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PUSB2X4D 2SC3596C SAA570 080ASBEW CP759R JR220V B1020 13003H1
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For processes Found Datasheets File :: 15110    Search Time::1.422ms    
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    UPG2012TB UPG2012TB-E3

California Eastern Labs
Part No. UPG2012TB UPG2012TB-E3
OCR Text ...onds maximum number of reflow processes : 3 times maximum chlorine content of rosin flux (% mass) : 0.2%(wt.) or bel ow ir260 vps peak temperature (package surface temperature) : 215 ? c or below time at temperature of 200...
Description L-BAND SPDT SWITCH

File Size 240.18K  /  8 Page

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    Hamamatsu Photonics
HAMAMATSU[Hamamatsu Corporation]
Part No. C7460
OCR Text ...uring the various manufacturing processes of semiconductors including etching, sputtering, cleaning, and CVD. The MPM can handle multi-channel recording in real-time. q Simultaneous measurement from 200 to 950 nm q Easy measurement using...
Description Multiband Plasma-Process Monitor

File Size 521.52K  /  8 Page

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    http://
WJCI[WJ Communication. Inc.]
Part No. ECG002_07 ECG002 ECG002B-G ECG002B-PCB ECG002C-G ECG002C-PCB ECG002F-G ECG002F-PCB ECG00207
OCR Text ...C reflow temperature) soldering processes. Outline Drawing Product Marking The component will be marked with an "E002G" designator with an alphanumeric lot code on the top surface of the package. The obsolete tin-lead package is mark...
Description InGaP HBT Gain Block

File Size 322.89K  /  7 Page

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    WJCI[WJ Communication. Inc.]
Part No. ECG006F-PCB ECG006 ECG006B-G ECG006B-PCB ECG006C-G ECG006C-PCB ECG006F-G
OCR Text ...C reflow temperature) soldering processes. Outline Drawing Product Marking The component will be marked with an "E006G" designator with an alphanumeric lot code on the top surface of the package. The obsolete tin-lead package is mark...
Description InGaP HBT Gain Block

File Size 321.34K  /  7 Page

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    UPC4093G2 UPC4093C UPC4093

NEC, Corp.
NEC[NEC]
Part No. UPC4093G2 UPC4093C UPC4093
OCR Text ...nt Device If other soldering processes are used, or if the soldering is performed under different conditions, please make sure to consult PC4093G2: 8-pin plastic SOP (225 mil) Process Infrared Ray Reflow Conditions Peak temperature: ...
Description J-FET INPUT LOW-OFFSET OPERATIONAL AMPLIFIER J - FET输入低失调运算放大器

File Size 88.72K  /  12 Page

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    CEL[California Eastern Labs]
Part No. NE5511279A-T1A-A NE5511279A NE5511279A-T1-A
OCR Text ...o 180C Maximum number of reflow processes Maximum chlorine content of rosin flux (% mass) Peak temperature (package surface temperature) Time at temperature of 200C or higher Preheating time at 120 to 150C Maximum number of reflow processes...
Description 7.5 V UHF BAND RF POWER SILICON LD-MOS FET

File Size 218.92K  /  4 Page

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    EXAR[Exar Corporation]
Part No. PEB1756E
OCR Text ...em/ backplane * TFI-5 Support * processes SONET/SDH sixteen STS-48/STM-16 or a mix of sixteen STM-12/STM-4 and STS-3/ STM-1 on the line side interface * processes SONET/SDH sixteen STS-48/STM-16 on the system/client side serial 2.5 Gbit/s i...
Description TETHYS 448 16 STS-48/STM-16 MUX/DEMUX
TETHYS⑩ 448 16 STS-48/STM-16 MUX/DEMUX

File Size 35.42K  /  2 Page

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    Infineon Technologies A...
INFINEON[Infineon Technologies AG]
Part No. PEB1757E
OCR Text ...ystem/backplane TFI-5 Support processes SONET/SDH quad STS-192/STM-64 on the line side interface processes SONET/SDH quad STS-192/STM-64 or sixteen STS-48/STM-16 on the system/client side serial 2.5 Gbit/s interface Pr...
Description Semiconductor Solutions for High Speed Communication and Fiber Optic Applications

File Size 241.14K  /  4 Page

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    EXAR[Exar Corporation]
Part No. PEB1757E
OCR Text ...em/ backplane * TFI-5 Support * processes SONET/SDH quad STS-192/STM-64 on the line side interface * processes SONET/SDH quad STS-192/STM-64 or sixteen STS-48/STM-16 on the system/client side serial 2.5 Gbit/s interface * Provides line timi...
Description TETHYS 4192 QUAD STS-192/STM-64 MUX/DEMUX
TETHYS⑩ 4192 QUAD STS-192/STM-64 MUX/DEMUX

File Size 35.56K  /  2 Page

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    STMICROELECTRONICS[STMicroelectronics]
Part No. ST20-C1
OCR Text .... . . . . . . . . . . . . . .76 processes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .78 Descheduled processes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .7...
Description Instruction Set Reference Manual

File Size 845.95K  /  205 Page

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For processes Found Datasheets File :: 15110    Search Time::1.422ms    
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