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HOLTEK[Holtek Semiconductor Inc]
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| Part No. |
HTG1390 1390
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| OCR Text |
...9 935.39
These pins must be bonded out for functional testing.
4
17th Nov '98
Preliminary
Pad Description
Pad No.
17, 18 8 9...pairs R0,R1 and R2,R3 are used as a data memory pointer when the memory transfer instruction is exec... |
| Description |
From old datasheet system
4-bit Microcontroller
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| File Size |
423.31K /
27 Page |
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it Online |
Download Datasheet
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XILINX INC
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| Part No. |
XCV100-4HQ240C XCV100-4HQG240C XILINXINC-XCV600-4PQ240C XCV200-6HQ240C
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| OCR Text |
...0 packages, all v cco pins are bonded together internally, and consequently the same v cco voltage must be connected to all of them. in the cs144 package, bank pairs that share a side are intercon- nected internally, permitting four choic... |
| Description |
FPGA, 600 CLBS, 108904 GATES, 250 MHz, PQFP240
FPGA, 1176 CLBS, 236666 GATES, 333 MHz, PQFP240
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| File Size |
437.02K /
71 Page |
View
it Online |
Download Datasheet |
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bonded-pairs Found Datasheets File :: 69 Search Time::1.171ms
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