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  layer-iii Datasheet PDF File

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    SP7662EB SP7662ER SP76621 SP7662

SIPEX[Sipex Corporation]
Part No. SP7662EB SP7662ER SP76621 SP7662
OCR Text ...gure 17. SP7662EB PC Layout 2nd Layer Side Figure 18. SP7662EB PC Layout 3rd Layer Side Figure 19. SP7662EB PC Layout Bottom Side Figure 20. SP7662EB PC Layout Bottom Side Components Feb21-07 SP7662 Evaluation Manual Page 10 ...
Description Evaluation Board Manual

File Size 542.15K  /  11 Page

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    SP7661EB SP7661ER SP76611 SP7661

SIPEX[Sipex Corporation]
Part No. SP7661EB SP7661ER SP76611 SP7661
OCR Text ...gure 12. SP7661EB PC Layout 2nd Layer Side Feb21-07 SP7661 Evaluation Manual Page 9 of 11 (c)2007 Sipex Corporation Figure 13. S...III Loop Compensation Calculator: Sipexsupport@sipex.com http://www.sipex.com/content.aspx?p=support...
Description Evaluation Board Manual

File Size 382.56K  /  11 Page

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    SIPEX[Sipex Corporation]
Part No. SP6133_06 SP6133 SP6133EB SP6133ER1 SP613306
OCR Text ...e 16. SP6133EB PCB Layout Inner Layer 1 & Inner Layer 2 Rev 3/30/06 SP6133 Evaluation Manual Page 9 of 10 Copyright 2006 Sipex Corporation Table 2: SP6133EB List of Materials Line No. 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 ...
Description Evaluation Board Manual

File Size 503.76K  /  10 Page

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Part No. C1206N82931G4C C1206N10931G4C CDR31BP151B3W4 CDR32BP151B3W4 CDR01BP390BJW4 C0805N30131G4C C1812P393K1X4C
OCR Text ...rminations use a nickel barrier layer and a tin overplate to provide excellent solderability for the customer. kemet multilayer ceramic chip...iii dielectrics (including x7r, x5r, z5u & y5v), the first symbol indicates the lower limit of the o...
Description CERAMIC CHIP CAPACITORS

File Size 2,099.47K  /  30 Page

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    EP3C25 EP3C80 EP1C12 EP2C8 EP2C50 EP1C6 EP2C5 EP2C20 EP2C35 EP3C10 EP3C55 EP3C40 EP2C70 EP1C20 EP3C16 EP3C120 EP3C5

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Altera Corporation
Part No. EP3C25 EP3C80 EP1C12 EP2C8 EP2C50 EP1C6 EP2C5 EP2C20 EP2C35 EP3C10 EP3C55 EP3C40 EP2C70 EP1C20 EP3C16 EP3C120 EP3C5
OCR Text ...otes to Table 3: (1) (2) Power layer Cu thickness 35 um, Cu 90% Signal layer Cu thickness 17 um, Cu 15% (Part 2 of 2) Package Dimensions...III devices on a typical board. Table 4. Thermal Resistance of Cyclone III Devices for Typical Bo...
Description Cyclone Series Device Thermal Resistance

File Size 80.37K  /  7 Page

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    MPC8280 MPC8270

Freescale Semiconductor, Inc
Part No. MPC8280 MPC8270
OCR Text ... ATM Transmission Convergence Layer Fast Ethernet Controller FCC HDLC Controller FCC Transparent Controller Serial Peripheral Interface (S...III The Hardware Interface Chapter 6 External Signals 6.1 6.2 Functional Pinout .......................
Description PowerQUICC II Family Reference Manual
PowerQUICC?/a> II Family Reference Manual

File Size 9,588.85K  /  1386 Page

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    MPC8270 MPC828007 MPC8280

Freescale Semiconductor, Inc
Part No. MPC8270 MPC828007 MPC8280
OCR Text ... ATM Transmission Convergence Layer Fast Ethernet Controller FCC HDLC Controller FCC Transparent Controller Serial Peripheral Interface (S...III The Hardware Interface Chapter 6 External Signals 6.1 6.2 Functional Pinout .......................
Description PowerQUICC⑩ II Family Reference Manual

File Size 9,024.70K  /  1386 Page

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