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  CCM04-1317 Datasheet PDF File

For CCM04-1317 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | <6> | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

    CCM04-5111 CCM04-5112 CCM04-5113 CCM04-5115 CCM04-5116 CCM04-5130 CCM04-5131 CCM04-5132 CCM04-5137 CCM04-5129 CCM04-4248

ITT[ITT Industries]
Part No. CCM04-5111 CCM04-5112 CCM04-5113 CCM04-5115 CCM04-5116 CCM04-5130 CCM04-5131 CCM04-5132 CCM04-5137 CCM04-5129 CCM04-4248 CCM04-4251 CCM04-4333 CCM04-5106 CCM04-5107 CCM04-5120 CCM04-5121 CCM04-5122 CCM04-5123 CCM04-5125 CCM04-5127
Description Miniature Connectors

File Size 336.41K  /  5 Page

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Amphenol Communications Solutions

Part No. 131-7314-11D
Description Paladin® 112Gb/s Backplane Connector, 7-Pair, 4 Column, Left End Wall, Backplane Module, 1.5mm Wipe, Nickel Sulfamate.
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    M/A-COM Technology Solu...
Part No. MADS-001317-1500-16 MADS-001317-1500AP
Description Solderable GaAs Flip Chip Schottky Diode

File Size 558.15K  /  6 Page

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Amphenol Communications Solutions

Part No. 131-7616-11D
Description Paladin® 112Gb/s Backplane Connector, 7-Pair, 6 Column, Right Polarized, Backplane Module, 1.5mm Wipe, Nickel Sulfamate.
Tech specs    

Official Product Page

    MACOM[Tyco Electronics]
Part No. MADS-001317-1320AG
Description    GaAs Solder Bump Flip Chip Schottky Diode

File Size 109.97K  /  3 Page

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Amphenol Communications Solutions

Part No. 131-7318-11H
Description Paladin® 112Gb/s Backplane Connector, 7-Pair, 8 Column, Left End Wall, Backplane Module, 1.5mm Wipe, APP.
Tech specs    

Official Product Page

    MASW-004240-13170W

M/A-COM Technology Solutions, Inc.
Part No. MASW-004240-13170W
Description HMIC SP4T Surface Mount Silicon PIN Diode Switch
HMIC垄芒 SP4T Surface Mount Silicon PIN Diode Switch

File Size 248.43K  /  6 Page

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Amphenol Communications Solutions

Part No. 131-7114-21D
Description Paladin® 112Gb/s Backplane Connector, 7-Pair, 4 Column, Open Wall, Backplane Module, 2.25mm Wipe, Nickel Sulfamate.
Tech specs    

Official Product Page

    MADS-001317-1320AG

M/A-COM Technology Solutions, Inc.
Part No. MADS-001317-1320AG
Description GaAs Solder Bump Flip Chip Schottky Diode

File Size 142.20K  /  3 Page

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Amphenol Communications Solutions

Part No. 131-7416-21D
Description Paladin® 112Gb/s Backplane Connector, 7-Pair, 6 Column, Right End Wall, Backplane Module, 2.25mm Wipe, Nickel Sulfamate.
Tech specs    

Official Product Page

    MADS-001317-1500AP

Tyco Electronics
Part No. MADS-001317-1500AP
Description Solderable GaAs Flip Chip Schottky Diode

File Size 250.70K  /  6 Page

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Amphenol Communications Solutions

Part No. 131-7118-21H
Description Paladin® 112Gb/s Backplane Connector, 7-Pair, 8 Column, Open Wall, Backplane Module, 2.25mm Wipe, APP.
Tech specs    

Official Product Page

    2SK117 E001317

Toshiba Semiconductor
Part No. 2SK117 E001317
Description From old datasheet system
LOW NOISE AUDIO AMPLIFIER APPLICATONS
N CHANNEL JUNCTIONS TYPE (LOW NOISE AUDIO AMPLIFIER APPLICATIONS)

File Size 197.43K  /  3 Page

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Amphenol Communications Solutions

Part No. 131-7514-21H
Description Paladin® 112Gb/s Backplane Connector, 7-Pair, 4 Column, Left Polarized, Backplane Module, 2.25mm Wipe, APP.
Tech specs    

Official Product Page

    MRF559 MSC1317

MICROSEMI[Microsemi Corporation]
Part No. MRF559 MSC1317
Description From old datasheet system
RF & MICROWAVE DISCRETE LOW POWER TRANSISTORS

File Size 206.30K  /  5 Page

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Amphenol Communications Solutions

Part No. 131-7214-11D
Description Paladin® 112Gb/s Backplane Connector, 7-Pair, 4 Column, Double End Wall, Backplane Module, 1.5mm Wipe, Nickel Sulfamate.
Tech specs    

Official Product Page

    RN1318 RN1314 RN1315 RN1316 RN1317

Toshiba Corporation
Toshiba Semiconductor
Part No. RN1318 RN1314 RN1315 RN1316 RN1317
Description TOSHIBA Transistor Silicon NPN Epitaxial Type (PCT Process)

File Size 259.01K  /  8 Page

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Amphenol Communications Solutions

Part No. 131-7516-11D
Description Paladin® 112Gb/s Backplane Connector, 7-Pair, 6 Column, Left Polarized, Backplane Module, 1.5mm Wipe, Nickel Sulfamate.
Tech specs    

Official Product Page

    C67078-S1317-A3 BUZ73A

SIEMENS AG
SIEMENS[Siemens Semiconductor Group]
Part No. C67078-S1317-A3 BUZ73A
Description SIPMOS Power Transistor (N channel Enhancement mode Avalanche-rated)
From old datasheet system

File Size 182.59K  /  9 Page

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Amphenol Communications Solutions

Part No. 131-7218-11H
Description Paladin® 112Gb/s Backplane Connector, 7-Pair, 8 Column, Double End Wall, Backplane Module, 1.5mm Wipe, APP.
Tech specs    

Official Product Page

For CCM04-1317 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | <6> | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

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