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    XILINX INC
Part No. XC2V3000-6FF1517C
OCR Text ... to 10m system gates. packaging offerings include ball grid array (bga) packages with 0.80mm, 1.00mm, and 1.27mm pitches. in addition to tradi- tional wire-bond interconnects, flip-chip interconnect is used in some of the bga offerings. the...
Description FPGA, 3584 CLBS, 3000000 GATES, PBGA1517

File Size 685.20K  /  70 Page

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    GS8161Z32AD-166I

GSI TECHNOLOGY
Part No. GS8161Z32AD-166I
OCR Text ...r a complete listing of current offerings 8/8 specifications cited are subject to change without notice. for latest document ation see http://www.gsitechnology.com. revision: 9/26/02 gs8161z18/32/36ad supplemental datasheet information 5...
Description 256K X 32 ZBT SRAM, PBGA165

File Size 903.58K  /  40 Page

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    FORCE TECHNOLOGIES LTD
Part No. FT28C16-15SC
OCR Text ...g. 3. the 28c16 ceramic package offerings have been removed. new designs should utilize the 28c256 ceramic offerings. ordering information (1) t acc (ns) i cc (ma) ordering code package operation range active standby 150 30 0.1 ...
Description 2K X 8 EEPROM 5V, 150 ns, PDSO24

File Size 235.92K  /  11 Page

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    GSITECHNOLOGY-GS881Z32AD-166T GSITECHNOLOGY-GS881Z32AD-166IT GS881Z36AD-133IT GS881Z36AD-150I GS881Z36AD-150T GS881Z36AD

GSI TECHNOLOGY
Part No. GSITECHNOLOGY-GS881Z32AD-166T GSITECHNOLOGY-GS881Z32AD-166IT GS881Z36AD-133IT GS881Z36AD-150I GS881Z36AD-150T GS881Z36AD-166 GS881Z36AD-150IT
OCR Text ...r a complete listing of current offerings 8/8 specifications cited are subject to change without notice. for latest document ation see http://www.gsitechnology.com. revision: 9/26/02 gs881z18/32/36ad supplemental datasheet information 25...
Description 256K X 36 ZBT SRAM, 8.5 ns, PBGA165
256K X 36 ZBT SRAM, 7.5 ns, PBGA165
256K X 36 ZBT SRAM, 7 ns, PBGA165

File Size 896.94K  /  40 Page

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    AT28C16 AT28C16-15 AT28C16-15JC AT28C16-15JI AT28C16-15PC AT28C16-15PI AT28C16-15SC AT28C16-15SI AT28C16E AT28C16E-15JC

ATMEL Corporation
Part No. AT28C16 AT28C16-15 AT28C16-15JC AT28C16-15JI AT28C16-15PC AT28C16-15PI AT28C16-15SC AT28C16-15SI AT28C16E AT28C16E-15JC AT28C16E-15JI AT28C16E-15PC AT28C16E-15PI AT28C16E-15SC AT28C16E-15SI AT28C16-W DOC220
OCR Text ...g. 3. The 28C16 ceramic package offerings have been removed. New designs should utilize the 28C256 ceramic offerings. Valid Part Numbers The following table lists standard Atmel products that can be ordered. Device Numbers AT28C16 AT28...
Description From old datasheet system
16K (2K x 8) CMOS E 2 PROM
16K 2K x 8 CMOS E2PROM

File Size 173.41K  /  9 Page

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    AT28C17 AT28C17-15 AT28C17-15JC AT28C17-15JI AT28C17-15PC AT28C17-15PI AT28C17-15SC AT28C17-15SI AT28C17E AT28C17E-15JC

ATMEL[ATMEL Corporation]
Part No. AT28C17 AT28C17-15 AT28C17-15JC AT28C17-15JI AT28C17-15PC AT28C17-15PI AT28C17-15SC AT28C17-15SI AT28C17E AT28C17E-15JC AT28C17E-15JI AT28C17E-15PC AT28C17E-15PI AT28C17E-15SC AT28C17E-15SI AT28C17-W DOC222
OCR Text ...e 28C17 ceramic and LCC package offerings have been removed. New designs should utilize the 28C256 ceramic offerings. Valid Part Numbers The following table lists standard Atmel products that can be ordered. Device Numbers AT28C17 AT28...
Description 16K 2K x 8 CMOS E2PROM
16K (2K x 8) CMOS
From old datasheet system

File Size 178.47K  /  9 Page

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    MPC8241 XPC8241TZP XPC8241TZP166B XPC8241TXXX XPC8241TZP200B MPC8241TZQ266D MPC8241TZQ266C MPC8241TZP166C MPC8241TZP200C

Freescale (Motorola)
FREESCALE[Freescale Semiconductor, Inc]
飞思卡尔半导体(中国)有限公司
Part No. MPC8241 XPC8241TZP XPC8241TZP166B XPC8241TXXX XPC8241TZP200B MPC8241TZQ266D MPC8241TZQ266C MPC8241TZP166C MPC8241TZP200C MPC8241TZP266C MPC8241TZQ166C MPC8241TZQ166D MPC8241TZQ200C MPC8241TXXPNS
OCR Text ...ffered for extended temperature offerings. Also, added Processor Version Number column to table. Updated list of extended temperature parts. Section 1.9--Updated part marking format and package description offerings. Substantive Change(s) ...
Description MPC8241 Part Number Specification for the XPC8241TXXnnnx Series
Intergrated Processor Hardware Specifications
Circular Connector; MIL SPEC:MIL-C-26482, Series I, Solder; Body Material:Aluminum; Series:PT07; No. of Contacts:16; Connector Shell Size:20; Connecting Termination:Solder; Circular Shell Style:Jam Nut Receptacle
Circular Connector; Body Material:Aluminum; Series:PT06; No. of Contacts:16; Connector Shell Size:20; Connecting Termination:Solder; Circular Shell Style:Straight Plug; Circular Contact Gender:Pin; Insert Arrangement:20-16
Circular Connector; MIL SPEC:MIL-C-26482, Series I, Solder; Body Material:Aluminum; Series:PT06; Number of Contacts:30; Connector Shell Size:18; Connecting Termination:Solder; Circular Shell Style:Straight Plug; Body Style:Straight
Circular Connector; Body Material:Aluminum; Series:PT07; Number of Contacts:32; Connector Shell Size:18; Connecting Termination:Solder; Circular Shell Style:Jam Nut Receptacle; Circular Contact Gender:Socket 综合处理器硬件规

File Size 203.98K  /  4 Page

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    C0603C470J5GACAUTO

Kemet Corporation
Part No. C0603C470J5GACAUTO
OCR Text ... v and 250 v ? capacitance offerings ranging from 0.5 pf up to 0.47 f ? available capacitance tolerances of 0.10 pf, 0.25 pf, 0.5 pf, 1%, 2%, 5%, 10%, and 20% overview kemets automotive grade series surfac...
Description Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

File Size 1,504.16K  /  19 Page

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