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Amphenol Communications Solutions |
| Part No. |
75844-182-08LF
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| Description |
BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Double Row, 8 Positions, 2.54mm (0.100in) Pitch.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
131-4418-21H
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| Description |
Paladin® 112Gb/s Backplane Connector, 4-Pair, 8 Column, Right End Wall, Backplane Module, 2.25mm Wipe, APP.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
10122864-418002LF
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| Description |
BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 36 Positions, 2.54 mm (0.100in) Pitch.
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| Tech specs |
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Official Product Page
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Ericsson Power Modules
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| Part No. |
PKJ4418LEPI
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| Description |
1-OUTPUT 46 W DC-DC REG PWR SUPPLY MODULE 2.300 X 2.400 INCH, 0.330 INCH HEIGHT, LOW PROFILE, HALF BRICK PACKAGE-9/8
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| File Size |
74.13K /
2 Page |
 View
it Online |
Download Datasheet
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Amphenol Communications Solutions |
| Part No. |
76384-418LF
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| Description |
Dubox®2.54mm, Board to Board Connector, Shrouded Header, Single Row, Straight.
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
131-4418-11H
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| Description |
Paladin® 112Gb/s Backplane Connector, 4-Pair, 8 Column, Right End Wall, Backplane Module, 1.5mm Wipe, APP.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
68464-418HLF
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| Description |
BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 18 Positions, 2.54 mm (0.100in) Pitch.
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| Tech specs |
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Official Product Page
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GTM, Corp.
Integrated Silicon Solution, Inc.
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| Part No. |
IS23SC4418 IS23SC4428
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| Description |
1024 x 8 Bits of EEPROM With Programmable Write Protection For Each Byte.(1024 x 8位，每个字节带可编程写保护的EEPROM) 1024 × 8位的EEPROM，具有可编程写保护每个字节。（1024 × 8位，每个字节带可编程写保护的EEPROM中）
1024 x 8 Bits of EEPROM With Programmable Write Protection For Each Byte And Two Bytes of Programmable Security Code(1024 x 8位，每个字节带可编程写保护，2字节可编程安全密码的EEPROM) 1024 × 8位的EEPROM，具有可编程写保护对于每一个字节，两个字节可编程保障法024 × 8位，每个字节带可编程写保护，2字节可编程安全密码的EEPROM中）
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| File Size |
81.17K /
12 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
68764-418HLF
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| Description |
BergStik® 2.54mm, Board To Board Connector, Unshrouded Right Angled Header, Through Hole, Single Row, 18 Positions, 2.54mm (0.100in) Pitch.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
131-4418-21D
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| Description |
Paladin® 112Gb/s Backplane Connector, 4-Pair, 8 Column, Right End Wall, Backplane Module, 2.25mm Wipe, Nickel Sulfamate.
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| Tech specs |
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Official Product Page
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GSI Technology, Inc.
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| Part No. |
GS864436E-166V GS864418E-150 GS864418E-225 GS864436E-225I
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| Description |
4M x 18, 2M x 36 72Mb S/DCD Sync Burst SRAMs 2M X 36 CACHE SRAM, 7 ns, PBGA165
4M x 18, 2M x 36 72Mb S/DCD Sync Burst SRAMs 4M X 18 CACHE SRAM, 7.5 ns, PBGA165
4M x 18, 2M x 36 72Mb S/DCD Sync Burst SRAMs 4M X 18 CACHE SRAM, 6.5 ns, PBGA165
4M x 18, 2M x 36 72Mb S/DCD Sync Burst SRAMs 2M X 36 CACHE SRAM, 6.5 ns, PBGA165
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| File Size |
805.64K /
32 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
93944-418HLF
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| Description |
BergStik® 2.54mm, Board To Board Connector, Unshrouded Vertical Header, Through Hole, Single Row, 18 Positions, 2.54mm (0.100in) Pitch.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
68604-418HLF
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| Description |
BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Single Row, 18 Positions, 2.54 mm (0.100in) Pitch.
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| Tech specs |
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Official Product Page
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Bom2Buy.com
Price and Availability
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JITONG
TECHNOLOGY
(CHINA HK & SZ)
Datasheet.hk's Sponsor |
| Part: 4410 |
| Maker: SI |
| Pack: SOP-8 |
| Stock: 156 |
| Unit price
for : |
|
50: $0.70 |
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100: $0.66 |
| 1000:
$0.63 |
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Email: oulindz@gmail.com |
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