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  43045-0806 Datasheet PDF File

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    43045-0808

Molex Electronics Ltd.
Part No. 43045-0808
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Header, Surface Mount, Dual Row, Right Angle, with Press-fit Metal Retention Clip, 8 Circuits
File Size 184.25K  /  3 Page

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Amphenol Communications Solutions
Part No. 10093084-3045HFLF
Description QSFP+ Cable Assembly, 28 AWG, 4.5ms, passive, Halogen free
Tech specs 　 　

Official Product Page

HUA FENG CIRCUIT





    43045-0800

Molex Electronics Ltd.
Part No. 43045-0800
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Header, Surface Mount Compatible, Dual Row, Right Angle, with Snap-in Plastic Peg PCB Lock, 8 Circuits
File Size 190.59K  /  3 Page

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Amphenol Communications Solutions
Part No. 10093084-3045LF
Description QSFP+ Cable Assembly, 28 AWG, 4.5ms, passive, non-halogen free
Tech specs 　 　

Official Product Page

    43045-1025

Molex Electronics Ltd.
Part No. 43045-1025
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Header, Surface Mount Compatible, Dual Row, Vertical, with Press-fit Metal Retention Clip, 10 Circuits
File Size 182.53K  /  3 Page

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Amphenol Communications Solutions
Part No. 54202-G08-06P
Description BergStik®, Board to Board connector, Unshrouded Vertical Header, Surface Mount, Double Row, 12 Positions, 2.54 mm (0.100in) Pitch.
Tech specs 　 　

Official Product Page

    43045-0809

Molex Electronics Ltd.
Part No. 43045-0809
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Header, Surface Mount, Dual Row, Right Angle, with Solder Tab, 8 Circuits
File Size 180.46K  /  3 Page

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Amphenol Communications Solutions
Part No. 75160-806-10LF
Description BergStik®, Board to Board connector, Unshrouded vertical header, through hole, single Row,10 position, 2.54mm pitch
Tech specs 　 　

Official Product Page

    43045-0810

Molex Electronics Ltd.
Part No. 43045-0810
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Header, Surface Mount, Dual Row, Right Angle, with Solder Tab, 8 Circuits
File Size 180.50K  /  3 Page

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Amphenol Communications Solutions
Part No. 57102-F08-06LF
Description Minitek®, Board/Wire to Board Connectors, Unshrouded Headers - Through Hole - Double row - 12 Positions - 2mm (0.079inch) - Vertical
Tech specs 　 　

Official Product Page

    43045-0410

Molex Electronics Ltd.
Part No. 43045-0410
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Header, Surface Mount, Dual Row, Right Angle, with Solder Tab, 4 Circuits
File Size 180.68K  /  3 Page

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Amphenol Communications Solutions
Part No. 54102-G0806LF
Description 54102-G0806LF-DUPLEX
Tech specs 　 　

Official Product Page

    43045-0420

Molex Electronics Ltd.
Part No. 43045-0420
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Header, Surface Mount, Dual Row, Vertical, with Solder Tab, 4 Circuits
File Size 175.81K  /  3 Page

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Amphenol Communications Solutions
Part No. 54122-101080600RLF
Description BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 8 position, 2.54mm (0.100in) pitch
Tech specs 　 　

Official Product Page

    43045-0610

Molex Electronics Ltd.
Part No. 43045-0610
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Header, Surface Mount, Dual Row, Right Angle, with Solder Tab, 6 Circuits
File Size 180.50K  /  3 Page

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Amphenol Communications Solutions
Part No. 68020-408-061033LF
Description BergStik®, Board to Board connector, Unshrouded Right angled Header, Through Hole, Double Row, 8 Positions, 2.54mm (0.100in) Pitch.
Tech specs 　 　

Official Product Page

    43045-1814

Molex Electronics Ltd.
Part No. 43045-1814
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Header, Surface Mount Compatible, Dual Row, Vertical, with PCB Polarizing Peg, 18 Circuits
File Size 166.55K  /  3 Page

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Amphenol Communications Solutions
Part No. 10142708-06200LF
Description Minitek®Pwr 5.7, Vertical Through Hole Header, Dual Row, Black Color, 6 Positions, 100u\\ Tin overall plating, GW Compatible LCP, With Pegs, Tray.
Tech specs 　 　

Official Product Page

    43045-1815

Molex Electronics Ltd.
Part No. 43045-1815
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Header, Surface Mount, Dual Row, Vertical, with Press-fit Metal Retention Clip, 18 Circuits
File Size 174.05K  /  3 Page

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Amphenol Communications Solutions
Part No. 54112-808061500LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 6 Positions, 2.54mm (0.100in) Pitch.
Tech specs 　 　

Official Product Page

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