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  5133 Datasheet PDF File

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    51336-1210 0513361210

Molex Electronics Ltd.
Part No. 51336-1210 0513361210
Description 1.25mm (.049) Pitch Mini Mi II System Wire-to-Board IDT Housing, Single Row, 12Circuits
1.25mm (.049) Pitch Mini Mi II?/a> System Wire-to-Board IDT Housing, Single Row, 12Circuits
1.25mm (.049") Pitch Mini Mi II垄芒 System Wire-to-Board IDT Housing, Single Row, 12Circuits

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Amphenol Communications Solutions

Part No. 87185-133HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 33 Positions, 2.54 mm Pitch, Vertical, 26.49 mm (1.043in) Mating, 2.41 mm (0.095in) Tail.
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    51336-1110 0513361110

Molex Electronics Ltd.
Part No. 51336-1110 0513361110
Description 1.25mm (.049) Pitch Mini Mi II System Wire-to-Board IDT Housing, Single Row, 11Circuits
1.25mm (.049) Pitch Mini Mi II?/a> System Wire-to-Board IDT Housing, Single Row, 11Circuits
1.25mm (.049") Pitch Mini Mi II垄芒 System Wire-to-Board IDT Housing, Single Row, 11Circuits

File Size 99.07K  /  2 Page

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Amphenol Communications Solutions

Part No. 98426-G04-05-133LF
Description Minitek® 2.00mm, Board to Board, Shrouded Vertical Stacking Header, Through Hole, Double Row, 10 Positions, 2.00mm (0.079in) Pitch.
Tech specs    

Official Product Page

    51336-1010 0513361010

Molex Electronics Ltd.
Part No. 51336-1010 0513361010
Description 1.25mm (.049) Pitch Mini Mi II?/a> System Wire-to-Board IDT Housing, Single Row, 10 Circuits
1.25mm (.049") Pitch Mini Mi II垄芒 System Wire-to-Board IDT Housing, Single Row, 10 Circuits

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Amphenol Communications Solutions

Part No. 98426-S04-05-133LF
Description Minitek® 2.00mm, Board to Board, Shrouded Vertical Stacking Header, Through Hole, Double Row, 10 Positions, 2.00mm (0.079in) Pitch.
Tech specs    

Official Product Page

    51336-0910 0513360910

Molex Electronics Ltd.
Part No. 51336-0910 0513360910
Description 1.25mm (.049) Pitch Mini Mi II System Wire-to-Board IDT Housing, Single Row, 9Circuits
1.25mm (.049) Pitch Mini Mi II?/a> System Wire-to-Board IDT Housing, Single Row, 9Circuits
1.25mm (.049") Pitch Mini Mi II垄芒 System Wire-to-Board IDT Housing, Single Row, 9Circuits

File Size 99.07K  /  2 Page

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Amphenol Communications Solutions

Part No. 68655-133HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 33 Positions, 2.54 mm Pitch, Vertical, 8.08 mm (0.318in) Mating, 7.37 mm (0.29in) Tail.
Tech specs    

Official Product Page

    51336-0810 0513360810

Molex Electronics Ltd.
Part No. 51336-0810 0513360810
Description 1.25mm (.049) Pitch Mini Mi II System Wire-to-Board IDT Housing, Single Row, 8Circuits
1.25mm (.049") Pitch Mini Mi II垄芒 System Wire-to-Board IDT Housing, Single Row, 8Circuits

File Size 99.03K  /  2 Page

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Amphenol Communications Solutions

Part No. 51915-133LF
Description PwrBlade®, Power Connectors, 7P 8S 1ACP 2P Right Angle Receptacle, Solder To Board
Tech specs    

Official Product Page

    51336-0710 0513360710

Molex Electronics Ltd.
Part No. 51336-0710 0513360710
Description 1.25mm (.049) Pitch Mini Mi II System Wire-to-Board IDT Housing, Single Row, 7Circuits
1.25mm (.049") Pitch Mini Mi II垄芒 System Wire-to-Board IDT Housing, Single Row, 7Circuits

File Size 99.07K  /  2 Page

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Amphenol Communications Solutions

Part No. 68705-133HLF
Description BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Single Row, 33 Positions, 2.54 mm (0.100in) Pitch.
Tech specs    

Official Product Page

    0050375133 50-37-5133

Molex Electronics Ltd.
Part No. 0050375133 50-37-5133
Description 2.50mm (.098) Pitch SPOX Wire-to-Board Crimp Housing, Friction Lock, 13 Circuits

File Size 127.65K  /  3 Page

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Amphenol Communications Solutions

Part No. 98426-S04-25-133LF
Description Minitek® 2.00mm, Board to Board, Shrouded Vertical Stacking Header, Through Hole, Double Row, 50 Positions, 2.00mm (0.079in) Pitch.
Tech specs    

Official Product Page

    51336-0410 0513360410

Molex Electronics Ltd.
Part No. 51336-0410 0513360410
Description 1.25mm (.049) Pitch Mini Mi II System Wire-to-Board IDT Housing, Single Row, 4Circuits
1.25mm (.049) Pitch Mini Mi II?/a> System Wire-to-Board IDT Housing, Single Row, 4Circuits
1.25mm (.049") Pitch Mini Mi II垄芒 System Wire-to-Board IDT Housing, Single Row, 4Circuits

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Amphenol Communications Solutions

Part No. 77315-133-36LF
Description BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 36 Positions 2.54mm (0.100in) Pitch, Right Angle
Tech specs    

Official Product Page

    51336-0210 0513360210

http://
Molex Electronics Ltd.
Part No. 51336-0210 0513360210
Description 1.25mm (.049) Pitch Mini Mi II?/a> System Wire-to-Board IDT Housing, Single Row, 2(.049) Pitch Mini Mi II?/a> System Wire-to-Board IDT Housing, Single Row, 2
1.25mm (.049") Pitch Mini Mi II垄芒 System Wire-to-Board IDT Housing, Single Row, 2(.049") Pitch Mini Mi II垄芒 System Wire-to-Board IDT Housing, Single Row, 2

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Amphenol Communications Solutions

Part No. 93235-133LF
Description Metral® Board Connectors, Backplane Connectors, 4 Row Signal Receptacle, Straight, Solder-to-Board, LF.
Tech specs    

Official Product Page

    0513360310 51336-0310

Molex Electronics Ltd.
Part No. 0513360310 51336-0310
Description 1.25mm (.049) Pitch Mini Mi II?/a> System Wire-to-Board IDT Housing, Single Row, 3Circuits
1.25mm (.049") Pitch Mini Mi II垄芒 System Wire-to-Board IDT Housing, Single Row, 3Circuits
MOLEX Connector

File Size 99.02K  /  2 Page

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Amphenol Communications Solutions

Part No. 68015-133HLF
Description BergStik®, Board to Board connector, Unshrouded Right Angled Header, Through Hole, Single Row, 33 Positions, 2.54 mm (0.100in) Pitch.
Tech specs    

Official Product Page

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