3172 pdf Datasheet P6 Part Num --- IC-ON-LINE


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3172 Datasheet PDF File

For 3172 Found Datasheets File :: 112+ Page :: | 1 | 2 | 3 | 4 | 5 | <6> | 7 | 8 | 9 | 10 | 11 | 12 |


Part No.	VRS51L3172-40-QG
Description	SPECIALTY MEMORY CIRCUIT, PQFP44
File Size	1,397.60K / 115 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	131-7214-11H
Description	Paladin® 112Gb/s Backplane Connector, 7-Pair, 4 Column, Double End Wall, Backplane Module, 1.5mm Wipe, APP.
Tech specs				Official Product Page

HUA FENG CIRCUIT

					Molex Electronics Ltd.
Part No.	0193172008
Description
File Size	361.73K / 5 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	131-7218-21D
Description	Paladin® 112Gb/s Backplane Connector, 7-Pair, 8 Column, Double End Wall, Backplane Module, 2.25mm Wipe, Nickel Sulfamate.
Tech specs				Official Product Page

					Molex Electronics Ltd.
Part No.	0193172012 193172012
Description
File Size	361.73K / 5 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	86503-172H
Description	86503-172H-B/S II
Tech specs				Official Product Page

					Molex Electronics Ltd.
Part No.	0193172014 193172014
Description
File Size	361.72K / 5 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	131-7218-11D
Description	Paladin® 112Gb/s Backplane Connector, 7-Pair, 8 Column, Double End Wall, Backplane Module, 1.5mm Wipe, Nickel Sulfamate.
Tech specs				Official Product Page

					Molex Electronics Ltd.
Part No.	0193172016 193172016
Description
File Size	361.73K / 5 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	77317-201-72LF
Description	BERGSTIK
Tech specs				Official Product Page

					Molex Electronics Ltd.
Part No.	0193172018 193172018
Description
File Size	361.72K / 5 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	131-7216-11D
Description	Paladin® 112Gb/s Backplane Connector, 7-Pair, 6 Column, Double End Wall, Backplane Module, 1.5mm Wipe, Nickel Sulfamate.
Tech specs				Official Product Page

					Molex Electronics Ltd.
Part No.	0193172020 193172020
Description
File Size	361.73K / 5 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	98426-G13-17-237LF
Description	Minitek® 2.00mm, Board to Board, Shrouded Vertical Stacking Header, Through Hole, Double Row, 34 Positions, 2.00mm (0.079in) Pitch.
Tech specs				Official Product Page

					Molex Electronics Ltd.
Part No.	0193172022
Description
File Size	361.73K / 5 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	98426-S13-17-237LF
Description	Minitek® 2.00mm, Board to Board, Shrouded Vertical Stacking Header, Through Hole, Double Row, 34 Positions, 2.00mm (0.079in) Pitch.
Tech specs				Official Product Page

					Molex Electronics Ltd.
Part No.	0193172024 193172024
Description
File Size	361.72K / 5 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	78233-172
Description	BergStik® 2.54mm, Board To Board Connector, Unshrouded Vertical Header, Through Hole, Double Row, 72 Positions, 2.54mm (0.100in)Pitch.
Tech specs				Official Product Page

					Molex Electronics Ltd.
Part No.	0923172001
Description	Picoflex PF-50 IDT-to-IDT Z-Style, 20 Circuits, 1.0m (3.28 ) Length
File Size	122.02K / 2 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	131-7214-11D
Description	Paladin® 112Gb/s Backplane Connector, 7-Pair, 4 Column, Double End Wall, Backplane Module, 1.5mm Wipe, Nickel Sulfamate.
Tech specs				Official Product Page

For 3172 Found Datasheets File :: 112+ Page :: | 1 | 2 | 3 | 4 | 5 | <6> | 7 | 8 | 9 | 10 | 11 | 12 |

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