| |
|
 |
XILINX INC
|
| Part No. |
XC2V3000-6FF1517C
|
| OCR Text |
... to 10m system gates. packaging offerings include ball grid array (bga) packages with 0.80mm, 1.00mm, and 1.27mm pitches. in addition to tradi- tional wire-bond interconnects, flip-chip interconnect is used in some of the bga offerings. the... |
| Description |
FPGA, 3584 CLBS, 3000000 GATES, PBGA1517
|
| File Size |
685.20K /
70 Page |
View
it Online |
Download Datasheet
|
| |
|
 |
FORCE TECHNOLOGIES LTD
|
| Part No. |
FT28C16-15SC
|
| OCR Text |
...g. 3. the 28c16 ceramic package offerings have been removed. new designs should utilize the 28c256 ceramic offerings. ordering information (1) t acc (ns) i cc (ma) ordering code package operation range active standby 150 30 0.1 ... |
| Description |
2K X 8 EEPROM 5V, 150 ns, PDSO24
|
| File Size |
235.92K /
11 Page |
View
it Online |
Download Datasheet
|
|

Price and Availability
|