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2SC2983 M63994P 90709 2SK3573 1N5407 MAX728 232PCLR R0547B02
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  flip-die Datasheet PDF File

For flip-die Found Datasheets File :: 2580    Search Time::1.484ms    
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    意法半导
Part No. L6316
OCR Text ... pattern, iw = 40ma, max ovs). flip chip package.l6316 differential voltage bias / voltage sense architecture. current bias available pr...die over temperature detect, analog temperature measurement. fast write-to-read recovery 150ns (ma...
Description 4-CHANNEL LOW POWER PREAMPLIFIER

File Size 35.88K  /  6 Page

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    Sussex Semiconductor
Part No. 1N419XA 1N418XA 1N417XA 1N498XA 1N497XA
OCR Text ...ssivated surface mount unipolar flip-die zener voltage- 6.8 to 200 volts .5 to 10 watt maximum power dissipation .5 to 10 watt unipolar zener flip-die custom ordering specifier szfd - - - die specifications unipolar ze...
Description (1N4xxxA) Zener Diodes

File Size 178.47K  /  7 Page

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    MA4E1317

Tyco Electronics
Part No. MA4E1317
OCR Text flip chip schottky barrier diodes m/a - com inc. and its affiliates reserve the right to make changes to the product(s) or information...die can also be assembled with the junction side up, and wire or ribbon bonds made to the pad...
Description (MA4E1317 - MA4E1319) GaAs Flip Chip Schottky Barrier Diodes

File Size 183.55K  /  5 Page

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    AD9901 AD9901KP AD9901KQ AD9901TQ_883 AD9901TE_883 AD9901CHIPS AD9901TE/883 AD9901TE/883B AD9901TQ/883 AD9901TQ/883B AD9

Analog Devices, Inc.
AD[Analog Devices]
Part No. AD9901 AD9901KP AD9901KQ AD9901TQ_883 AD9901TE_883 AD9901CHIPS AD9901TE/883 AD9901TE/883B AD9901TQ/883 AD9901TQ/883B AD9901-15
OCR Text ...CK DIAGRAM D REFERENCE INPUT FLIP-FLOP REFERENCE INPUT Q D Q Q REFERENCE FREQUENCY DISCRIMINATOR FLIP-FLOP Q R OUTPUT OUTP...DIE LAYOUT AND MECHANICAL INFORMATION REFERENCE IN (-VS) GND (REFERENCE IN) +VS (GND) OUTPUT RSET ...
Description    Ultrahigh Speed Phase/Frequency Discriminator

File Size 156.93K  /  8 Page

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    SGS Thomson Microelectronics
Part No. AN1553
OCR Text Flip-Chip 300m recommendations for Audio Power Amplifier by Jean-Marc BUGNARD 1 - INTRODUCTION The competitive market of portable equipm...Die size and bumps count are adapted to the connection requirements. The Flip-Chip CSPs' tolerance o...
Description FLIP CHIP 300MICRONSM RECOMMENDATIONS FOR AUDIO POWER AMPLIFIER

File Size 68.17K  /  6 Page

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    SGS Thomson Microelectronics
Part No. AN1547
OCR Text Flip-Chip 170m recommendations for Audio Power Amplifier by Jean-Marc BUGNARD 1 - INTRODUCTION The competitive market of portable equipm...Die size and bumps count are adapted to the connection requirements. The Flip-Chip CSPs' tolerance o...
Description FLIP CHIP 170MICRONSM RECOMMENDATIONS FOR AUDIO POWER AMPLIFIERS

File Size 68.82K  /  6 Page

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    SiliconBlue
Part No. ICE65L04
OCR Text ...ut look - up tables (lut4) and flip - flops ? low - power logic and interconnect ? on - chip, 4kbit ram blocks; 20 per device ...die photo (magnified) table 1 : ice65 ultra low - power programmable logic family summa...
Description Ultra Low-Power FPGA Known Good Die

File Size 571.64K  /  8 Page

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    FCCSP

Amkor Technology
Part No. FCCSP
OCR Text ...kage sizes from 3 mm to 15 mm ? flip chip bump pitches of 150 m min. for peripheral array, 250 m min. for area array ? available in 0.5...die, 0.8 mm pitch, 0.6 mm mold cap ? 0 lfpm, 4 layer pc board ? junction ambient thermal resistance ...
Description a flip chip solution in a CSP package format.

File Size 116.26K  /  2 Page

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