warp pdf Datasheet P5 Full Text Search --- IC-ON-LINE


	Part Number	Hot Search : 2SD2494 DDZX1XTS 71900 TT150N 6MBP40 BP206 LTC35 4THDXXXM
	Product Description
	Full Text Search

warp Datasheet PDF File

For warp Found Datasheets File :: 2253 Search Time::2.562ms
Page :: | 1 | 2 | 3 | 4 | <5> | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |

				Hitachi Semiconductor
Part No.	PF0121
OCR Text	...or screw up the heatsink flange warp size of the heatsink flange: S Conditions M3 Screw Bolts Spec 4 to 6 kgcm S=0 +0.3/-0 mm S 16.5 4 2.88 5 PF0121 Note for Use Unevenness and distortion at the surface of the heatsink a...
Description	MOS FET Power Amplifier Module for GSM Mobile Phone
File Size	50.73K / 12 Page	View it Online	Download Datasheet

				CYPRESS[Cypress Semiconductor] Cypress Semiconductor Corp.
Part No.	CY7C344-25 CY7C344-15HC_HI CY7C344-15JC_JI CY7C344-15PC_PI CY7C344-25PC_PI CY7C344-20WMB CY7C344-25WMB CY7C344-20JC_JI CY7C344-20HC_HI CY7C344-20HMB CY7C344-20PC_PI CY7C344-20WC_WI CY7C344-25JC_JI CY7C344-15WC_WI CY7C344-25HC_HI CY7C344-25HMB CY7C344-25WC_WI CY7C344B CY7C344-25WC/WI CY7C344-20WC/WI CY7C344-15PC/PI CY7C344-15WC/WI CY7C344-20HC/HI CY7C344-20JC/JI CY7C344-15HC/HI CY7C344-25HC/HI CY7C344-15JC/JI CY7C344-25PC/PI CY7C344-20PC/PI CY7C344-25JC/JI CY7C344-20WC CY7C344-20JI CY7C344-25PI CY7C344-15JC CY7C344-20JC CY7C344-25PC
OCR Text	... may be easily determined using warp(R), warp ProfessionalTM, or warp EnterpriseTM software. The CY7C344 has fixed internal delays, allowing the user to determine the worst case timing delays for any design. CY7C344B When expander log...
Description	32-Macrocell MAX® EPLD JT 13C 13#22D PIN PLUG 32-Macrocell MAX EPLD 32宏单元最大可编程逻辑器件
File Size	238.68K / 16 Page	View it Online	Download Datasheet

				Hittite Microwave Corporation
Part No.	HMC444LP4
OCR Text	...L BE 0.05mm MAXIMUM. 7. PACKAGE warp SHALL NOT EXCEED 0.05mm. 8. ALL GROUND LEADS AND GROUND PADDLE MUST BE SOLDERED TO PCB RF GROUND. 9. REFER TO HITTITE APPLICATION NOTE FOR SUGGESTED PCB LAND PATTERN. For price, delivery, and to place...
Description	SMT GaAs HBT MMIC x8 ACTIVE FREQUENCY MULTIPLIER, 9.9 - 11.2 GHz OUTPUT
File Size	241.59K / 6 Page	View it Online	Download Datasheet

				美国讯泰微波有限公司上海代表 Hittite Microwave Corporation
Part No.	HMC525LC4
OCR Text	...CE IS NON-CUMULATIVE 5. PACKAGE warp SHALL NOT EXCEED 0.05mm DATUM 6. ALL GROUND LEADS AND GROUND PADDLE MUST BE SOLDERED TO PCB RF GROUND 103 C/W -65 to +150 C -55 to +85 deg C Outline Drawing For price, delivery, and to place ord...
Description	GaAs MMIC I/Q MIXER 4 - 8.5 GHz
File Size	266.09K / 6 Page	View it Online	Download Datasheet

				SHARP[Sharp Electrionic Components]
Part No.	LZ2336
OCR Text	...lon by device swIflcation sh=b, warp Wes no reswsib(llv b any defeck hat cccur In quipmsnt us!ng any of SHARP's &vIces, zhom In catalcgs, I dats bwks, etc hnhct warp (n waler to obb[n ti latest @mIon of tie dev(ce swdlcabon shwh bsti us!ng ...
Description	Two-power supply ( 5 V and 12 V) operation 1 / 3 type B/W CCD Area Sensor for EIA
File Size	175.27K / 8 Page	View it Online	Download Datasheet

				Cypress Semiconductor Corp. CYPRESS[Cypress Semiconductor]
Part No.	CY3620 CY3620R62
OCR Text	...ISRTM) CPLDs * Industry-leading warp(R) design software for VHDL and Verilog * Easy-to-use ISR PC programmer for on-board programming * C3ISR programming cable that supports all Programmable Serial InterfaceTM (PSITM), Delta39KTM, and Ultra...
Description	Kit, Screwdriver Ratchet CPLD的设计套 warpISR™ Design Kit for CPLDs
File Size	30.86K / 3 Page	View it Online	Download Datasheet

				Hittite Microwave Corporation
Part No.	HMC500LP3 HMC500LP3E
OCR Text	...L BE 0.05mm MAXIMUM. 5. PACKAGE warp SHALL NOT EXCEED 0.05mm. 6. ALL GROUND LEADS AND GROUND PADDLE MUST BE SOLDERED TO PCB RF GROUND. 7. REFER TO HITTITE APPLICATION NOTE FOR SUGGESTED PCB LAND PATTERN. Package Information Part Number ...
Description	GaAs HBT VECTOR MODULATOR 1.8 - 2.2 GHz
File Size	357.35K / 8 Page	View it Online	Download Datasheet

				Electronic Theatre Controls, Inc. ETC[ETC]
Part No.	PT15-21C
OCR Text	...ng. 3.4 After soldering, do not warp the circuit board. Everlight Electronics Co., Ltd. Device NoDPT-015-112 http:\\www.everlight.com Prepared date07-19-2004 Rev 1.2 Page: 6 of 9 Prepared byJaine Tsai PT15-21C 4.Soldering...
Description	1206 package phototransistor
File Size	183.87K / 9 Page	View it Online	Download Datasheet

				Analog Devices
Part No.	AD7661
OCR Text	...* FEATURES Throughput: 1 MSPS (warp Mode) 800 kSPS (Normal Mode) INL: 2.5 LSB Max (0.0038% of Full Scale) 16 Bits Resolution with No Missing Codes Analog Input Voltage Range: 0 V to 2.5 V No Pipeline Delay Parallel and Serial 5 V/3 V Inter...
Description	16-Bit 1 MSPS SAR Unipolar ADC with Ref
File Size	222.59K / 23 Page	View it Online	Download Datasheet

				Murata Manufacturing Co., Ltd.
Part No.	CDALA10M7GA019 CDACV10M7GA001-R0
OCR Text	...imize the stress imposed on the warp or flexure of the board. 4. After installing chips, if solder is excessively applied to the circuit board, mechanical stress will cause destruction resistance characteristics to lower. To prevent this, b...
Description	Ceramic Filters (CERAFIL) for FM Receivers
File Size	921.25K / 57 Page	View it Online	Download Datasheet

For warp Found Datasheets File :: 2253 Search Time::2.562ms
Page :: | 1 | 2 | 3 | 4 | <5> | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |