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  5687-4CC Datasheet PDF File

For 5687-4CC Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | <6> | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

    IRG4CC40UB

International Rectifier
Part No. IRG4CC40UB
Description IRG4CC30UB IGBT Die in Wafer Form

File Size 34.15K  /  1 Page

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Amphenol Communications Solutions

Part No. 95687-144HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 44 Positions, 2.54 mm Pitch, Vertical, 9.14 mm (0.36in) Mating, 9.14 mm (0.36in) Tail.
Tech specs    

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HUA FENG CIRCUIT





    IRG4CC30SB

International Rectifier
Part No. IRG4CC30SB
Description IRG4CC30SB IGBT Die in Wafer Form

File Size 34.55K  /  1 Page

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Amphenol Communications Solutions

Part No. 95687-436HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 36 Positions, 2.54 mm Pitch, Vertical, 9.14 mm (0.36in) Mating, 9.14 mm (0.36in) Tail.
Tech specs    

Official Product Page

    IRG4CC58KB

International Rectifier
Part No. IRG4CC58KB
Description IRG4CC58KB IGBT Die in Wafer Form

File Size 40.45K  /  1 Page

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Amphenol Communications Solutions

Part No. 95687-114HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 14 Positions, 2.54 mm Pitch, Vertical, 9.14 mm (0.36in) Mating, 9.14 mm (0.36in) Tail.
Tech specs    

Official Product Page

    IRG4CC30UB

International Rectifier
Part No. IRG4CC30UB
Description IRG4CC30UB IGBT Die in Wafer Form

File Size 34.35K  /  1 Page

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Amphenol Communications Solutions

Part No. 95687-136HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 36 Positions, 2.54 mm Pitch, Vertical, 9.14 mm (0.36in) Mating, 9.14 mm (0.36in) Tail.
Tech specs    

Official Product Page

    IRG4CC60UB

International Rectifier
Part No. IRG4CC60UB
Description IRG4CC60UB IGBT Die in Wafer Form

File Size 27.20K  /  1 Page

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Amphenol Communications Solutions

Part No. 95687-158HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 58 Positions, 2.54 mm Pitch, Vertical, 9.14 mm (0.36in) Mating, 9.14 mm (0.36in) Tail.
Tech specs    

Official Product Page

    IRG4CC40KB

International Rectifier
Part No. IRG4CC40KB
Description IRG4CC40KB IGBT Die in Wafer Form

File Size 34.29K  /  1 Page

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Amphenol Communications Solutions

Part No. 95687-122HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 22 Positions, 2.54 mm Pitch, Vertical, 9.14 mm (0.36in) Mating, 9.14 mm (0.36in) Tail.
Tech specs    

Official Product Page

    IRG4CC50WB

Hittite Microwave Corporation
International Rectifier
Part No. IRG4CC50WB
Description IGBT Die in Wafer Form 600 V Size 5 WARP Speed
IRG4CC50WB IGBT Die in Wafer Form

File Size 23.15K  /  1 Page

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Amphenol Communications Solutions

Part No. 95687-168HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 68 Positions, 2.54 mm Pitch, Vertical, 9.14 mm (0.36in) Mating, 9.14 mm (0.36in) Tail.
Tech specs    

Official Product Page

    IRG4CC40RB

International Rectifier
Part No. IRG4CC40RB
Description IRG4CC40RB IGBT Die in Wafer Form

File Size 26.02K  /  1 Page

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Amphenol Communications Solutions

Part No. 95687-102HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 2 Positions, 2.54 mm Pitch, Vertical, 9.14 mm (0.36in) Mating, 9.14 mm (0.36in) Tail.
Tech specs    

Official Product Page

    IRG4CC40SB

International Rectifier
Part No. IRG4CC40SB
Description IRG4CC40SB IGBT Die in Wafer Form

File Size 38.59K  /  1 Page

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Amphenol Communications Solutions

Part No. 95687-402HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 2 Positions, 2.54 mm Pitch, Vertical, 9.14 mm (0.36in) Mating, 9.14 mm (0.36in) Tail.
Tech specs    

Official Product Page

    IRG4CC40FB

International Rectifier
Part No. IRG4CC40FB
Description IRG4CC40FB IGBT Die in Wafer Form

File Size 34.37K  /  1 Page

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Amphenol Communications Solutions

Part No. 95687-448HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 48 Positions, 2.54 mm Pitch, Vertical, 9.14 mm (0.36in) Mating, 9.14 mm (0.36in) Tail.
Tech specs    

Official Product Page

For 5687-4CC Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | <6> | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

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