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  87758-2016 Datasheet PDF File

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    02016-BRF-001-A

M/A-COM Technology Solutions, Inc.
Part No. 02016-BRF-001-A
Description 1.25 Gbps Transimpedance Amplifier with AGC

File Size 142.10K  /  2 Page

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Murata Manufacturing Co Ltd

Part No. DFE2016CKA-2R2M=P2
Description Fixed IND 2.2uH 1400mA NONAUTO
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    0877584616 87758-4616

Molex Electronics Ltd.
Part No. 0877584616 87758-4616
Description 2.00mm (.079) Pitch Milli-Grid Header, Through Hole, Vertical, 46 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Pocket Tray Packaging, Lead-free
2.00mm (.079) Pitch Milli-Grid?/a> Header, Through Hole, Vertical, 46 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Pocket Tray Packaging, Lead-free

File Size 170.71K  /  4 Page

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Murata Manufacturing Co Ltd

Part No. DFE2016CKA-1R0M=P2
Description Fixed IND 1uH 1800mA NONAUTO
Tech specs    

Official Product Page

    87758-2650 0877582650

Molex Electronics Ltd.
Part No. 87758-2650 0877582650
Description 2.00mm (.079) Pitch Milli-Grid Header, Through Hole, Vertical, 26 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Tray Packaging, Lead-free

File Size 135.48K  /  4 Page

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Amphenol Communications Solutions

Part No. 10127820-1622LPCLF
Description Minitek® Pwr 4.2, Dual Row, Vertical Through Hole Header, 80u\\ Min Tin plating, Natural Color, 16 Positions, LCP, GW Compatible, With Pegs, Tape and Reel with cap.
Tech specs    

Official Product Page

    87758-3216 0877583216

Molex Electronics Ltd.
Part No. 87758-3216 0877583216
Description 2.00mm (.079) Pitch Milli-Grid?/a> Header, Through Hole, Vertical, 32 Circuits, 0.38μm(15μ) Gold (Au) Selective Plating, Pocket Tray Packaging, Lead-free
2.00mm (.079) Pitch Milli-Grid Header, Through Hole, Vertical, 32 Circuits, 0.38μm(15μ) Gold (Au) Selective Plating, Pocket Tray Packaging, Lead-free

File Size 170.71K  /  4 Page

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Amphenol Communications Solutions

Part No. 68020-162HLF
Description BergStik®, Board to Board connector, Unshrouded Right angled Header, Through Hole, Double Row, 62 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    0877580014 87758-0014

Molex Electronics Ltd.
Part No. 0877580014 87758-0014
Description 2.00mm (.079) Pitch Milli-Grid?/a> Header, Through Hole, Vertical, 14 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Tray Packaging, Lead-free
2.00mm (.079) Pitch Milli-Grid Header, Through Hole, Vertical, 14 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Tray Packaging, Lead-free

File Size 183.80K  /  4 Page

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Amphenol Communications Solutions

Part No. 67292-016LF
Description BergStik® 2.54mm, Board To Board, Vertical 2 Row Guide Pin Header 32 Positions 2.54mm Pitch 3.81um (150u\\.) Tin-Lead Mating plating.
Tech specs    

Official Product Page

    0877583650 87758-3650

Molex Electronics Ltd.
Part No. 0877583650 87758-3650
Description 2.00mm (.079) Pitch Milli-Grid?/a> Header, Through Hole, Vertical, 36 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Tray Packaging, Lead-free
2.00mm (.079) Pitch Milli-Grid Header, Through Hole, Vertical, 36 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Tray Packaging, Lead-free

File Size 135.77K  /  4 Page

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Amphenol Communications Solutions

Part No. 54122-809201650LF
Description BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 20 position, 2.54mm (0.100in) pitch
Tech specs    

Official Product Page

    0877583250 87758-3250

Molex Electronics Ltd.
Part No. 0877583250 87758-3250
Description 2.00mm (.079) Pitch Milli-Grid Header, Through Hole, Vertical, 32 Circuits

File Size 135.77K  /  4 Page

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Amphenol Communications Solutions

Part No. 10127820-1621LPLF
Description Minitek® Pwr 4.2, Dual Row, Vertical Through Hole Header, Gold Flash plating, Natural Color, 16 Positions, LCP, GW Compatible, Tray Packing, With Pegs.
Tech specs    

Official Product Page

    0877584816 87758-4816

Molex Electronics Ltd.
Part No. 0877584816 87758-4816
Description 2.00mm (.079) Pitch Milli-Grid Header, Through Hole, Vertical, 48 Circuits, 0.38μm(15μ) Gold (Au) Selective Plating, Pocket Tray Packaging, Lead-free
2.00mm (.079) Pitch Milli-Grid?/a> Header, Through Hole, Vertical, 48 Circuits, 0.38μm(15μ) Gold (Au) Selective Plating, Pocket Tray Packaging, Lead-free

File Size 170.71K  /  4 Page

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Amphenol Communications Solutions

Part No. 10127720-162LF
Description Minitek® Pwr 3.0, Dual Row, Right Angle Through Hole Header, 16 Positions, Gold Flash plating, Non GW Compatible LCP, With Pegs, Tray Packing.
Tech specs    

Official Product Page

    0877584817 87758-4817

Molex Electronics Ltd.
Part No. 0877584817 87758-4817
Description 2.00mm (.079) Pitch Milli-Grid Header, Through Hole, Vertical, 48 Circuits
2.00mm (.079) Pitch Milli-Grid?/a> Header, Through Hole, Vertical, 48 Circuits

File Size 170.70K  /  4 Page

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Amphenol Communications Solutions

Part No. 10127820-1622PLF
Description Minitek® Pwr 4.2, Dual Row, Vertical Through Hole Header, 80u\\ Min Tin plating, Natural Color, 16 Positions, Non GW Compatible Nylon66, Tray Packing, With Pegs.
Tech specs    

Official Product Page

    0877584850 87758-4850

Molex Electronics Ltd.
Part No. 0877584850 87758-4850
Description 2.00mm (.079) Pitch Milli-Grid Header, Through Hole, Vertical, 48 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Tray Packaging, Lead-free

File Size 135.77K  /  4 Page

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Amphenol Communications Solutions

Part No. 67292-016
Description BergStik® 2.54mm, Board To Board, Vertical 2 Row Guide Pin Header 32 Positions 2.54mm Pitch 3.81um (150u\\.) Tin-Lead Mating plating.
Tech specs    

Official Product Page

For 87758-2016 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | <6> | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

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