mil-std-1686 pdf Datasheet P6 Full Text Search --- IC-ON-LINE


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mil-std-1686 Datasheet PDF File

For mil-std-1686 Found Datasheets File :: 257 Search Time::0.859ms
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				FILTRONIC[Filtronic Compound Semiconductors]
Part No.	FPDA200V
OCR Text	...ontrol measures can be found in mil-std-1686 and MIL-HDBK-263. ASSEMBLY INSTRUCTIONS The recommended die attach is gold/tin eutectic solder under a nitrogen atmosphere. Stage temperature should be 280-290C; maximum time at temperature is on...
Description	HIGH PERFORMANCE PHEMT WITH SOURCE VIAS
File Size	57.15K / 3 Page	View it Online	Download Datasheet

				FILTRONIC[Filtronic Compound Semiconductors]
Part No.	FPD6836
OCR Text	...ontrol measures can be found in mil-std-1686 and MIL-HDBK-263. ASSEMBLY INSTRUCTIONS The recommended die attach is gold/tin eutectic solder under a nitrogen atmosphere. Stage temperature should be 280-290C; maximum time at temperature is on...
Description	0.25W POWER PHEMT
File Size	185.61K / 2 Page	View it Online	Download Datasheet

				Filtronic Compound Semiconductors
Part No.	FPD750
OCR Text	...ontrol measures can be found in mil-std-1686 and MIL-HDBK-263. ASSEMBLY INSTRUCTIONS The recommended die attach is gold/tin eutectic solder under a nitrogen atmosphere. Stage temperature should be 280-290C; maximum time at temperature is on...
Description	0.5W POWER PHEMT
File Size	172.52K / 2 Page	View it Online	Download Datasheet

				Filtronic Compound Semicond... FILTRONIC[Filtronic Compound Semiconductors]
Part No.	FPD3000
OCR Text	...ontrol measures can be found in mil-std-1686 and MIL-HDBK-263. ASSEMBLY INSTRUCTIONS The recommended die attach is gold/tin eutectic solder under a nitrogen atmosphere. Stage temperature should be 280-290C; maximum time at temperature is on...
Description	2W POWER PHEMT
File Size	181.19K / 2 Page	View it Online	Download Datasheet

				FILTRONIC[Filtronic Compound Semiconductors]
Part No.	FPD2250
OCR Text	...ontrol measures can be found in mil-std-1686 and MIL-HDBK-263. ASSEMBLY INSTRUCTIONS The recommended die attach is gold/tin eutectic solder under a nitrogen atmosphere. Stage temperature should be 280-290C; maximum time at temperature is on...
Description	1.5W POWER PHEMT
File Size	180.89K / 2 Page	View it Online	Download Datasheet

				Filtronic Compound Semiconductors
Part No.	FMA3014
OCR Text	...n wedge bonding with 0.7 or 1.0 mil (0.018 or 0.025 mm) gold wire. Stage temperature should be 250-260C. Bonds should be made from the die f...STD-1686 and MIL-HDBK-263. APPLICATION NOTES & DESIGN DATA: Application Notes and design data in...
Description	12.7-16GHZ MMIC LIMITING AMPLIFIER
File Size	196.10K / 6 Page	View it Online	Download Datasheet

				Filtronic Compound Semiconductors
Part No.	FMA3016-QFN
OCR Text	...evaluation board material is 30-mil thick ROGERS RT4350. All RF tracks should be 50-ohm characteristic material SMA RF edge connector DC con...STD-1686 and MIL-HDBK-263. DISCLAIMERS: This product is not designed for use in any space based ...
Description	3.5GHz High Power Amplifier for WiMAX applications
File Size	613.90K / 6 Page	View it Online	Download Datasheet

				Filtronic Compound Semi... FILTRONIC[Filtronic Compound Semiconductors]
Part No.	LP750
OCR Text	...ontrol measures can be found in mil-std-1686 and MIL-HDBK-263. ASSEMBLY INSTRUCTIONS The recommended die attach is gold/tin eutectic solder under a nitrogen atmosphere. Stage temperature should be 280-290C; maximum time at temperature is on...
Description	0.5 W POWER PHEMT
File Size	33.95K / 2 Page	View it Online	Download Datasheet

				FILTRONIC[Filtronic Compound Semiconductors]
Part No.	FPD1050
OCR Text	...ontrol measures can be found in mil-std-1686 and MIL-HDBK-263. ASSEMBLY INSTRUCTIONS The recommended die attach is gold/tin eutectic solder under a nitrogen atmosphere. Stage temperature should be 280-290C; maximum time at temperature is on...
Description	0.75W POWER PHEMT
File Size	174.13K / 2 Page	View it Online	Download Datasheet

				M/A-COM Technology Solu...
Part No.	MAAM26100 MAAM26100-15
OCR Text	...ll or wedge bond with 1.0 mil diameter gold wire of 3.0 mil x 0.5 mil ribbon. thermosonic bonding with a nominal stage temperature of 150c and a ball bonding force of 40 to 50 grams or wedge bonding ...
Description	GaAs MMIC Power Amplifier
File Size	749.87K / 5 Page	View it Online	Download Datasheet

For mil-std-1686 Found Datasheets File :: 257 Search Time::0.859ms
Page :: | 1 | 2 | 3 | 4 | 5 | <6> | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |