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Electronic Theatre Controls, Inc. MITSUBISHI[Mitsubishi Electric Semiconductor]
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| Part No. |
RA06H8285M RA06H8285M-E01 RA06H8285M-01
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| OCR Text |
...amic substrate in the module to crack by bending forces, either immediately when driving screws or later when thermal expansion forces are added). A thermal compound between module and heat sink is recommended for low thermal contact resist... |
| Description |
MITSUBISHI RF MOSFET MODULE
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| File Size |
56.33K /
8 Page |
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it Online |
Download Datasheet
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PMC-Serria
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| Part No. |
PMC-951041
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| OCR Text |
...ation may cause the packages to crack and/ or wirebonds to break resulting in a non-functional circuit. The objective of this document is to outline the process that must be followed, by PMC-Sierra and its customers to ensure that the moist... |
| Description |
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| File Size |
144.59K /
24 Page |
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it Online |
Download Datasheet
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Price and Availability
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