.) Mating
Tech specs 　 　

Official Product Page

    MC285013

Isahaya Electronics Corporation
Part No. MC285013
Description FOR GENERAL SWITCHING APPLICATION SILICON EPITAXIAL TYPE
File Size 137.53K  /  3 Page

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Amphenol Communications Solutions
Part No. 95278-501A16LF
Description BergStik®, Board to Board connector, Unshrouded Header, SMT, Double Row, 16 Positions, 2.54 mm Pitch, Vertical, 5.84 mm (0.23 in.) Mating
Tech specs 　 　

Official Product Page

    LBN18501

SIPAT Co,Ltd
Part No. LBN18501
Description    185MHz IF SAW Filter 24MHz Bandwidth
File Size 182.52K  /  3 Page

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Amphenol Communications Solutions
Part No. 95278-501A40LF
Description BergStik®, Board to Board connector, Unshrouded Header, SMT, Double Row, 40 Positions, 2.54 mm Pitch, Vertical, 5.84 mm (0.23 in.) Mating
Tech specs 　 　

Official Product Page

   
Part No. PS8501L1-V-AX
Description 1 CHANNEL LINEAR OUTPUT OPTOCOUPLER
File Size 290.85K  /  18 Page

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Amphenol Communications Solutions
Part No. 95278-501B20LF
Description BergStik®, Board to Board connector, Unshrouded Header, SMT, Double Row, 20 Positions, 2.54 mm Pitch, Vertical, 5.84 mm (0.23 in.) Mating
Tech specs 　 　

Official Product Page

    Champion Microelectronic Corporation
Part No. CM8501IT
Description 1.5A BUS TERMINATOR
File Size 321.21K  /  10 Page

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Amphenol Communications Solutions
Part No. 95278-501B40LF
Description BergStik®, Board to Board connector, Unshrouded Header, SMT, Double Row, 40 Positions, 2.54 mm Pitch, Vertical, 5.84 mm (0.23 in.) Mating
Tech specs 　 　

Official Product Page

    ams AG
Part No. AS8501 AS8501TR
Description High precision voltage and current measurement sensor interface
File Size 475.62K  /  40 Page

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Amphenol Communications Solutions
Part No. RJCSE508501
Description Modular Jack - Right Angle, Input Output Connectors 8P8C, Without Shield, With LEDs.
Tech specs 　 　

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    TDA8501 TDA8501T

PHILIPS[Philips Semiconductors]
Part No. TDA8501 TDA8501T
Description PAL/NTSC encoder
File Size 238.35K  /  30 Page

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Amphenol Communications Solutions
Part No. 468-5010-061
Description VHDM-HSD™, Backplane connectors, Vertical Orientation, Press Fit Termination, 6 Row HSD, 10 positions, open, 4.75mm (0.187in), Header.
Tech specs 　 　

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    TPCP8501

Toshiba Semiconductor
Part No. TPCP8501
Description TOSHIBA Transistor Silicon NPN Epitaxial Type
File Size 222.41K  /  5 Page

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Amphenol Communications Solutions
Part No. 498-5010-A62
Description VHDM®, Backplane connectors, Vertical Orientation, Press Fit Termination, 6 Row VHDM, 10 positions, right, A-Key, 6.25mm (0.246in), Header.
Tech specs 　 　

Official Product Page

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