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For crack Found Datasheets File :: 594    Search Time::1.188ms    
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    1473418-1 1473416-1 1473416-2 1473418-2 3-1437285-0 3-1437285-1 3-1437285-2 3-1437290-7 1747359-1 1747359-2 1-1447232-7

Tyco Electronics
Part No. 1473418-1 1473416-1 1473416-2 1473418-2 3-1437285-0 3-1437285-1 3-1437285-2 3-1437290-7 1747359-1 1747359-2 1-1447232-7 6437288-1 6437288-2 6437288-3 6437288-4 6437288-5 2-1437285-2 2-1437285-3 2-1437285-5 1437288-1 1437288-3 1437288-4 1437288-5 1437288-6 6473418-2 4-1437290-0 4-1437290-1 3-1437290-8 3-1437290-9
OCR Text ... there shall be no detrimental crack,rust,play, scratch,deformation and etc. 7.2 feeling on mating /unmating feeling is verified by mating and unmating the cont act,housing and connector there should be no detrimental binding...
Description SUPER SEAL CONNECTOR
   SUPER SEAL CONNECTOR

File Size 881.62K  /  41 Page

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HIROSE[Hirose Electric]
Hirose Electric USA, INC.
HIROSE ELECTRIC Co., Ltd.
Part No. DF1EC-2P-2.5DSA DF1E-02P-2.5DS DF1E-2RS_P-2.5 DF1E-2S-2.5C DF1E-30SCF DF1EA-2EP-2.5C DF1E-2RS/P-2.5
OCR Text .... 5. Means to Prevent Solder crack The glass enforcement resin is adopted for the pin header to prevent a solder crack to occur due to heat compression. 8. Correspond to Automatic Insertion Machine The radial tape packaging is provi...
Description 2.5mm Pitch Connector for Full Lock and Discrete Wire Connection 2.5毫米间距连接器全部锁和离散线连接

File Size 392.80K  /  16 Page

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    GRM0225C1C7R3DD05 GRM0335C2A6R9DA01 GRM0335C1E330JA01D GRM0335C2A6R4DA01 GRM0335C2A6R3CA01 GRM0335C2A6R7WA01 GRM0335C2A6

Murata Manufacturing Co., Ltd.
Murata Manufacturing Co., L...
Murata Manufacturing Co...
Part No. GRM0225C1C7R3DD05 GRM0335C2A6R9DA01 GRM0335C1E330JA01D GRM0335C2A6R4DA01 GRM0335C2A6R3CA01 GRM0335C2A6R7WA01 GRM0335C2A6R8WA01 GRM0335C2A6R4WA01 GRM0335C2A6R7DA01 GRM0335C2A6R8CA01 GRM0335C2A6R9BA01 GRM0335C2A7R0BA01 GRM0335C2A6R4BA01 GRM0335C2A6R5DA01 GRM0335C2A6R6BA01 GRM0335C2A6R8BA01 GRM0335C2A6R3BA01 GRM0335C2A6R4CA01 GRM0335C2A6R6WA01 GRM0335C2A6R9CA01 GRM0335C2A7R0DA01 GRM0335C2A6R3DA01 GRM0335C2A6R5BA01 GRM0335C2A6R5CA01 GRM0335C2A6R6CA01 GRM0335C2A6R6DA01 GRM0335C2A6R7CA01 GRM0335C2A6R8DA01 GRM0335C2A6R9WA01 GRM0335C2A7R0CA01 GR3033B11H102KA01D GRJ054B11H102KA01D GRM155R60G475ME87D GRM155R60J475ME47D GRM0224C1CR80BD05 GRM188R61C106MA73D GRM0222C1C4R0WD05 GRM0222C1C4R2WD05 GRM0222C1C4R0BD05 GRM0222C1C4R0CD05 GRM0222C1C4R1BD05 GRM0222C1C4R1CD05 GRM0222C1C4R2BD05 GRM0222C1C4R2CD05 GRM0222C1C4R3BD05 GRM0222C1C4R3WD05 GRM0222C1C4R4BD05 GRM0222C1C4R4CD05 GR30DLB11H102KA01D GRJ0DLB11H102KA01D GRM0DLB11H102KA01D GRM0224C1CR60BD05 GRM0224C1CR90BD05 GRM0225C1C8R2WD05 GRM0223C1C3R2WD05 GRM0225C1C7R2WD05 GRM0225C1C180GD05 GRM0225C1C180JD05 GRM0225C1C9R7WD05 GRM0225C1C7R7WD05 GRM0225C1C8R0DD05 GRM0225C1C8R0WD05 GRM02EB11H102KA01D GRM0335C2A7R5BA01 GRM0335C2A5R5BA01 LLL153C80J104ME01E G
OCR Text ... compact anti- noise deflecting crack soldering crack hiq l x w dimension: products of 0.6 x 0.3 mm or less low dissipation for high frequency by devising ceramic materials and electrode materials, low dissipation is achieved in frequency b...
Description Chip Monolithic Ceramic Capacitors
   Chip Monolithic Ceramic Capacitors

File Size 3,979.11K  /  182 Page

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    GRM0224C1CR80BD05 GRM0224C1CR90WD05 GRM0224C1CR60BD05 GRM0224C1CR90BD05 GRM0225C1C180GD05 GRM31A5C2J330JW01D GRM0225C1C1

Murata Manufacturing Co., Ltd.
Murata Manufacturing Co...
Part No. GRM0224C1CR80BD05 GRM0224C1CR90WD05 GRM0224C1CR60BD05 GRM0224C1CR90BD05 GRM0225C1C180GD05 GRM31A5C2J330JW01D GRM0225C1C100GD05 GA355XR7GB563KW06L GRM0225C1C220GD05 GRM0225C1C180JD05
OCR Text ... compact anti- noise deflecting crack soldering crack hiq l x w dimension: products of 0.6 x 0.3 mm or less low dissipation for high frequency by devising ceramic materials and electrode materials, low dissipation is achieved in frequency b...
Description Chip Monolithic Ceramic Capacitors (Medium Voltage)

File Size 4,713.55K  /  237 Page

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    RA05H9595M RA05H9595M-101

Mitsubishi Electric Semicon...
Mitsubishi Electric Semiconductor
Part No. RA05H9595M RA05H9595M-101
OCR Text ...amic substrate in the module to crack by bending forces, either immediately when driving screws or later when thermal expansion forces are added). A thermal compound between module and heat sink is recommended for low thermal contact resist...
Description RF MOSFET MODULE 952-954MHz 5W 14V, 3 Stage Amp.

File Size 79.15K  /  7 Page

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    LZ2416J

SHARP[Sharp Electrionic Components]
Part No. LZ2416J
OCR Text ...s added to a lead could cause a crack in the low melting point glass in the jointed part of the lead. Low melting point glass Lead (In the case of plastic packages) - The leads of the package are fixed with package body (plastic), so st...
Description Dual-power-supply (5 V/12 V) Operation 1/4-type B/W CCD Area Sensor with 270 k Pixels

File Size 86.23K  /  12 Page

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    Electronic Theatre Controls, Inc.
MITSUBISHI[Mitsubishi Electric Semiconductor]
Part No. RA06H8285M RA06H8285M-E01 RA06H8285M-01
OCR Text ...amic substrate in the module to crack by bending forces, either immediately when driving screws or later when thermal expansion forces are added). A thermal compound between module and heat sink is recommended for low thermal contact resist...
Description MITSUBISHI RF MOSFET MODULE

File Size 56.33K  /  8 Page

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    PMC-Serria
Part No. PMC-951041
OCR Text ...ation may cause the packages to crack and/ or wirebonds to break resulting in a non-functional circuit. The objective of this document is to outline the process that must be followed, by PMC-Sierra and its customers to ensure that the moist...
Description
File Size 144.59K  /  24 Page

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    RA30H0608M RA30H0608M-01 RA30H0608M-E01

Mitsubishi Electric, Corp.
MITSUBISHI[Mitsubishi Electric Semiconductor]
Mitsubishi Electric Corporation
Part No. RA30H0608M RA30H0608M-01 RA30H0608M-E01
OCR Text ...amic substrate in the module to crack by bending forces, either immediately when driving screws or later when thermal expansion forces are added). A thermal compound between module and heat sink is recommended for low thermal contact resist...
Description 68-88MHz 30W 12.5V MOBILE RADIO 68 - 88MHz功率30W 12.5V移动通信

File Size 56.04K  /  9 Page

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    GRM0225C1CR80BD05 GM022E1X0ER50E01L GM022E2C0ER50E01L GM022E2C0G1R0E01L GM023E1X0ER50E01L GM023E1X0GR50E01L GM022E1X0G1R

Murata Manufacturing Co., Ltd.
Murata Manufacturing Co., L...
Murata Manufacturing Co...
Part No. GRM0225C1CR80BD05 GM022E1X0ER50E01L GM022E2C0ER50E01L GM022E2C0G1R0E01L GM023E1X0ER50E01L GM023E1X0GR50E01L GM022E1X0G1R0E01L GM022E1X0GR50E01L GM022E2C0E1R0E01L GM022E2C0GR50E01L GM023E1X0E1R0E01L GM023E1X0G1R0E01L GM023E2C0E1R0E01L GM023E2C0ER50E01L GM023E2C0G1R0E01L GRM55DR72E105KW01L GRM155R71H391KA01D GRM2165C1H202JA01D GRM0225C1CR60BD05 GRM0225C1CR90BD05 GRM0225C1CR90WD05 GRM0225C1C1R7WD05 GRM0225C1CR20WD05 GRM0225C1CR20BD05 GRM0225C1C2R0BD05 GRM0225C1C2R0CD05 GRM0225C1C2R0WD05 GJ022E1X0ER50E01L GJ023E1X0E1R0E01L
OCR Text ... compact anti- noise deflecting crack soldering crack hiq l x w dimension: products of 0.6 x 0.3 mm or less low dissipation for high frequency by devising ceramic materials and electrode materials, low dissipation is achieved in frequency b...
Description Chip Monolithic Ceramioc Capacitors
Chip Monolithic Ceramic Capacitors
   Chip Monolithic Ceramic Capacitors

File Size 3,973.91K  /  182 Page

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For crack Found Datasheets File :: 594    Search Time::1.188ms    
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