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Amphenol Communications Solutions |
| Part No. |
95293-501B10LF
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| Description |
BergStik®, Board to Board connector, Unshrouded vertical header, Surface mount, Single Row,10 Positions, 2.54 mm (0.100in) Pitch.
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
95293-101B10LF
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| Description |
BergStik®, Board to Board connector, Unshrouded vertical header, Surface mount, Single Row,10 Positions, 2.54 mm (0.100in) Pitch.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
G861B10214T9P2HR
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| Description |
Board mount - Header Receptacle - Wire to Board 2.0mm Pitch Vertical DIP,2x5Pin,15u\\ Gold,NY4T,Tail=2.0mm,Latch Type,With Post,Color-Black,Tray
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
G861B10212T9HR
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| Description |
Board mount - Header Plug - Protect Header 2.0mm Pitch Vertical Dip,2x5Pin,15u\\ Gold,NY4T,Latch Type,Tail=2.0mm
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
G881B10102KEU
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| Description |
Micro Power 3.0 Connector System - G881 Series, Wire to Board connector, , Vertical, Single row, 3.0mm pitch, 10 positions , 100u\\ Tin, 3.18mm tail length, LCP, Black, TRAY
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
95278-501B10LF
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| Description |
BergStik®, Board to Board connector, Unshrouded Header, SMT, Double Row, 10 Positions, 2.54 mm Pitch, 5.84 mm (0.23 in.) Mating
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Official Product Page
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Kemet Corporation
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| Part No. |
T591B107M004ATE070
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| Description |
T591, Tantalum, Polymer Tantalum, 100 uF, 20%, 4 VDC, SMD, Polymer, Molded, Low ESR, 70 mOhms, 3528, Height Max = 2.1mm
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| File Size |
67.92K /
1 Page |
 View
it Online |
Download Datasheet
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Amphenol Communications Solutions |
| Part No. |
G861B10312T9HR
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| Description |
Board mount - Header Plug - Protect Header 2.0mm Pitch Vertical Dip,2x5Pin,Gold Flash,NY4T,Latch Type,Tail=2.0mm
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| Tech specs |
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Official Product Page
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Kemet Corporation
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| Part No. |
M3253502E1B101JZMB-R M3253502E1B101JZMB-T
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| Description |
SMD MIL C0G PRF32535, Ceramic, Military/High Reliability, 100 pF, 5%, 100 V, C0G, SMD, Low ESR, MIL-PRF-32535, N/A, 0402
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| File Size |
51.10K /
1 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
G861B1011AT6REU
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| Description |
Board mount - Header Plug - Protect Header 2.0mm Pitch Vertical Dip,2x5Pin,Matte Tin,NY9T,Tail=2.1mm,T&R With CAP
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| Tech specs |
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Official Product Page
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Kemet Corporation
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| Part No. |
M3253503E1B102JZMB-R M3253503E1B102JZMB-T
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| Description |
SMD MIL C0G PRF32535, Ceramic, Military/High Reliability, 1000 pF, 5%, 100 V, C0G, SMD, Low ESR, MIL-PRF-32535, N/A, 0603
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| File Size |
51.07K /
1 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
95278-801B10LF
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| Description |
BergStik®, Board to Board connector, Unshrouded Header, SMT, Double Row, 10 Positions, 2.54 mm Pitch, 5.84 mm (0.23 in.) Mating
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| Tech specs |
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Official Product Page
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Kemet Corporation
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| Part No. |
M3253503E1B101JZMB-R M3253503E1B101JZMB-T
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| Description |
SMD MIL C0G PRF32535, Ceramic, Military/High Reliability, 100 pF, 5%, 100 V, C0G, SMD, Low ESR, MIL-PRF-32535, N/A, 0603
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| File Size |
51.08K /
1 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
95278-401B10LF
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| Description |
BergStik®, Board to Board connector, Unshrouded Header, SMT, Double Row, 10 Positions, 2.54 mm Pitch, Vertical, Tin plating, 5.84 mm (0.23 in.) Mating
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| Tech specs |
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Official Product Page
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Bom2Buy.com
Price and Availability
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