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  heating cooling Datasheet PDF File

For heating cooling Found Datasheets File :: 2883    Search Time::0.828ms    
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    SEOUL[Seoul Semiconductor]
Part No. THBTGFR422
OCR Text ...le (1) Lead Solder -Preliminary heating to be at 150max. for 2 minutes max. -Soldering heat to be at 240max. for 5 seconds max. LED Surface...cooling: -5C/sec. 120 0 60 to 120 sec. 5sec. max (2) Lead Free Solder -Preliminary heating ...
Description CHIP LED DEVICE

File Size 295.02K  /  7 Page

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    C2-R22J-10

Superworld Electronics
Part No. C2-R22J-10
OCR Text ... conditions C2 SERIES Pre-heating should be in such a way that the temperature difference between solder and ferrite surface is limited to 150C max. Also cooling into the solvent after soldering should be in such a way that the temper...
Description CERAMIC CHIP INDUCTORS

File Size 373.59K  /  7 Page

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    NB104-S

Seoul Semiconductor
Part No. NB104-S
OCR Text ... (1) Lead Solder -Preliminary heating to be at 150max. for 2 minutes max. -Soldering heat to be at 240max. for 5 seconds max. LED Surface...cooling: -5C/sec. 120 0 60 to 120 sec. 5sec. max (2) Lead-Free Solder -Preliminary heating ...
Description CHIP LED DEVICE

File Size 360.88K  /  8 Page

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    GANGES TECHNOLOGY
Part No. HCB1608K-121T20 HCB3216K-121T20 HCB1608K-151T20 HCB5750V-151T30 HCB3225K-201T40
OCR Text ... P6. www.DataSheet4U.com PRE-heating SOLDERING NATURAL cooling P5. PRE-heating SOLDERING NATURAL cooling PRE-heating SOLDERING NATURAL cooling TEMPERATURE C TEMPERATURE C 0 0 Top cover tape 150 (302...
Description Ferrite Chip Bead

File Size 232.94K  /  9 Page

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    PZT651T1 ON2780 PZT65

ONSEMI[ON Semiconductor]
Part No. PZT651T1 ON2780 PZT65
OCR Text ...data sheet. When using infrared heating with the reflow soldering method, the difference should be a maximum of 10C. * The soldering temp...cooling should be used as the use of forced cooling will increase the temperature gradient and resul...
Description From old datasheet system
HIGH CURRENT NPN SILICON TRANSISTOR SURFACE MOUNT

File Size 101.17K  /  6 Page

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    MBRV7030CTL MBRV7030CTL_D ON0481

Motorola, Inc.
ON Semi
MOTOROLA[Motorola, Inc]
Part No. MBRV7030CTL MBRV7030CTL_D ON0481
OCR Text ...data sheet. When using infrared heating with the reflow soldering method, the difference shall be a maximum of 10C. * The soldering temperat...cooling should be used as the use of forced cooling will increase the temperature gradient and resul...
Description TOOLS, ELECTRONIC KITS RoHS Compliant: NA
SWIRCHMODE Schottky Power Rectifier(D3PAK Power Surface Mount Pakage)
70 AMPERES 30 VOLTS
From old datasheet system
SWIRCHMODE⑩ Schottky Power Rectifier(D3PAK Power Surface Mount Pakage)

File Size 154.71K  /  8 Page

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    Motorola
Part No. MSD1010T1
OCR Text ...ata sheet. when using infrared heating with the reflow soldering method, the difference should be a maximum of 10 c. ? the soldering temp...cooling should be used as the use of forced cooling will increase the temperature gradient and res...
Description PNP Silicon Driver Transistors

File Size 95.88K  /  4 Page

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    http://
SEOUL[Seoul Semiconductor]
Seoul Semicondutctor Inc.
Part No. SSC-ZHBTGFR421 SEOULSEMICONDUCTORCOLTD-SSC-ZHBTGFR421
OCR Text ...le (1) Lead Solder -Preliminary heating to be at 150max. for 2 minutes max. -Soldering heat to be at 240max. for 5 seconds max. LED Surface...cooling: -5C/sec. 120 0 60 to 120 sec. 5sec. max (2) Lead Free Solder -Preliminary heating ...
Description CHIP LED DEVICE

File Size 303.88K  /  7 Page

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    2SA1162GT1 2SA1162YT1 2SA1162GT1/D

Toshiba, Corp.
ON Semiconductor
Part No. 2SA1162GT1 2SA1162YT1 2SA1162GT1/D
OCR Text ...data sheet. When using infrared heating with the reflow soldering method, the difference should be a maximum of 10C. * The soldering temp...cooling should be used as the use of forced cooling will increase the temperature gradient and resul...
Description General Purpose Amplifier Transistors 通用晶体管放大器

File Size 46.39K  /  6 Page

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For heating cooling Found Datasheets File :: 2883    Search Time::0.828ms    
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