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Molex Electronics Ltd.
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| Part No. |
87911-4011 0879114011
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| Description |
2.54mm (.100) Pitch C-Grid庐 Header, Right Angle, Through Hole, 40 Circuits, 0.38渭m (15渭) Gold (Au) Selective Plating, Tube Packaging, Lead-free
2.54mm (.100) Pitch C-Grid? Header, Right Angle, Through Hole, 40 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Tube Packaging, Lead-free
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| File Size |
360.70K /
6 Page |
 View
it Online |
Download Datasheet
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Amphenol Communications Solutions |
| Part No. |
131-6116-11H
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| Description |
Paladin® 112Gb/s Backplane Connector, 6-Pair, 6 Column, Open Wall, Backplane Module, 1.5mm Wipe, APP.
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
87911-6411 0879116411
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| Description |
2.54mm (.100) Pitch C-Grid庐 Header, Right Angle, Through Hole, 64 Circuits, 0.38渭m (15渭) Gold (Au) Selective Plating, Tube Packaging, Lead-free
2.54mm (.100) Pitch C-Grid? Header, Right Angle, Through Hole, 64 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Tube Packaging, Lead-free
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| File Size |
360.70K /
6 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
131-6116-11D
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| Description |
Paladin® 112Gb/s Backplane Connector, 6-Pair, 6 Column, Open Wall, Backplane Module, 1.5mm Wipe, Nickel Sulfamate.
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
87911-8011 0879118011
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| Description |
2.54mm (.100) Pitch C-Grid庐 Header, Right Angle, Through Hole, 80 Circuits, 0.38渭m (15渭) Gold (Au) Selective Plating, Tube Packaging, Lead-free
2.54mm (.100) Pitch C-Grid? Header, Right Angle, Through Hole, 80 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Tube Packaging, Lead-free
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| File Size |
360.70K /
6 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
20021611-00012T1LF
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| Description |
1.27mm (0.05in.) pitch, Header with eject latch, 12 contacts
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
20021611-00030T1LF
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| Description |
1.27mm (0.05in.) pitch, Header with eject latch, 30 contacts
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
87916-113HLF
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| Description |
BergStik® 2.54mm, Board To Board Connector, Unshrouded Header, Through Hole, Single Row, 13 Positions, 2.54mm Pitch, Vertical, 21.08mm (0.83in) Mating, 3.25mm (0.128in) Tail.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
20021611-00040T8LF
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| Description |
1.27mm (0.05in.) pitch, Header with eject latch, 40 contacts
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
87916-111HLF
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| Description |
BergStik® 2.54mm, Board To Board Connector, Unshrouded Header, Through Hole, Single Row, 11 Positions, 2.54mm Pitch, Vertical, 21.08mm (0.83in) Mating, 3.25mm (0.128in) Tail.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
20021611-00008T1LF
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| Description |
1.27mm (0.05in.) pitch, Header with eject latch, 8 contacts
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
U90H161100A
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| Description |
ExpressPort QSFP+, High Speed Input Output Connectors, QSFP 12.73MM HS 1X1.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
131-3516-11D
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| Description |
Paladin® 112Gb/s Backplane Connector, 3-Pair, 6 Column, Left Polarized, Backplane Module, 1.5mm Wipe, Nickel Sulfamate.
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| Tech specs |
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Official Product Page
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Price and Availability
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