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Part No. TC55VL1636FF-100 TC55VL1636FF-83
Description 512K X 36 STANDARD SRAM, 8.5 ns, PQFP100
512K X 36 STANDARD SRAM, 9 ns, PQFP100

File Size 828.57K  /  19 Page

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Amphenol Communications Solutions

Part No. 61082-163602LF
Description BergStak® 0.80mm Pitch, Receptacle, Vertical, Double Row, 160 Positions.
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    Toshiba Corporation
Part No. TC55VD1636FF-133
Description 512K Word x 36 Bit Synchronous No-turnround Static RAM(512K 字x36位同步无转向静RAM)

File Size 865.10K  /  20 Page

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Amphenol Communications Solutions

Part No. 75168-316-36LF
Description BergStik®, Board to Board connector, Unshrouded Right Angled header, Through Hole, Single Row, 36 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    TOSHIBA
Part No. TC55VD1636FF-133 TC55VD1636FF-167
Description 524,288-WORD BY 36-BIT SYNCHRONOUS NO-TURNAROUND STATIC RAM

File Size 893.07K  /  20 Page

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Amphenol Communications Solutions

Part No. 61083-163622LF
Description BergStak® 0.80mm Pitch, Mezzanine Connector, Vertical Header, Double Row, 160 Positions.
Tech specs    

Official Product Page

    TOSHIBA
Part No. TC55V16366FF-133 TC55V16366FF-167
Description 524,288-WORD BY 36-BIT SYNCHRONOUS PIPELINED BURST STATIC RAM

File Size 1,144.06K  /  19 Page

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Amphenol Communications Solutions

Part No. 61082-163600LF
Description 0.8MM B TO B REC ASSY
Tech specs    

Official Product Page

    TOSHIBA
Part No. TC55WD1636FF-133 TC55WD1636FF-167 TC55WD1636FF-150
Description 524,288-WORD BY 36-BIT SYNCHRONOUS NO-TURNAROUND STATIC RAM

File Size 830.90K  /  18 Page

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Amphenol Communications Solutions

Part No. 61083-163600LF
Description BergStak® 0.80mm Pitch, Mezzanine Connector, Vertical Header, Double Row, 160 Positions.
Tech specs    

Official Product Page

    MAX11636EEET MAX11634

Maxim Integrated Products
Part No. MAX11636EEET MAX11634
Description 12-Bit, 300ksps ADCs with Differential

File Size 1,292.38K  /  24 Page

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Amphenol Communications Solutions

Part No. 61083-163602LF
Description BergStak® 0.80mm Pitch, Mezzanine Connector, Vertical Header, Double Row, 160 Positions.
Tech specs    

Official Product Page

    K7Z167288B K7Z163688B

Samsung semiconductor
Part No. K7Z167288B K7Z163688B
Description 512Kx36 & 256Kx72 DLW(Double Late Write) RAM

File Size 239.63K  /  20 Page

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Amphenol Communications Solutions

Part No. 75168-116-36LF
Description BergStik®, Board to Board connector, Unshrouded Right Angled header, Through Hole, Single Row, 36 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    SAMSUNG SEMICONDUCTOR CO. LTD.
Part No. K7N161801M K7N163601M
Description 512Kx36 & 1Mx18-Bit Pipelined NtRAM TM

File Size 317.40K  /  20 Page

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Amphenol Communications Solutions

Part No. RJMG163618101NR
Description RJMG, Input output Connectors, 1x1,10/100 with LEDs
Tech specs    

Official Product Page

    http://
Samsung Semiconductor Co., Ltd.
SAMSUNG SEMICONDUCTOR CO. LTD.
Part No. K7N161845M K7N163645M
Description 512Kx36 & 1Mx18-Bit Pipelined NtRAMTM 512Kx36
512Kx36 & 1Mx18-Bit Pipelined NtRAMTM

File Size 470.55K  /  20 Page

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Amphenol Communications Solutions

Part No. 61082-163622LF
Description BergStak® 0.80mm Pitch, Receptacle, Vertical, Double Row, 160 Positions.
Tech specs    

Official Product Page

    SAMSUNG SEMICONDUCTOR CO. LTD.
Part No. K7M161825M K7M163625M
Description 512Kx36 & 1Mx18 Flow-Through NtRAM-TM

File Size 355.71K  /  20 Page

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Amphenol Communications Solutions

Part No. UE86G16360033T
Description XCede I/O, High Speed Input Output Connectors, 1X1 XCede IO COMBO.
Tech specs    

Official Product Page

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