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  MA4E2508M-1112 Datasheet PDF File

For MA4E2508M-1112 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | <6> | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

    TH71112

ETC[ETC]
Part No. TH71112
Description 868/915MHz FSK/FM/ASK Receiver

File Size 667.02K  /  20 Page

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Amphenol Communications Solutions

Part No. 10136647-031112LF
Description Minitek® Pwr 4.2, Single Row, Vertical Through Hole Header, Nylon 66, Tin plating, Natural Color, 3 Positions, GW Compatible, without Posts, Tray packing.
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    SavantIC
Part No. 2SA1112
Description (2SA1111 / 2SA1112) SILICON POWER TRANSISTOR

File Size 153.62K  /  4 Page

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Amphenol Communications Solutions

Part No. G832MC111202122HR
Description 0.80mm Board-to-Board 100Ω Connector, Pitch 0.8mm, Height 4.7 mm, 120 Positions, Dual Row, BTB Vertical Plug SMT, 15u\\ Gold Black.
Tech specs    

Official Product Page

    VTP1112

PERKINELMER[PerkinElmer Optoelectronics]
Part No. VTP1112
Description VTP Process Photodiodes

File Size 19.90K  /  1 Page

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Amphenol Communications Solutions

Part No. 54242-111202300LF
Description BergStik<sup>®<sup>, Board to Board connector, 2.54mm (0.100in), Unshrouded vertical stacking Header, Surface Mount, Double Row, 20 Positions
Tech specs    

Official Product Page

    TIM1112-4

Toshiba Semiconductor
Part No. TIM1112-4
Description MICROWAVE POWER GaAs FET

File Size 155.58K  /  5 Page

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Amphenol Communications Solutions

Part No. G832MC111204322HR
Description 0.80mm Board-to-Board 100Ω Connector, Pitch 0.8mm, Height 6.7 mm, 120 Positions, Dual Row, BTB Vertical Plug SMT, 8u\\ Gold Black.
Tech specs    

Official Product Page

    TIM1112-2

Toshiba Semiconductor
Part No. TIM1112-2
Description MICROWAVE POWER GaAs FET

File Size 153.41K  /  5 Page

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Amphenol Communications Solutions

Part No. 20021112-00098T1LF
Description Minitek127®, Board to Board connector, Unshrouded Right Angled Header, Through Hole, Double Row, 98 Positions, 1.27 mm (.050in) Pitch.
Tech specs    

Official Product Page

    NTE[NTE Electronics]
Part No. NTE1112
Description Integrated Circuit Audio Power Amplifier, 4W @ 24V

File Size 77.05K  /  2 Page

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Amphenol Communications Solutions

Part No. 10018783-11112TLF
Description PCI Express® GEN 3 Card Edge, Storage and Server Connector, Vertical, Through Hole, x8, 98 Positions, 1.00mm (0.039in) Pitch
Tech specs    

Official Product Page

    HOSIDEN CORP
Part No. CCD1112
Description PCB CONNECTOR

File Size 57.06K  /  1 Page

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Amphenol Communications Solutions

Part No. 94611-123HLF
Description BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Single Row, 23 Positions, 2.54 mm (0.100in) Pitch.
Tech specs    

Official Product Page

    BCM1112

Broadcom Corp.
Broadcom Corporation.
Part No. BCM1112
Description VOICE OVER IP CPE ENGINE
VoIP CPE Engine

File Size 87.99K  /  2 Page

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Amphenol Communications Solutions

Part No. 20021112-00094T1LF
Description Minitek127®, Board to Board connector, Unshrouded Right Angled Header, Through Hole, Double Row, 94 Positions, 1.27 mm (.050in) Pitch.
Tech specs    

Official Product Page

   
Part No. FR1112C
Description SINGLE COLOR LED, RED, 1.2 mm

File Size 249.85K  /  16 Page

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Amphenol Communications Solutions

Part No. 20021112-00096T4LF
Description Minitek127®, Board to Board connector, Unshrouded Right Angled Header, Through Hole, Double Row, 96 Positions, 1.27 mm (.050in) Pitch.
Tech specs    

Official Product Page

    KSR1112

Samsung Electronic
Samsung semiconductor
Part No. KSR1112
Description NPN SWITCHING APPLICATION)

File Size 32.66K  /  1 Page

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Amphenol Communications Solutions

Part No. 20021112-00038T4LF
Description Minitek127®, Board to Board connector, Unshrouded Right Angled Header, Through Hole, Double Row, 38 Positions, 1.27 mm (.050in) Pitch.
Tech specs    

Official Product Page

For MA4E2508M-1112 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | <6> | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

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