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  2816-4 Datasheet PDF File

For 2816-4 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | <6> | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

    T4312816A T4312816A-10S T4312816A-6S T4312816A-7.5S T4312816A-7S T4312816A-8S

TMT[Taiwan Memory Technology]
Part No. T4312816A T4312816A-10S T4312816A-6S T4312816A-7.5S T4312816A-7S T4312816A-8S
Description 8M x 16 SDRAM

File Size 706.35K  /  29 Page

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Amphenol Communications Solutions

Part No. 54122-816523000LF
Description BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 52 position, 2.54mm (0.100in) pitch
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    RH128160T-009-F

Okaya Electric America, Inc.
Part No. RH128160T-009-F
Description Screen Size: 1.8隆卤 Diagonal
Screen Size: 1.8 Diagonal

File Size 143.27K  /  2 Page

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Amphenol Communications Solutions

Part No. 54122-128161250LF
Description BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 16 position, 2.54mm (0.100in) pitch
Tech specs    

Official Product Page

    TM Technology, Inc.
Part No. T4312816B-7S T4312816B-7SG
Description 8M x 16 SDRAM 2M x 16bit x 4Banks Synchronous DRAM

File Size 692.50K  /  70 Page

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Amphenol Communications Solutions

Part No. 77315-428-16LF
Description BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 16 Positions 2.54mm (0.100in) Pitch, Right Angle
Tech specs    

Official Product Page

    T4312816B T4312816B-6SG T4312816B-7S T4312816B-7SG

Taiwan Memory Technology
Part No. T4312816B T4312816B-6SG T4312816B-7S T4312816B-7SG
Description 8M x 16 SDRAM 2M x 16bit x 4Banks Synchronous DRAM

File Size 683.40K  /  70 Page

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Amphenol Communications Solutions

Part No. 68682-816
Description Dubox® 2.54mm, Board to Board Connector, PCB Mounted Receptacle, Vertical, Through Hole, Dual Entry, Double Row, 32 Position ,2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    0428160412

Molex Electronics Ltd.
Part No. 0428160412
Description RECEPT. HOUSING SINGLE ROW MINIFIT SR.

File Size 197.04K  /  1 Page

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Amphenol Communications Solutions

Part No. 59202-S28-16-050LF
Description Minitek® 2.00mm, Board To Board, Unshrouded Vertical Header, Surface Mount, Double Row, 32 Positions.
Tech specs    

Official Product Page

    44428-1605 0444281605

Molex Electronics Ltd.
Part No. 44428-1605 0444281605
Description 3.00mm (.118) Pitch Micro-Fit 3.0 BMI?/a> Header, Surface Mount Compatible, DualRow, Right Angle, without Snap-in Plastic Peg PCB Lock, 16 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating
3.00mm (.118) Pitch Micro-Fit 3.0 BMI Header, Surface Mount Compatible, DualRow, Right Angle, without Snap-in Plastic Peg PCB Lock, 16 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating

File Size 232.70K  /  4 Page

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Amphenol Communications Solutions

Part No. 54112-816202500LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 20 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    87760-2816 0877602816

Molex Electronics Ltd.
Part No. 87760-2816 0877602816
Description 2.00mm (.079) Pitch Milli-Grid Header, Right Angle, Through Hole, 28 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Tray, Lead-free
2.00mm (.079) Pitch Milli-Grid?/a> Header, Right Angle, Through Hole, 28 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Tray, Lead-free

File Size 160.34K  /  4 Page

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Amphenol Communications Solutions

Part No. 54122-816202500LF
Description BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 20 position, 2.54mm (0.100in) pitch
Tech specs    

Official Product Page

    K4S281632K

Samsung semiconductor
Part No. K4S281632K
Description 128Mb K-die SDRAM Specification

File Size 271.10K  /  15 Page

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Amphenol Communications Solutions

Part No. 54242-816062600LF
Description BergStik® 2.54mm, Board To Board Connector, Unshrouded Stacking vertical header, Surface Mount, Double Row, 6 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    Samsung
Part No. K4S281632K
Description 128Mb K-die SDRAM

File Size 251.68K  /  14 Page

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Amphenol Communications Solutions

Part No. 54112-816122500LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 12 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    0511281601 51128-1601

Molex Electronics Ltd.
Part No. 0511281601 51128-1601
Description 2.50mm (.098") / 3.00mm (.118") Pitch Wire-to-Board Receptacle Housing with Fuse16 Circuits
2.50mm (.098) / 3.00mm (.118) Pitch Wire-to-Board Receptacle Housing with Fuse16 Circuits

File Size 89.45K  /  2 Page

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Amphenol Communications Solutions

Part No. 59112-G28-16-050LF
Description Minitek® 2.00mm, Board To Board, Unshrouded Vertical Stacking Header, Through Hole, Double Row, 32 Positions.
Tech specs    

Official Product Page

For 2816-4 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | <6> | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

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