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  5941-4CC Datasheet PDF File

For 5941-4CC Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | <7> | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

    IRG4CC20UB

International Rectifier
Part No. IRG4CC20UB
Description IRG4CC20UB IGBT Die in Wafer Form

File Size 34.41K  /  1 Page

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Amphenol Communications Solutions

Part No. 68459-410HLF
Description BergStik® 2.54mm, Board To Board Connector, Unshrouded Right Angled Header, Through Hole, Double Row, 10 Positions, 2.54mm (0.100in)Pitch.
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    IRG4CC30FB

International Rectifier
Part No. IRG4CC30FB
Description IRG4CC30FB IGBT Die in Wafer Form

File Size 34.79K  /  1 Page

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Amphenol Communications Solutions

Part No. 68459-414HLF
Description BergStik® 2.54mm, Board To Board Connector, Unshrouded Right Angled Header, Through Hole, Double Row, 14 Positions, 2.54mm (0.100in)Pitch.
Tech specs    

Official Product Page

    IRG4CC30KB

International Rectifier
Part No. IRG4CC30KB
Description IRG4CC30KB IGBT Die in Wafer Form

File Size 39.22K  /  1 Page

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Amphenol Communications Solutions

Part No. 10159559-410221RLF
Description ComboStak® Vertical Receptacle 2P 10S 2P Height 7.7mm
Tech specs    

Official Product Page

    IRG4CC30SB

International Rectifier
Part No. IRG4CC30SB
Description IRG4CC30SB IGBT Die in Wafer Form

File Size 34.55K  /  1 Page

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Amphenol Communications Solutions

Part No. 10136594-101LF
Description AirMax VS2®, Backplane Connectors, 4-Pair, 120 -position, 2mm pitch, 10 column, 4 Walls, Right Angle Header, small press-fit, 1 side plating.
Tech specs    

Official Product Page

    IRG4CC30UB

International Rectifier
Part No. IRG4CC30UB
Description IRG4CC30UB IGBT Die in Wafer Form

File Size 34.35K  /  1 Page

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Amphenol Communications Solutions

Part No. 68459-416HLF
Description BergStik® 2.54mm, Board To Board Connector, Unshrouded Right Angled Header, Through Hole, Double Row, 16 Positions, 2.54mm (0.100in)Pitch.
Tech specs    

Official Product Page

    IRG4CC40FB

International Rectifier
Part No. IRG4CC40FB
Description IRG4CC40FB IGBT Die in Wafer Form

File Size 34.37K  /  1 Page

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Amphenol Communications Solutions

Part No. 68459-412HLF
Description BergStik® 2.54mm, Board To Board Connector, Unshrouded Right Angled Header, Through Hole, Double Row, 12 Positions, 2.54mm (0.100in)Pitch.
Tech specs    

Official Product Page

    IRG4CC40KB

International Rectifier
Part No. IRG4CC40KB
Description IRG4CC40KB IGBT Die in Wafer Form

File Size 34.29K  /  1 Page

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Amphenol Communications Solutions

Part No. 68459-418HLF
Description BergStik® 2.54mm, Board To Board Connector, Unshrouded Right Angled Header, Through Hole, Double Row, 18 Positions, 2.54mm (0.100in)Pitch.
Tech specs    

Official Product Page

    IRG4CC40SB

International Rectifier
Part No. IRG4CC40SB
Description IRG4CC40SB IGBT Die in Wafer Form

File Size 38.59K  /  1 Page

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Amphenol Communications Solutions

Part No. 10136594-102LF
Description AirMax VS2®, Backplane Connectors, 4-Pair, 120 -position, 2mm pitch, 10 column, 4 Walls, Right Angle Header, small press-fit, 2 side plating.
Tech specs    

Official Product Page

    IRG4CC77KB

International Rectifier
Part No. IRG4CC77KB
Description IRG4CC77KB IGBT Die in Wafer Form

File Size 39.14K  /  1 Page

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    IRG4CC71KB

International Rectifier
Part No. IRG4CC71KB
Description IRG4CC71KB IGBT Die in Wafer Form

File Size 37.81K  /  1 Page

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For 5941-4CC Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | <7> | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

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