Part Number Hot Search : 
TS931I MZ85C13 MP118A SP16150C 00BZI MIC2208 0LD104 MA300RUI
Product Description
Full Text Search
  4410.9014 Datasheet PDF File

For 4410.9014 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | <6> | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

    90147-1211

Molex Electronics Ltd.
Part No. 90147-1211
Description 2.54mm (.100) Pitch C-Grid? PC Board Connector, Single Row, Vertical, 11 Circuits

File Size 169.31K  /  4 Page

View it Online

Download Datasheet

   

Toshiba Electronic Devices & Storage Corporation

Part No. XPN19014MC
Description P-ch MOSFET, -40 V, -20 A, 0.0187 Ω@-10 V, TSON Advance(WF), AEC-Q101
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    90147-1212

Molex Electronics Ltd.
Part No. 90147-1212
Description 2.54mm (.100) Pitch C-Grid? PC Board Connector, Single Row, Vertical, 12 Circuits

File Size 169.53K  /  4 Page

View it Online

Download Datasheet

   

Amphenol Communications Solutions

Part No. 51939-014LF
Description PwrBlade®, Power Connectors, 3P 24S 4P Right Angle Header, Solder To Board
Tech specs    

Official Product Page

    90147-1205

Molex Electronics Ltd.
Part No. 90147-1205
Description 2.54mm (.100) Pitch C-Grid? PC Board Connector, Single Row, Vertical, 5 Circuits

File Size 169.43K  /  4 Page

View it Online

Download Datasheet

   

Amphenol Communications Solutions

Part No. 68690-140HLF
Description BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 40 Positions, 2.54 mm (0.100in)Pitch.
Tech specs    

Official Product Page

    90143-0020

Molex Electronics Ltd.
Part No. 90143-0020
Description 2.54mm (.100) Pitch C-Grid III Modular Crimp Housing, Dual Row, 20 Circuits

File Size 250.10K  /  2 Page

View it Online

Download Datasheet

   

Amphenol Communications Solutions

Part No. 87901-412HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 12 Positions, 2.54 mm Pitch, Vertical, 20.83 mm (0.82in) Mating, 3.05 mm (0.12in) Tail.
Tech specs    

Official Product Page

    90143-0022

Molex Electronics Ltd.
Part No. 90143-0022
Description 2.54mm (.100) Pitch C-Grid III Modular Crimp Housing, Dual Row, 22 Circuits

File Size 250.36K  /  2 Page

View it Online

Download Datasheet

   

Amphenol Communications Solutions

Part No. 87901-434HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 34 Positions, 2.54 mm Pitch, Vertical, 20.83 mm (0.82in) Mating, 3.05 mm (0.12in) Tail.
Tech specs    

Official Product Page

    90143-0024

Molex Electronics Ltd.
Part No. 90143-0024
Description 2.54mm (.100) Pitch C-Grid III Modular Crimp Housing, Dual Row, 24 Circuits

File Size 250.36K  /  2 Page

View it Online

Download Datasheet

   

Amphenol Communications Solutions

Part No. 87901-456HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 56 Positions, 2.54 mm Pitch, Vertical, 20.83 mm (0.82in) Mating, 3.05 mm (0.12in) Tail.
Tech specs    

Official Product Page

    90143-0026

Molex Electronics Ltd.
Part No. 90143-0026
Description 2.54mm (.100) Pitch C-Grid III Modular Crimp Housing, Dual Row, 26 Circuits

File Size 250.36K  /  2 Page

View it Online

Download Datasheet

   

Amphenol Communications Solutions

Part No. 10136290-141PLF
Description Minitek<sup>reg;</sup> Pwr 4.2 High Current Connector, Wire to Board connector, Plug Terminal, Right Angle , 4.20mm (0.165in) Pitch.
Tech specs    

Official Product Page

    90143-0028

Molex Electronics Ltd.
Part No. 90143-0028
Description 2.54mm (.100) Pitch C-Grid III Modular Crimp Housing, Dual Row, 28 Circuits

File Size 250.36K  /  2 Page

View it Online

Download Datasheet

   

Amphenol Communications Solutions

Part No. 67289-014
Description BergStik® 2.54mm, Board To Board, Vertical 2 Row Guide Pin Header 28 Positions 2.54mm Pitch 0.76um (30u\\.) Gold Mating plating.
Tech specs    

Official Product Page

    90143-0036

Molex Electronics Ltd.
Part No. 90143-0036
Description 2.54mm (.100) Pitch C-Grid III Modular Crimp Housing, Dual Row, 36 Circuits

File Size 250.24K  /  2 Page

View it Online

Download Datasheet

   

Amphenol Communications Solutions

Part No. 68690-148HLF
Description BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 48 Positions, 2.54 mm (0.100in)Pitch.
Tech specs    

Official Product Page

    90143-0050

Molex Electronics Ltd.
Part No. 90143-0050
Description 2.54mm (.100) Pitch C-Grid III Modular Crimp Housing, Dual Row, 50 Circuits

File Size 250.24K  /  2 Page

View it Online

Download Datasheet

   

Amphenol Communications Solutions

Part No. 87901-420HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 20 Positions, 2.54 mm Pitch, Vertical, 20.83 mm (0.82in) Mating, 3.05 mm (0.12in) Tail.
Tech specs    

Official Product Page

For 4410.9014 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | <6> | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

▲Up To Search▲

 



Bom2Buy.com




Price and Availability



 
Price & Availability of 4410.9014

All Rights Reserved © IC-ON-LINE 2003 - 2022  

[Add Bookmark] [Contact Us] [Link exchange] [Privacy policy]
Mirror Sites :  [www.datasheet.hk]   [www.maxim4u.com]  [www.ic-on-line.cn] [www.ic-on-line.com] [www.ic-on-line.net] [www.alldatasheet.com.cn] [www.gdcy.com]  [www.gdcy.net]


 . . . . .
  We use cookies to deliver the best possible web experience and assist with our advertising efforts. By continuing to use this site, you consent to the use of cookies. For more information on cookies, please take a look at our Privacy Policy. X
0.021689176559448