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SEOUL[Seoul Semiconductor]
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| Part No. |
THBTGFR422
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| OCR Text |
...le (1) Lead Solder -Preliminary heating to be at 150max. for 2 minutes max. -Soldering heat to be at 240max. for 5 seconds max.
LED Surface...cooling: -5C/sec.
120
0 60 to 120 sec. 5sec. max
(2) Lead Free Solder -Preliminary heating ... |
| Description |
CHIP LED DEVICE
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| File Size |
295.02K /
7 Page |
View
it Online |
Download Datasheet
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Motorola
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| Part No. |
MSD1010T1
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| OCR Text |
...ata sheet. when using infrared heating with the reflow soldering method, the difference should be a maximum of 10 c. ? the soldering temp...cooling should be used as the use of forced cooling will increase the temperature gradient and res... |
| Description |
PNP Silicon Driver Transistors
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| File Size |
95.88K /
4 Page |
View
it Online |
Download Datasheet
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http:// SEOUL[Seoul Semiconductor] Seoul Semicondutctor Inc.
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| Part No. |
SSC-ZHBTGFR421 SEOULSEMICONDUCTORCOLTD-SSC-ZHBTGFR421
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| OCR Text |
...le (1) Lead Solder -Preliminary heating to be at 150max. for 2 minutes max. -Soldering heat to be at 240max. for 5 seconds max.
LED Surface...cooling: -5C/sec.
120
0 60 to 120 sec. 5sec. max
(2) Lead Free Solder -Preliminary heating ... |
| Description |
CHIP LED DEVICE
|
| File Size |
303.88K /
7 Page |
View
it Online |
Download Datasheet
|
|

Price and Availability
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